-
公开(公告)号：WO2012047780A3
公开(公告)日：2012-06-14
申请号：PCT/US2011054545
申请日：2011-10-03
Applicant: IBM , ANDO TAKASHI , CHARNS LESLIE , CUMMINGS JASON , HUPKA JUKASZ J , KOLI DINESH R , KONNO TOMOHISA , KRISHNAN MAHADEVAIYER , LOFARO MICHAEL F , NALASKOWSKI JAKUB , NODA MASAHIRO , PENIGALAPATI DINESH K , YAMANAKA TATSUYA
Inventor： ANDO TAKASHI , CHARNS LESLIE , CUMMINGS JASON , HUPKA JUKASZ J , KOLI DINESH R , KONNO TOMOHISA , KRISHNAN MAHADEVAIYER , LOFARO MICHAEL F , NALASKOWSKI JAKUB , NODA MASAHIRO , PENIGALAPATI DINESH K , YAMANAKA TATSUYA
IPC: H01L21/336 , H01L21/304 , H01L29/78
CPC classification number: H01L21/31053 , H01L29/517 , H01L29/6653 , H01L29/66545
Abstract: Methods for polishing multiple dielectric layers to form replacement metal gate structures include a first chemical mechanical polish step to remove overburden and planarize a top layer to leave a planarized thickness over a gate structure. A second chemical mechanical polish step includes removal of the thickness to expose an underlying covered surface of a dielectric of the gate structure with a slurry configured to polish the top layer and the underlying covered surface substantially equally to accomplish a planar topography. A third chemical mechanical polish step is employed to remove the dielectric of the gate structure and expose a gate conductor.
Abstract translation: 用于抛光多个电介质层以形成替换金属栅极结构的方法包括第一化学机械抛光步骤，以去除覆盖层并平坦化顶层以在栅极结构上留下平坦化的厚度。 第二化学机械抛光步骤包括去除厚度以暴露栅极结构的电介质的下面覆盖的表面，其中浆料被配置成基本上等同地抛光顶层和下面的被覆表面以实现平面形貌。 采用第三种化学机械抛光步骤来去除栅极结构的电介质并露出栅极导体。
-
Patent Agency Ranking2.发明申请CHEMICAL MECHANICAL PLANARIZATION PROCESSES FOR FABRICATION OF FINFET DEVICES 审中-公开用于制造FINFET器件的化学机械平面化方法
公开(公告)号：WO2012047770A3
公开(公告)日：2012-06-21
申请号：PCT/US2011054521
申请日：2011-10-03
Applicant: IBM , CHANG JOSEPHINE B , CHARNS LESLIE , CUMMINGS JASON E , GUILLORN MICHAEL A , HUPKA LUKASZ J , KOLI DINESH , KONNO TOMOHISA , KRISHNAN MAHADEVAIYER , LOFARO MICHAEL F , NALASKOWSKI JAKUB W , NODA MASAHIRO , PENIGALAPATI DINESH K , YAMANAKA TATSUYA
Inventor： CHANG JOSEPHINE B , CHARNS LESLIE , CUMMINGS JASON E , GUILLORN MICHAEL A , HUPKA LUKASZ J , KOLI DINESH , KONNO TOMOHISA , KRISHNAN MAHADEVAIYER , LOFARO MICHAEL F , NALASKOWSKI JAKUB W , NODA MASAHIRO , PENIGALAPATI DINESH K , YAMANAKA TATSUYA
IPC: H01L21/304 , H01L21/336 , H01L29/78
CPC classification number: H01L21/31053 , H01L29/517 , H01L29/6653 , H01L29/66545
Abstract: A planarization method includes planarizing a semiconductor wafer in a first chemical mechanical polish step to remove overburden and planarize a top layer leaving a thickness of top layer material over underlying layers. The top layer material is planarized in a second chemical mechanical polish step to further remove the top layer and expose underlying layers of a second material and a third material such that a selectivity of the top layer material to the second material to the third material is between about 1:1:1 to about 2:1:1 to provide a planar topography.
Abstract translation: 平面化方法包括在第一化学机械抛光步骤中平坦化半导体晶片以去除覆盖层并平坦化顶层，从而在顶层之上留下厚度的顶层材料。 顶层材料在第二化学机械抛光步骤中被平坦化，以进一步去除顶层并暴露第二材料和第三材料的下层，使得顶层材料对第二材料对第三材料的选择性在 约1：1至约2：1：1，以提供平面形貌。
-
公开(公告)号：JPS611359A
公开(公告)日：1986-01-07
申请号：JP12141884
申请日：1984-06-13
Applicant: NODA MASAHIRO
Inventor： NODA MASAHIRO
IPC: A23L21/25
Abstract: PURPOSE:The titled well compatible health food, obtained by grinding an aloe, and adding and incorporating the ground aloe directly in honey, having mineral, vitamins, etc. of the honey and active constituents of the aloe together and further unique green color. CONSTITUTION:A honey food containing aloe, and obtained by grinding the aloe, and adding the ground aloe together, with the juice to natural honey, and mixing both under stirring. The amount of the aloe to be added is preferably 3-20wt%.
-
公开(公告)号：JPS5484605A
公开(公告)日：1979-07-05
申请号：JP15227277
申请日：1977-12-16
Applicant: NODA MASAHIRO
Inventor： NODA MASAHIRO
-
公开(公告)号：JPH0935611A
公开(公告)日：1997-02-07
申请号：JP23188795
申请日：1995-07-18
Applicant: NODA MASAHIRO
Inventor： NODA MASAHIRO
Abstract: PROBLEM TO BE SOLVED: To make a breaker tripped by vibration, by fitting a specific article to the tip of the breaker switch. SOLUTION: A weight D easy to fall due by vibration is fitted to the tip of a breaker switch G. For instance, a split pin A is passed into a hole of the tip of the switch G to connect the weight D via a string B and a hook C. The weight D is placed on a mount E in the vicinity of the switch G by a double-sided tape F, etc.
-
公开(公告)号：JPS6224058B2
公开(公告)日：1987-05-26
申请号：JP12141884
申请日：1984-06-13
Applicant: NODA MASAHIRO
Inventor： NODA MASAHIRO
IPC: A23L21/25
-
-
-
-
-
Search Results
6
records
(took 0.024 seconds)
