公开(公告)号：JPH11219820A

公开(公告)日：1999-08-10

申请号：JP3361298

申请日：1998-01-30

Applicant: NISSHA PRINTING

Inventor： YAMAMOTO KUNITOSHI ,  ITO TAKASHI ,  FUKUI AKIRA

IPC: H05K1/16 ,  H01F17/00 ,  H01F41/04

Abstract: PROBLEM TO BE SOLVED: To attain the small exclusive area and impedance stabilization by a method wherein a printed-coil spirally formed of conductor pattern layers and the other circuit are provided between truneated chevron shaped linear holes. SOLUTION: Opposing linear holes 2 describing truneated chevron shape are provided on a substrate 1. Conductor pattern layers 3 in equiwidth are spirally formed on upper and lower sides and both sides on the axes of the parts held between the linear holes 2a at the required intervals for avoiding the shortcircuiting with mutually adjacent conductor pattern layers 3. In a printed-coil 4, the conductor pattern layers 3 are spirally formed on upper and lower sides and both sides on the axes of the parts held between the linear holes 2 so that the interline distances of the conductor pattern layers 3 may not be notably restricted. Resultantly, the exclusive area is narrowed as well as the flux dentisy is increased. Besides, the printed-coil 4 together with the other circuit 5 are provided on a printed-wiring board. In such a constitution, the printed-coil together with the other circuit 5 are provided on one sheet of the printed- wiring board thereby making feasible of cutting down the packaging manhours for thinning the printed-wiring board.

公开(公告)号：JP2006310758A

公开(公告)日：2006-11-09

申请号：JP2006007397

申请日：2006-01-16

Applicant: Nissha Printing Co Ltd ,  日本写真印刷株式会社

Inventor： YAMAMOTO KUNITOSHI ,  ITO TAKASHI

IPC: H05K3/28 ,  H01F17/00 ,  H05K1/16 ,  H05K3/18

Abstract: PROBLEM TO BE SOLVED: To provide a circuit wiring board which is densified by forming conductors without clearance on the circuit wiring board and to provide its manufacturing method.
SOLUTION: The circuit wiring board has several first conductors 103 which are formed with clearances 108 one another on a conductor forming surface 102a of an insulating substrate 102, and first insulators 104 which are formed respectively on first exposed surfaces 103a of the first conductors 103. In this case, second conductors 105 are formed in the clearances 108 and second insulators 106 are formed on second exposed surfaces 105a of the second conductors 105 with fusing with the first insulators 104.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种电路布线板，其通过在电路布线板上形成导体而没有间隙而致密化并提供其制造方法。 解决方案：电路布线板具有在绝缘基板102的导体形成表面102a上彼此形成有间隙108的多个第一导体103和分别形成在第一绝缘基板102的第一裸露表面103a上的第一绝缘体104。 在这种情况下，第二导体105形成在间隙108中，第二绝缘体106通过与第一绝缘体104熔合而形成在第二导体105的第二暴露表面105a上。（C）2007， JPO＆INPIT