公开(公告)号：DE102016123746A1

公开(公告)日：2017-06-14

申请号：DE102016123746

申请日：2016-12-08

Applicant: NICHIA CORP

Inventor： KISHIMOTO TOMOHISA ,  FUKUDA MAYUMI

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/52

Abstract: Ein Verfahren zur Herstellung einer Baugruppe enthält die folgenden Schritte: Vorbereiten eines Leiterrahmens, der einen Rahmen, eine erste Elektrode, eine zweite Elektrode, einen ersten Verbindungsabschnitt, der den Rahmen und die erste Elektrode verbindet, und einen zweiten Verbindungsabschnitt, der den Rahmen und die zweite Elektrode verbindet, aufweist; Anordnen des Leiterrahmens in einer Form; Einspritzen eines ersten Harzes in die Form aus einem Einlass der Form, der sich angrenzend an die erste Elektrode befindet, zum Formen eines Flanschabschnitts und eines Wandabschnitts der Baugruppe; und Schneiden des Leiterrahmens und eines Teils des Flanschabschnitts, der sich angrenzend an die erste Elektrode befindet. In dem Schritt des Einspritzens des ersten Harzes stellen die Form und der Leiterrahmen zusammen einen Hohlraum bereit, in den das erste Harz eingespritzt wird und in dem ein Teil des Flanschabschnitts so ausgebildet wird, dass er eine andere Dicke als der Leiterrahmen aufweist.

公开(公告)号：EP1837386A4

公开(公告)日：2010-09-22

申请号：EP05844881

申请日：2005-12-28

Applicant: NICHIA CORP

Inventor： KAMESHIMA MASATOSHI ,  HOSOKAWA SHOJI ,  TAKASHIMA SUGURU ,  TAMAKI HIROTO ,  SHINOHARA TAKAYUKI ,  NAITOU TAKAHIRO ,  KISHIMOTO TOMOHISA

IPC: C09K11/64 ,  H01L33/06 ,  C09K11/08 ,  H01L33/00 ,  H01L33/32 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62

CPC classification number: C09K11/0883 ,  C09K11/7734 ,  H01L33/502 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/3025 ,  H05B33/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP1914811A4

公开(公告)日：2011-01-05

申请号：EP06781880

申请日：2006-07-28

Applicant: NICHIA CORP

Inventor： KURAMOTO MASAFUMI ,  MIKI TOMOHIDE ,  TSUKIOKA TOMOYA ,  KISHIMOTO TOMOHISA

IPC: H01L33/00 ,  C08G59/42 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

CPC classification number: H01L33/36 ,  C08G59/3245 ,  C08K3/0033 ,  C08K3/013 ,  C08K5/005 ,  H01L33/32 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

公开(公告)号：EP1895599A4

公开(公告)日：2014-03-19

申请号：EP06766760

申请日：2006-06-15

Applicant: NICHIA CORP

Inventor： TAKASHIMA SUGURU ,  AIHARA MASATO ,  TAKEICHI JUNJI ,  NAITOU TAKAHIRO ,  TAMAKI HIROTO ,  KISHIMOTO TOMOHISA

IPC: H01L33/50 ,  C09K11/77

CPC classification number: C09K11/7774 ,  C09K11/662 ,  C09K11/7771 ,  C09K11/7785 ,  H01L33/50 ,  H01L33/504 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A light emitting device includes a wavelength converting member for absorbing light emitted by an exciting light source and emitting light of a different wavelength. With a wavelength at which the light from the exciting light source has a maximum energy intensity denoted as a first wavelength, a wavelength at which the light from the wavelength converting member has a maximum energy intensity denoted as a second wavelength, a wavelength lying between the first and second wavelengths at which the light from the light emitting device has a minimum energy intensity denoted as a third wavelength, and 650 nm denoted as a fourth wavelength, then the light emitting device has an emission spectrum such that the proportion of the energy intensity at the first wavelength to the energy intensity at the third wavelength is in a range from 100:15 to 100: 150, and the proportion of the energy intensity at the first wavelength to the energy intensity at the fourth wavelength is in a range from 100:45 to 100:200.

公开(公告)号：JP2008263235A

公开(公告)日：2008-10-30

申请号：JP2008188491

申请日：2008-07-22

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： KURAMOTO MASAFUMI ,  TSUKIOKA TOMOYA ,  HAYASHI MASAKI ,  MIKI MICHIHIDE ,  TAMAOKI HIROTO ,  KISHIMOTO TOMOHISA

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a surface-mounting light emitting device excellent in light resistance and mass productivity.
SOLUTION: The surface-mounting light emitting device comprises a light emitting element 10, a circuit board 20 on which the light emitting element 10 is mounted, a wall part 50 which is made in the circuit board 20 and reflects light from the light emitting element 10, and a transparent sealing member 70 which covers the light emitting element 10. The wall part 50 is made of thermo-setting resin, closely in contact with the circuit board 20 and formed by a transfer mold.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 解决的问题：提供耐光性和批量生产率优异的表面贴装发光装置。 表面安装发光器件包括发光元件10，安装有发光元件10的电路板20，形成在电路板20中的壁部50， 发光元件10和覆盖发光元件10的透明密封构件70.壁部50由热固性树脂制成，与电路板20紧密接触并由转印模形成。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2010278474A

公开(公告)日：2010-12-09

申请号：JP2010195755

申请日：2010-09-01

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： OGAWA SATORU ,  KISHIMOTO TOMOHISA

IPC: H01L33/56 ,  C03C8/04 ,  C03C8/08 ,  C03C8/10 ,  C03C8/14 ,  C03C8/20

CPC classification number: H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To form a glass sealing portion which conforms to a complex three-dimensional shape of a substrate to which a light emitting element is mounted easily with excellent mass productivity without causing big damage to a surrounding member. SOLUTION: A light emitting device includes: a light emitting element 12 having a pair of electrodes; a substrate 11 to which the light emitting element is mounted; substrate electrodes which are mounted to the substrate and are connected to the respective electrodes of the light emitting element; and a glass sealing portion 16a sealing the light emitting element. The glass sealing portion is formed by fusion-bonding glass powder provided around the light emitting element on the substrate or sealing materials composed of the glass powder and other materials. The ratio of primary particles contained in the sealing material to all particles of the sealing material is within a range of 20-100%. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了形成符合发光元件安装的基板的复杂三维形状的玻璃密封部分，其容易以优异的批量生产率而不会对周围部件造成大的损害。 解决方案：发光器件包括：具有一对电极的发光元件12; 安装有发光元件的基板11; 基板电极，其安装到基板并连接到发光元件的各个电极; 以及密封发光元件的玻璃密封部16a。 玻璃密封部通过将设置在基板上的发光元件周围的玻璃粉末或由玻璃粉末等材料构成的密封材料进行熔融而形成。 包封在密封材料中的一次颗粒与密封材料的所有颗粒的比例在20-100％的范围内。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2008252137A

公开(公告)日：2008-10-16

申请号：JP2008182652

申请日：2008-07-14

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： KURAMOTO MASAFUMI ,  KISHIMOTO TOMOHISA

IPC: H01L33/32 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a long-life surface mount type light-emitting device having excellent mass productivity, and to provide a forming body used for the surface mount type light-emitting device. SOLUTION: The surface mount type light-emitting device has a light-emitting element 100 and first and second resin forming bodies 40, 50. In the first resin forming body 40, a substrate 10 on which the light-emitting element 100 is placed and first and second leads 20, 30 electrically connected to the light-emitting element 100 are formed integrally. In the second resin forming body 50, the light-emitting element 100 is covered. In the first resin forming body 40, a recess 40c having a bottom surface 40a and a side 40b is formed. The first and second leads 20, 30 are exposed from the bottom surface 40a of the recess 40c of the first resin forming body 40. The first and second resin forming bodies 40, 50 are made of a thermosetting resin. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种具有优异的批量生产率的长寿命表面安装型发光装置，并提供用于表面安装型发光装置的成形体。 ＆lt; P＆gt;解决方案：表面安装型发光装置具有发光元件100和第一和第二树脂形成体40,50。在第一树脂形成体40中，将发光元件100 并且与发光元件100电连接的第一和第二引线20,30一体地形成。 在第二树脂形成体50中覆盖发光元件100。 在第一树脂成形体40中形成具有底面40a和侧面40b的凹部40c。 第一和第二引线20,30从第一树脂形成体40的凹部40c的底面40a露出。第一和第二树脂形成体40,50由热固性树脂制成。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008252135A

公开(公告)日：2008-10-16

申请号：JP2008182468

申请日：2008-07-14

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： KURAMOTO MASAFUMI ,  KISHIMOTO TOMOHISA

IPC: H01L33/32 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a long-life surface mount type light-emitting device having excellent mass productivity, and to provide a forming body used for the surface mount type light-emitting device. SOLUTION: The surface mount type light-emitting device has: a GaN-based light-emitting element 10 emitting blue light; a first resin forming body 40, where a first lead 20 for placing the light-emitting element 10 and a second lead 30 electrically connected to the light-emitting element 10 are formed integrally; and a second resin forming body 50 containing a YAG-based phosphor 80 for covering the light-emitting element 10. The first resin forming body 40 forms a recess 40c having a bottom surface 40a and a side 40b. The second resin forming body 50 is arranged in the recess 40c. In the first resin forming body 40, a thermosetting resin, such as an epoxy resin, is formed by transfer molding. The second forming body 50 uses a thermosetting resin, such as a silicone resin. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种具有优异的批量生产率的长寿命表面安装型发光装置，并提供用于表面安装型发光装置的成形体。 解决方案：表面贴装型发光器件具有：发射蓝光的GaN基发光元件10; 第一树脂形成体40，其中用于放置发光元件10的第一引线20和与发光元件10电连接的第二引线30一体地形成; 以及包含用于覆盖发光元件10的YAG系荧光体80的第二树脂形成体50.第一树脂形成体40形成具有底面40a和侧面40b的凹部40c。 第二树脂成形体50配置在凹部40c中。 在第一树脂形成体40中，通过传递模塑形成诸如环氧树脂的热固性树脂。 第二成形体50使用热固性树脂，例如硅树脂。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2011097094A

公开(公告)日：2011-05-12

申请号：JP2011006851

申请日：2011-01-17

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： KURAMOTO MASAFUMI ,  KISHIMOTO TOMOHISA

IPC: H01L33/32 ,  H01L33/48 ,  B29C45/14 ,  B29L11/00 ,  H01L23/28 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a surface-mount light-emitting device that has a long life and is excellent in mass productivity, and also to provide a molding applicable to the surface-mount light-emitting device. SOLUTION: The surface-mount light-emitting device has: a GaN based light-emitting element 10 which emits blue light; a first resin compact 40 formed integrally with a first lead 20 to mount the light-emitting element 10 and a second lead 30 electrically connected to the light-emitting element 10; and a second resin compact 50 which covers the light-emitting element 10 containing YAG based phosphors 80. The first resin compact 40 is formed to have a concave portion 40c with a bottom face 40a and a side face 40b, in which there is laid out the second resin compact 50. The first resin molding 40 is molded of thermoplastic resin such as epoxy resin by means of transfer mold, and the second resin molding 50 is molded using thermoplastic resin such as silicone resin. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题：提供一种寿命长，质量生产性优异的表面贴装型发光元件，也可以提供适用于表面安装型发光元件的成型体。 表面安装型发光装置具有发出蓝色光的GaN系发光元件10。 与第一引线20一体形成以安装发光元件10的第一树脂紧凑件40和与发光元件10电连接的第二引线30; 以及覆盖包含YAG基荧光体80的发光元件10的第二树脂压块50.第一树脂压块40形成为具有底面40a和侧面40b的凹部40c，其中布置有 第二树脂模制件50通过转移模具由诸如环氧树脂的热塑性树脂模制而成，并且使用诸如硅树脂的热塑性树脂模制第二树脂模制件50。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2008252148A

公开(公告)日：2008-10-16

申请号：JP2008188492

申请日：2008-07-22

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： KURAMOTO MASAFUMI ,  TSUKIOKA TOMOYA ,  HAYASHI MASAKI ,  MIKI MICHIHIDE ,  TAMAOKI HIROTO ,  KISHIMOTO TOMOHISA

IPC: H01L33/32 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface mount type light-emitting device having excellent light resistance and mass productivity.
SOLUTION: The surface mount type light-emitting device has: a light-emitting element 10; a circuit board 20 on which the light-emitting element 10 is placed; a wall section 50 that is formed on the circuit board 20 and reflects light from the light-emitting element 10; and a light-transmitting sealing member 70 for covering the light-emitting element 10. The wall section 50 is formed of a thermosetting resin, adheres to the circuit board 20, and is formed by transfer molding.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 解决的问题：提供具有优异的耐光性和批量生产率的表面安装型发光装置的制造方法。 表面安装型发光装置具有：发光元件10; 其上放置有发光元件10的电路板20; 形成在电路板20上并反射来自发光元件10的光的壁部50; 以及用于覆盖发光元件10的透光密封构件70.壁部50由热固性树脂形成，粘附到电路板20上，并通过传递成型形成。 版权所有（C）2009，JPO＆INPIT