Abstract:
An apparatus and method wherein the method comprises: a deformable substrate; a curved support structure configured to support at least a portion of a resistive sensor wherein the resistive sensor comprises a first electrode, a second electrode and a resistive sensor material provided between the electrodes;at least one support configured to space the curved support structure from the deformable substrate so that when the deformable substrate is deformed the curved support structure is not deformed in the same way;wherein the resistive sensor is positioned on the curved support structure so as to limit deformation of the resistive sensor when the deformable substrate is deformed.
Abstract:
An apparatus comprising a flexible substrate 201 and an overhanging electronic component island 202a wherein the rigid electronic component island comprises a substrate-face with a connection portion 221a and an overhang portion 222a, the connection portion being mechanically coupled to a surface of the flexible substrate via one or more central connection-support pad 203a and the overhang portion configured to overhang and be substantially free of the underlying flexible substrate such that the underlying flexible substrate can be strained independently from the overhang portion under operational strains of the flexible substrate. The central connection pad also removes stress within the components on the island. This connection mechanism allows adjacent component islands to overlap one another.
Abstract:
An apparatus and method wherein the method comprises: a deformable substrate; a curved support structure configured to support at least a portion of a resistive sensor wherein the resistive sensor comprises a first electrode, a second electrode and a resistive sensor material provided between the electrodes;at least one support configured to space the curved support structure from the deformable substrate so that when the deformable substrate is deformed the curved support structure is not deformed in the same way;wherein the resistive sensor is positioned on the curved support structure so as to limit deformation of the resistive sensor when the deformable substrate is deformed.
Abstract:
An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.
Abstract:
An apparatus (201) comprises a light emitter (202) and a photodetector (203) formed on a single fluid-permeable substrate (206) such that the photodetector (203) is able to detect light emitted by the light emitter (202) after interaction of the light with a user of the apparatus (201). The photodetector comprises a channel member (207) which may be made from graphene, respective source and drain electrodes (208, 209), a layer of photosensitive material (210) configured to vary the flow of electrical current through the channel member (207) on exposure to light from the light emitter (202), and a gate electrode (211). The apparatus (201) further comprises a layer of fluid-impermeable dielectric material (212) configured to inhibit a flow of electrical current between the channel member (207) and the gate electrode (211) of the photodetector (203) to enable the electrical conductance of the channel member (207) to be controlled by a voltage applied to the gate electrode (211) and to inhibit exposure of the light emitter (202) to fluid which has permeated through the fluid-permeable substrate (206). The layer of fluid-impermeable dielectric material (212) allows resilient substrates made from polymeric material to be used without the risk of damage to the overlying components caused by the permeated fluid. The dual functionality of the layer of fluid-impermeable dielectric material (212) reduces the number of fabrication steps used to form the apparatus (201) and results in a thinner, more compact device.