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1.发明专利
公开(公告)号：JPH11219820A
公开(公告)日：1999-08-10
申请号：JP3361298
申请日：1998-01-30
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI , ITO TAKASHI , FUKUI AKIRA
Abstract: PROBLEM TO BE SOLVED: To attain the small exclusive area and impedance stabilization by a method wherein a printed-coil spirally formed of conductor pattern layers and the other circuit are provided between truneated chevron shaped linear holes. SOLUTION: Opposing linear holes 2 describing truneated chevron shape are provided on a substrate 1. Conductor pattern layers 3 in equiwidth are spirally formed on upper and lower sides and both sides on the axes of the parts held between the linear holes 2a at the required intervals for avoiding the shortcircuiting with mutually adjacent conductor pattern layers 3. In a printed-coil 4, the conductor pattern layers 3 are spirally formed on upper and lower sides and both sides on the axes of the parts held between the linear holes 2 so that the interline distances of the conductor pattern layers 3 may not be notably restricted. Resultantly, the exclusive area is narrowed as well as the flux dentisy is increased. Besides, the printed-coil 4 together with the other circuit 5 are provided on a printed-wiring board. In such a constitution, the printed-coil together with the other circuit 5 are provided on one sheet of the printed- wiring board thereby making feasible of cutting down the packaging manhours for thinning the printed-wiring board.
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公开(公告)号：JPH1197842A
公开(公告)日：1999-04-09
申请号：JP27053997
申请日：1997-09-16
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI , FUKUI AKIRA
Abstract: PROBLEM TO BE SOLVED: To manufacture a printed wiring board, which is of high density and reliability and corrosion resistance of which are superior by a method, wherein a conductor layer is formed on the inner wall of a through-hole formed so as to cross a dividing line in such a way that the dividing line is excluded. SOLUTION: First, a through-hole is opened in an insulating board 1. In succession, resist layers are formed on parts in which wiring patterns 3 on the surface and the rear of every block are not required and on a part, in which a conductor layer 4 on the inner wall of the through-hole formed so as to cross a dividing line, is not required. Then, plated layers are formed on both faces of the board 1 and on a part which is not covered with the resist layers on the inner wall surface of the through hole. As a result, wiring patterns 3 are formed respectively on the surface and the rear of every block, and the conductor layer 4 which connects the respective wiring patterns 3 is formed on the inner wall of the through-hole, so as to cross the dividing line in such a way that the dividing line is excluded. Then, surface protective layers are executed to the insulating board 1, the wiring patterns 3, the conductor layer 4 and the like. Lastly, the insulating board 1 is cut along the dividing line.
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公开(公告)号：JPH1187911A
公开(公告)日：1999-03-30
申请号：JP25277297
申请日：1997-09-01
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI , FUKUI AKIRA
Abstract: PROBLEM TO BE SOLVED: To precisely process printed circuit board, by forming plating layers on front and rear surfaces of an insulating board and an inner surface of a through-hole, then providing resist layer, removing layers except the resist layers by etching, and then removing the resist layers to form a circuit pattern and a conductor. SOLUTION: First, longitudinal through-holes 3 are opened at an insulating board 1, in which copper foils 2 are laminated on both side surfaces. Plating layers 4 of copper or the like are formed on each foil 2 and inner wall surfaces of the holes 3. Resist layers 5 are provided on parts to be retained as predetermined circuit patterns 6 on the layers 4 of both the surfaces of the board, and on parts to be raised as conductors 7 for connecting the patterns 6 on the layers 4 of inner wall surfaces of the holes 3. Then, the layers 4 and the foil 2 of the parts not covered with the layers 5 are removed by etching. As a result, the layers 5 are released to form the patterns 6 and the conductors 7 at the same time.
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4.发明专利
公开(公告)号：JPH11186039A
公开(公告)日：1999-07-09
申请号：JP36467697
申请日：1997-12-17
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI , FUKUI AKIRA
Abstract: PROBLEM TO BE SOLVED: To reduce eddy current loss of a printed wiring board by forming parallel linear holes through an insulating substrate, and providing a printed coil forming a spiral conductor pattern having an equal width around the part of the insulating substrate between the linear holes, including both surface of the part and internal surfaces of the holes to the substrate together with other circuits. SOLUTION: Parallel linear holes 2 are formed through an insulating substrate 1, and a conductor pattern 3 having an equal width is formed spirally around the part of the substrate 1 between the holes 2, including both surfaces of the part and the internal surfaces of the holes 2. The holes 2 are composed of two or more narrow and long through-holes formed in parallel with each other, and an axis for forming the conductor pattern 3 of a printed coil 4 is formed in a printed wiring board. The conductor pattern 3 can be formed by plating both surfaces of the part between the holes 2 and the internal surfaces of the holes 2 after unwanted parts on the surfaces are coated with a resist, by eliminating the unwanted parts of a conductive film with a laser beam after the film is formed on both surfaces of the part and the internal surfaces of the holes 2, and so on.
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