公开(公告)号：CA2516404A1

公开(公告)日：2004-09-10

申请号：CA2516404

申请日：2004-02-25

Applicant: KANEKA CORP ,  NICHIA CORP

Inventor： IDE MASAHITO ,  KURAMOTO MASAFUMI ,  MIKI TOMOHIDE ,  TSUMURA MANABU ,  OUCHI KATSUYA

IPC: C08K3/22 ,  C08L83/04 ,  C08L101/00 ,  C09D7/80 ,  C09D183/05 ,  H01L23/29 ,  H01L33/44 ,  C09K3/00 ,  C09D4/00 ,  C09D201/00 ,  H01L33/00 ,  B05D5/06

Abstract: The invention aims at providing A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components; A light-shielding paste which contains a thermosetting resin and an inorganic member as essential components; A curable composition which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member; The above curable composition which further contains (G) silica; The above curable composition which shows such a flow leveling property that when the composition is allowed to stand on a glass substrate inclined at an angle of 80 degrees at 100 DEG C for 1 hour, the flow-out distance is not longer than 2 cm; A light-shielding paste which comprises the above curable composition; or, A method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls and formed of a molding resin by a monolithic process with the respective ends of an external positive electrode and an external negative electrode being exposed at a predetermined distance on the aperture bottom which method comprises (1) applying a light-shielding paste to a substrate; (2) bringing the LED package aperture into close contact therewith; and (3) heating the LED package with the aperture facing upward; and thereby the light-shielding paste is allowed to spread along the package sidewalls alone. The curable composition of the invention is excellent in light-shielding ability and is highly resistant to light and, therefore, can be used as a light-shielding paste. Further, the curable composition of the invention is low in fluidity and, therefore, light-emitting diodes with the curing product formed on the LED package sidewalls alone can be obtained by using that curable composition. Furthermore, according to the method of light-shielding resin layer formation according to the invention, it is possible to efficiently apply a light-shielding paste to the LED package sidewalls alone for light-shielding resin layer formation, whereby the productivity is markedly improved.

公开(公告)号：DE112023001442T5

公开(公告)日：2025-01-02

申请号：DE112023001442

申请日：2023-03-03

Applicant: NICHIA CORP

Inventor： ARIKAWA TAKUMA ,  KURAMOTO MASAFUMI ,  WAKAKI TAKAYOSHI

IPC: G02F2/02 ,  G01N21/64 ,  G02F1/13357

Abstract: Bereitgestellt wird ein Wellenlängenumwandlungselement, bei dem die Verfärbung von einem Endabschnitt aus verhindert wird. Das Wellenlängenumwandlungselement schließt ein Laminat ein, das eine Wellenlängenumwandlungsschicht, die Quantenpunkte enthält; und zwei Sperrschichten, die jeweils auf eine der Hauptoberflächen der Wellenlängenumwandlungsschicht und auf die andere Hauptoberfläche laminiert sind, einschließt. In diesem Wellenlängenumwandlungselement weisen die Sperrschichten jeweils einen ersten Modifikationsteil auf mindestens einem Abschnitt ihrer Endoberflächen auf, weist die Wellenlängenumwandlungsschicht einen zweiten Modifikationsteil auf mindestens einem Abschnitt ihrer Endoberfläche auf und liegt der zweite Modifikationsteil mindestens teilweise an einer Endoberfläche des Laminats frei.

公开(公告)号：EP3163602A2

公开(公告)日：2017-05-03

申请号：EP16002297

申请日：2010-01-20

Applicant: NICHIA CORP

Inventor： KURAMOTO MASAFUMI ,  OGAWA SATORU ,  NIWA MIKI

IPC: H01L21/58 ,  H01L21/60 ,  H01L33/40 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022

CPC classification number: H01L33/44 ,  H01L23/08 ,  H01L23/293 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/2712 ,  H01L2224/2745 ,  H01L2224/275 ,  H01L2224/29023 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73265 ,  H01L2224/83048 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83207 ,  H01L2224/83439 ,  H01L2224/83487 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/83894 ,  H01L2224/83895 ,  H01L2224/83896 ,  H01L2224/83907 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0541 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/201 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01S5/0226 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2224/05599

Abstract: An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. Disclosed is a method for producing a semiconductor device in which silver (520, 620, 720) formed by silver sputtering, silver vapour deposition or silver plating and provided on a surface of a base (500, 600, 700) and silver (140, 240, 340) formed by silver sputtering, silver vapour deposition or silver plating and provided on a surface of a semiconductor element (100, 200, 300) are bonded, the method comprising the steps of arranging the semiconductor element (100, 200, 300) on the base (500, 600, 700) such that said silver (140, 240, 340) provided on a surface of the semiconductor element (100, 200, 300) is in contact with said silver (520, 620, 720) provided on a surface of the base (500, 600, 700), temporarily bonding the semiconductor element (100, 200, 300) and the base (500, 600, 700) by applying a pressure or an ultrasonic vibration to the semiconductor element (100, 200, 300) or the base (500, 600, 700), and permanently bonding the semiconductor element (100, 200, 300) and the base (500, 600, 700) by applying heat having a temperature of 150 to 900°C to the semiconductor element (100, 200, 300) and the base (500, 600, 700) in air or in an oxygen environment. The step of temporarily bonding and the step of permanently bonding may be performed simultaneously. The semiconductor element (100, 200, 300) and the base (500, 600, 700) may be heated in advance at 150 to 900°C before the step of temporarily bonding. A pressure of 5 to 50 MPa may be applied before the step of temporarily bonding. The semiconductor element (100, 200, 300) may be a light emitting semiconductor element.

Abstract translation: 本发明的一个目的是提供一种用于生产具有低电阻的导电性构件的方法，所述导电构件是用一种低成本的稳定的导电材料组合物并不含有获得，在粘接剂。 公开了一种用于生产，其中银以银溅射，银蒸镀或银电镀形成，并且设置在基座（500，600，700）和银的表面上的半导体器件（520，620，720）的方法（140， 240，340）所形成由银溅射，银蒸镀或电镀银并提供了一种半导体元件（100，200,300）的表面上的键合，该方法包括配置半导体元件（100，200的步骤，300 ）基体（500,600，700），检查这就是说，340设置在半导体元件（100，200,300）的表面上的银（140，240）是与所述银（520，620，720接触）上 设置在基座（500，600，700），通过施加压力或超声波振动到半导体元件暂时的半导体元件（100，200，300）和基部（500，600，700）接合（的表面上 100，200，300）或所述基部（500，600,700），和永久地接合半导体元件（100，200,300）和第 E型灯头（500，600，700）通过施加具有150〜900℃的半导体元件（100，200，300），并在空气中或在氧气环境中的基站（500,600，700）的热。 的暂时接合步骤和永久地结合的步骤可以同时进行。 半导体元件（100，200，300）和基部（500，600，700）可以预先在150的临时粘结步骤之前被加热到900℃。 5至50MPa的压力可能暂时结合步骤之前施加。 半导体元件（100，200，300）可以是半导体发光元件。

公开(公告)号：EP3163601A2

公开(公告)日：2017-05-03

申请号：EP16002296

申请日：2010-01-20

Applicant: NICHIA CORP

Inventor： KURAMOTO MASAFUMI ,  OGAWA SATORU ,  NIWA MIKI

IPC: H01L21/58 ,  H01L21/60 ,  H01L33/40 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022

CPC classification number: H01L33/44 ,  H01L23/08 ,  H01L23/293 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/2712 ,  H01L2224/2745 ,  H01L2224/275 ,  H01L2224/29023 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73265 ,  H01L2224/83048 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83207 ,  H01L2224/83439 ,  H01L2224/83487 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/83894 ,  H01L2224/83895 ,  H01L2224/83896 ,  H01L2224/83907 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0541 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/201 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01S5/0226 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2224/05599

Abstract: An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. Disclosed is a method for producing a semiconductor device in which silver oxide (520, 620, 720) provided on a surface of a base (500, 600, 700) and silver or silver oxide (140, 240, 340) provided on a surface of a semiconductor element (100, 200, 300) are bonded, the method including the steps of arranging a semiconductor element (100, 200, 300) on a base (500, 600, 700) such that silver or silver oxide (140, 240, 340) provided on a surface of the semiconductor element (100, 200, 300) is in contact with silver oxide (520, 620, 720) provided on a surface of the base (500, 600, 700), temporarily bonding the semiconductor element (100, 200, 300) and the base (500, 600, 700) by applying a pressure or an ultrasonic vibration to the semiconductor element (100, 200, 300) or the base (500, 600, 700), and permanently bonding the semiconductor element (100, 200, 300) and the base (500, 600, 700) by applying heat having a temperature of 150 to 900°C to the semiconductor element (100, 200, 300) and the base (500, 600, 700). The step of temporarily bonding and the step of permanently bonding may be performed simultaneously. The step of permanently bonding may be performed in air or in an oxygen environment, or in a nitrogen environment. The semiconductor element (100, 200, 300) and the base (500, 600, 700) may be heated in advance at 150 to 900°C before the step of temporarily bonding. A pressure of 5 to 50 MPa may be applied in the step of temporarily bonding. The semiconductor element (100, 200, 300) may be a light emitting semiconductor element.

Abstract translation: 本发明的一个目的是提供一种用于生产具有低电阻的导电性构件的方法，所述导电构件是用一种低成本的稳定的导电材料组合物并不含有获得，在粘接剂。 是（340 140，240）的表面上设置用于在其中氧化银（520，620，720）的半导体器件提供了一种基站（500，600，700），并且银或氧化银的表面上的方法公开 的半导体元件（100，200，300）键合的，该方法包括在基体上布置的半导体元件（100，200，300）的步骤（500，600，700）检测没有银或氧化银（140， 设置在半导体元件（100，200,300）的表面上的240，340）与设置在基座（500，600，700的表面上的氧化银（520，620，720）接触），暂时接合 半导体元件（100，200，300）和基部（500，600，700）通过施加到所述半导体元件（100，200，300）或所述基部（500，600,700）的压力或超声波振动，和 半导体元件（100，200，300）和基部（500，600，700）通过施加具有150至900℃的温度下对半导体元件的热永久地结合（100，200，300） 和所述基部（500，600，700）。 的暂时接合步骤和永久地结合的步骤可以同时进行。 永久接合的步骤可以在空气中或在氧气中进行，以环境，或在氮气环境中。 半导体元件（100，200，300）和基部（500，600，700）可以预先在150的临时粘结步骤之前被加热到900℃。 5至50MPa的压力可以以临时粘结的步骤中施加。 半导体元件（100，200，300）可以是半导体发光元件。

公开(公告)号：EP1609835A4

公开(公告)日：2007-10-10

申请号：EP04714432

申请日：2004-02-25

Applicant: KANEKA CORP ,  NICHIA CORP

Inventor： TSUMURA MANABU ,  IDE MASAHITO ,  OUCHI KATSUYA ,  KURAMOTO MASAFUMI ,  MIKI TOMOHIDE

IPC: C09K3/00 ,  B05D5/06 ,  C08K3/22 ,  C08L83/04 ,  C08L101/00 ,  C09D4/00 ,  C09D183/05 ,  C09D201/00 ,  H01L23/29 ,  H01L33/44

CPC classification number: C08G77/452 ,  C08F283/00 ,  C08F290/06 ,  C08F290/14 ,  C08G77/485 ,  C08G77/54 ,  C08K3/22 ,  C08L51/003 ,  C08L53/00 ,  C08L83/04 ,  C08L101/00 ,  H01L23/295 ,  H01L33/44 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/31663 ,  Y10T428/31786 ,  C08L2666/02 ,  H01L2924/00

Abstract: A light-shielding paste composed of a specific component and an inorganic material is disclosed. A method for providing an LED package with a light-shielding resin layer by applying the light-shielding paste only to the side walls of the package is also disclosed. Since the light-shielding paste has a low fluidity, it is possible to form a cured product thereof only on the side walls of the LED package. With this light-shielding resin layer forming method, light-shielding resin layers can be efficiently formed only on the side walls of the LED packages, thereby greatly improving the productivity.

公开(公告)号：EP2407980A4

公开(公告)日：2014-09-03

申请号：EP10802279

申请日：2010-07-21

Applicant: NICHIA CORP

Inventor： KURAMOTO MASAFUMI ,  OGAWA SATORU ,  NIWA MIKI ,  SUGANUMA KATSUAKI ,  KIM KEUN-SOO

IPC: H01B13/00 ,  B22F1/00 ,  H01B1/22 ,  H01L23/00 ,  H01L33/62

CPC classification number: H01B1/22 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48097 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012

Abstract: The object of the present invention is to provide a method for producing a conductive material that has a low electric resistance and that is obtained using an inexpensive and stable conductive material composition. A conductive material having a low electric resistance can be obtained by a method including the step of heating a conductive material composition that contains at least one of a full-cured or semi-cured thermosetting resin and a thermoplastic resin, as well as silver particles. Such a conductive material is a conductive material that includes fused silver particles, and thermosetting resin fine particles that have an average particle diameter of 0.1 µm to 10 µm both inclusive and are dispersed in the fused silver particles. Further, in such a conductive material is a conductive material that includes fused silver particles, and a thermoplastic resin welded among the fused silver particles.

公开(公告)号：EP1939949A4

公开(公告)日：2013-08-21

申请号：EP06810833

申请日：2006-09-29

Applicant: NICHIA CORP

Inventor： KITANI MOTOHISA ,  ICHIKAWA HIROFUMI ,  TSUKIOKA TOMOYA ,  MIKI TOMOHIDE ,  KURAMOTO MASAFUMI

IPC: H01L33/00 ,  C08L77/00 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP2711995A4

公开(公告)日：2014-11-26

申请号：EP12786606

申请日：2012-05-15

Applicant: NICHIA CORP

Inventor： KURAMOTO MASAFUMI ,  IWAKURA DAISUKE ,  OZEKI KENJI ,  TSURUHA TOMOAKI ,  OKADA SATOSHI ,  HAYASHI MASAKI

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L24/45 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/54 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: To provide a light emitting device having high light extraction efficiency, and a method for manufacturing the light emitting device. A method for manufacturing a light emitting device (100) according to the present invention, includes: forming a sealing member (40) for sealing a light emitting element (10) on a base body (30) by dropping, the base body (30) including a conductive member (20) for connecting to the light emitting element (10), and a molding (25) integrally molded with the conductive member (20); the sealing member (40) being formed such that at least a part of a periphery of the sealing member (40) is located on an outward surface (38) of the conductive member (20) or the molding (25), the outward surface facing outward in a top view.

公开(公告)号：EP2239743A4

公开(公告)日：2014-03-05

申请号：EP09702097

申请日：2009-01-09

Applicant: NICHIA CORP

Inventor： KURAMOTO MASAFUMI ,  OGAWA SATORU ,  SUGANUMA KATSUAKI ,  KIM KEUN-SOO

IPC: H01L33/62 ,  H01B1/02 ,  H05K1/09

CPC classification number: H01L33/62 ,  B23K1/0008 ,  B23K1/0016 ,  B23K35/025 ,  H01B1/02 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/092 ,  Y10T29/49144 ,  H01L2924/00

Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 µm to 15 µm, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 µm to 15 µm in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150°C to 320°C, so as to obtain a conductive material.

Abstract translation: 本发明的一个目的是提供一种用于制造导电材料确实提供的方法允许生成具有低电阻，并且也通过使用廉价且稳定的导电性材料的组合物不含有粘合剂而获得的。 直径可以通过制造方法来提供所述导电材料做包括烧结的第一导电材料组合物的步骤做了含有上的0.1微米至15微米平均粒子（中位粒径）的银粒子和金属氧化物，从而获得 导电材料。 可以设置导电材料，从而通过下述方法确实包括烧结的第二导电材料的组合物所做的步骤含有对在0.1微米至15微米的平均粒径（中值粒径）在氧气，臭氧或环境的气氛的银粒子 气氛下，在〜320℃的范围内的150℃的温度，从而获得导电性材料。

公开(公告)号：EP2390903A4

公开(公告)日：2012-10-17

申请号：EP10733350

申请日：2010-01-20

Applicant: NICHIA CORP

Inventor： KURAMOTO MASAFUMI ,  OGAWA SATORU ,  NIWA MIKI

IPC: H01L21/58 ,  H01L21/60 ,  H01L33/40 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022

CPC classification number: H01L33/44 ,  H01L23/08 ,  H01L23/293 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/2712 ,  H01L2224/2745 ,  H01L2224/275 ,  H01L2224/29023 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73265 ,  H01L2224/83048 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83207 ,  H01L2224/83439 ,  H01L2224/83487 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/83894 ,  H01L2224/83895 ,  H01L2224/83896 ,  H01L2224/83907 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0541 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/201 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01S5/0226 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2224/05599