公开(公告)号：EP2455966A4

公开(公告)日：2014-11-26

申请号：EP10799683

申请日：2010-05-28

Applicant: NICHIA CORP

Inventor： SUZUKI RYO ,  HAYASHI TADAO ,  TSUKIOKA TOMOYA ,  TAKEUCHI YOSHIKAZU

IPC: H01L33/38 ,  H01L23/00 ,  H01L33/62

CPC classification number: H01L33/38 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05552 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/06051 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP1914811A4

公开(公告)日：2011-01-05

申请号：EP06781880

申请日：2006-07-28

Applicant: NICHIA CORP

Inventor： KURAMOTO MASAFUMI ,  MIKI TOMOHIDE ,  TSUKIOKA TOMOYA ,  KISHIMOTO TOMOHISA

IPC: H01L33/00 ,  C08G59/42 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

CPC classification number: H01L33/36 ,  C08G59/3245 ,  C08K3/0033 ,  C08K3/013 ,  C08K5/005 ,  H01L33/32 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

公开(公告)号：EP1939949A4

公开(公告)日：2013-08-21

申请号：EP06810833

申请日：2006-09-29

Applicant: NICHIA CORP

Inventor： KITANI MOTOHISA ,  ICHIKAWA HIROFUMI ,  TSUKIOKA TOMOYA ,  MIKI TOMOHIDE ,  KURAMOTO MASAFUMI

IPC: H01L33/00 ,  C08L77/00 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：JP2008252148A

公开(公告)日：2008-10-16

申请号：JP2008188492

申请日：2008-07-22

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： KURAMOTO MASAFUMI ,  TSUKIOKA TOMOYA ,  HAYASHI MASAKI ,  MIKI MICHIHIDE ,  TAMAOKI HIROTO ,  KISHIMOTO TOMOHISA

IPC: H01L33/32 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface mount type light-emitting device having excellent light resistance and mass productivity.
SOLUTION: The surface mount type light-emitting device has: a light-emitting element 10; a circuit board 20 on which the light-emitting element 10 is placed; a wall section 50 that is formed on the circuit board 20 and reflects light from the light-emitting element 10; and a light-transmitting sealing member 70 for covering the light-emitting element 10. The wall section 50 is formed of a thermosetting resin, adheres to the circuit board 20, and is formed by transfer molding.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 解决的问题：提供具有优异的耐光性和批量生产率的表面安装型发光装置的制造方法。 表面安装型发光装置具有：发光元件10; 其上放置有发光元件10的电路板20; 形成在电路板20上并反射来自发光元件10的光的壁部50; 以及用于覆盖发光元件10的透光密封构件70.壁部50由热固性树脂形成，粘附到电路板20上，并通过传递成型形成。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2011023484A

公开(公告)日：2011-02-03

申请号：JP2009166054

申请日：2009-07-14

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： SUZUKI AKIRA ,  HAYASHI TADAO ,  TSUKIOKA TOMOYA ,  TAKEUCHI YOSHIKAZU

IPC: H01L21/60 ,  H01L23/12 ,  H01L33/48

CPC classification number: H01L33/38 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05552 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/06051 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a light emitting device for reliably performing self-alignment even when electrodes on the side of a substrate are formed by separation with respect to one element to be mounted, and also suppressing a solder ball and the void of the electrode. SOLUTION: The light emitting device 1 is configured to face a rectangular element 10 and be mounted upon a mounting substrate via a heat-melted connecting material. In the device, second substrate electrodes 3 are formed in alignment with the recessed notches 2c of a first substrate electrode 2 and a portion of the outer periphery of the first and second substrate electrodes includes first extended sections 2b that extend farther outward than the outer periphery gs of the element. The first extending sections are formed in at least one or more locations on one side of the outer periphery of the rectangular element; the first substrate electrode includes second extending sections 2d that are formed on at least one of both ends of the recessed notches in alignment with the first extending sections of the second substrate electrodes; and the second extending sections extend farther outward than the outer periphery of the element. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种用于可靠地执行自对准的发光装置，即使通过相对于一个要安装的元件分离形成基板一侧的电极，并且还抑制焊球和 无电极。 解决方案：发光器件1被配置为面对矩形元件10并且经由热熔融连接材料安装在安装基板上。 在该器件中，第二衬底电极3形成为与第一衬底电极2的凹陷凹槽2c对齐，并且第一和第二衬底电极的外周部分包括比外周更向外延伸的第一延伸部分2b 元素的gs。 所述第一延伸部形成在所述矩形元件的外周的一侧的至少一个以上的位置; 第一基板电极包括第二延伸部分2d，其形成在与第二基板电极的第一延伸部分对准的凹陷部分的两端中的至少一个上; 并且所述第二延伸部分比所述元件的外周向外延伸得更远。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2008263235A

公开(公告)日：2008-10-30

申请号：JP2008188491

申请日：2008-07-22

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： KURAMOTO MASAFUMI ,  TSUKIOKA TOMOYA ,  HAYASHI MASAKI ,  MIKI MICHIHIDE ,  TAMAOKI HIROTO ,  KISHIMOTO TOMOHISA

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a surface-mounting light emitting device excellent in light resistance and mass productivity.
SOLUTION: The surface-mounting light emitting device comprises a light emitting element 10, a circuit board 20 on which the light emitting element 10 is mounted, a wall part 50 which is made in the circuit board 20 and reflects light from the light emitting element 10, and a transparent sealing member 70 which covers the light emitting element 10. The wall part 50 is made of thermo-setting resin, closely in contact with the circuit board 20 and formed by a transfer mold.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 解决的问题：提供耐光性和批量生产率优异的表面贴装发光装置。 表面安装发光器件包括发光元件10，安装有发光元件10的电路板20，形成在电路板20中的壁部50， 发光元件10和覆盖发光元件10的透明密封构件70.壁部50由热固性树脂制成，与电路板20紧密接触并由转印模形成。 版权所有（C）2009，JPO＆INPIT