公开(公告)号：EP1058491B1

公开(公告)日：2005-11-02

申请号：EP00304651.3

申请日：2000-05-31

Applicant: NORTHROP GRUMMAN CORPORATION

Inventor： Smith, Carl R. ,  Madura, Jeffrey R. ,  Kramer, Jesse J.

IPC: H05K1/05 ,  H05K1/02

CPC classification number: H05K1/056 ,  H01L2224/73204 ,  H05K1/0206 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/10727 ,  Y10T428/24124 ,  Y10T428/24132

公开(公告)号：EP1058491A2

公开(公告)日：2000-12-06

申请号：EP00304651.3

申请日：2000-05-31

Applicant: Northrop Grumman Corporation

Inventor： Smith, Carl R. ,  Madura, Jeffrey R. ,  Kramer, Jesse J.

IPC: H05K1/05 ,  H05K1/02

CPC classification number: H05K1/056 ,  H01L2224/73204 ,  H05K1/0206 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/10727 ,  Y10T428/24124 ,  Y10T428/24132

Abstract: A printed wiring board structure having at least one chip-carrying layer adjacent a core fabricated of a metal matrix having disposed therein continuous pitch based graphite fibers. The chip carrying layers and the core have an interface therebetween and are integrally connected to each other through vias plated with an electrically and thermally conductive material to thereby provide a plurality of connection sites along this interface. The matrix is preferably fabricated of aluminum. Preferred fibers are fabricated of pitch based graphite. A substantial weight savings over a common molybdenum core printed wiring board is realized due to the significant reduction in density of the core material. A typically preferred present printed wiring board structure has several circuit layers and two chip-carrying layers each on opposite sides of the core, with each of the layers and the core having respective interfaces therebetween wherein each layer is integrally connected to the core at a plurality of connection sites, as required by circuit design, along the respective interfaces. Because of the plurality of connection sites along respective interfaces, superior thermal conductivity occurs from the layers to the core since heat travels through these connection sites to effectuate extremely efficient heat transfer and ultimate heat dissipation from the entire printed wiring board structure.

Abstract translation: 一种印刷线路板结构，其具有至少一个芯片承载层，邻近由金属基体制成的芯，其中设置有连续的基于沥青的石墨纤维。 芯片承载层和芯在它们之间具有界面，并且通过电镀和导热材料的通孔彼此一体地连接，从而沿着该界面提供多个连接位置。 该基质优选由铝制成。 优选的纤维由沥青基石墨制成。 由于芯材密度的显着降低，实现了相对于普通钼芯印刷线路板的显着的重量。 通常优选的当前印刷布线板结构在芯的相对侧上具有几个电路层和两个芯片承载层，其中每个层和芯具有各自的界面，其中每个层以多个整体连接到芯 的连接站点，按照电路设计的要求，沿着相应的接口。 由于沿着各个界面的多个连接位置，因为热量传播通过这些连接部位从而实现了从整个印刷线路板结构的非常有效的热传递和最终的散热，所以从层到核心出现了优异的导热性。

公开(公告)号：EP1058490A2

公开(公告)日：2000-12-06

申请号：EP00304645.5

申请日：2000-05-31

Applicant: Northrop Grumman Corporation

Inventor： Smith, Carl R. ,  Madura, Jeffrey R. ,  Kramer, Jesse J.

IPC: H05K1/05 ,  H05K1/02

CPC classification number: H05K1/056 ,  H05K1/0206 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/10727 ,  Y10T428/24124 ,  Y10T428/24132

Abstract: A printed wiring board structure having at least one chip-carrying layer adjacent a core fabricated of an organic matrix having disposed therein continuous pitch based graphite fibers. The chip carrying layers and the core have an interface therebetween and are integrally connected to each other through vias plated with an electrically and thermally conductive material to thereby provide a plurality of connection sites along this interface. An organic matrix is preferably fabricated of a polymer material such as an epoxy resin. Preferred fibers are fabricated of pitch based graphite. A substantial weight savings over a common molybdenum core printed wiring board is realized due to the significant reduction in density of the core material. A typically preferred present printed wiring board structure has several circuit layers and two chip-carrying layers each on opposite sides of the core, with each of the layers and the core having respective interfaces therebetween wherein each layer is integrally connected to the core at a plurality of connection sites, as required by circuit design, along the respective interfaces. Because of the plurality of connection sites along respective interfaces, superior thermal conductivity occurs from the layers to the core since heat travels through these connection sites to effectuate extremely efficient heat transfer and ultimate heat dissipation from the entire printed wiring board structure.

公开(公告)号：EP1058490B1

公开(公告)日：2004-08-11

申请号：EP00304645.5

申请日：2000-05-31

Applicant: Northrop Grumman Corporation

Inventor： Smith, Carl R. ,  Madura, Jeffrey R. ,  Kramer, Jesse J.

IPC: H05K1/05 ,  H05K1/02

CPC classification number: H05K1/056 ,  H05K1/0206 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/10727 ,  Y10T428/24124 ,  Y10T428/24132

公开(公告)号：EP1058491A3

公开(公告)日：2002-03-13

申请号：EP00304651.3

申请日：2000-05-31

Applicant: Northrop Grumman Corporation

Inventor： Smith, Carl R. ,  Madura, Jeffrey R. ,  Kramer, Jesse J.

IPC: H05K1/05 ,  H05K1/02

CPC classification number: H05K1/056 ,  H01L2224/73204 ,  H05K1/0206 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/10727 ,  Y10T428/24124 ,  Y10T428/24132

Abstract: A printed wiring board structure (30) having at least one chip-carrying layer (16) adjacent a core (32) fabricated of a metal matrix (34) having disposed therein continuous pitch based graphite fibers (36). The chip carrying layers (16) and the core (32) have an interface (52) therebetween and are integrally connected to each other through vias (48) plated with an electrically and thermally conductive material (50) to thereby provide a plurality of connection sites along this interface (52). The matrix (34) is preferably fabricated of aluminum. Preferred fibers (36) are fabricated of pitch based graphite. A typically preferred present printed wiring board structure (30) has several circuit layers and two chip-carrying layers (16) each on opposite sides of the core (32), with each of the layers (16) and the core (32) having respective interfaces (52) therebetween wherein each layer is integrally connected to the core (32) at a plurality of connection sites, as required by circuit design, along the respective interfaces. Because of the plurality of connection sites along respective interfaces (52), superior thermal conductivity occurs from the layers (16) to the core (36) since heat travels through these connection sites to effectuate extremely efficient heat transfer and ultimate heat dissipation from the entire printed wiring board structure (30).

公开(公告)号：EP1058490A3

公开(公告)日：2002-03-13

申请号：EP00304645.5

申请日：2000-05-31

Applicant: Northrop Grumman Corporation

Inventor： Smith, Carl R. ,  Madura, Jeffrey R. ,  Kramer, Jesse J.

IPC: H05K1/05 ,  H05K1/02

CPC classification number: H05K1/056 ,  H05K1/0206 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/10727 ,  Y10T428/24124 ,  Y10T428/24132

Abstract: A printed wiring board structure (30) having at least one chip-carrying layer (16) adjacent a core (32) fabricated of an organic matrix (34) having disposed therein continuous pitch based graphite fibers (36). The chip carrying layers (16) and the core (32) have an interface (52) therebetween and are integrally connected to each other through vias (48) plated with an electrically and thermally conductive material (50) to thereby provide a plurality of connection sites along this interface (52). An organic matrix (34) is preferably fabricated of a polymer material such as an epoxy resin. Preferred fibers (36) are fabricated of pitch based graphite. A typically preferred present printed wiring board structure (30) has several circuit layers and two chip-carrying layers (16) each on opposite sides of the core (32), with each of the layers (16) and the core (32) having respective interfaces (52) therebetween wherein each layer is integrally connected to the core at a plurality of connection sites, as required by circuit design, along the respective interfaces. Because of the plurality of connection sites along respective interfaces (52), superior thermal conductivity occurs from the layers (16) to the core (32) since heat travels through these connection sites to effectuate extremely efficient heat transfer and ultimate heat dissipation from the entire printed wiring board structure (30).

Abstract translation: 一种印刷线路板结构，其具有至少一个芯片承载层，邻近由有机基体制成的芯，其中设置有连续的基于沥青的石墨纤维。 芯片承载层和芯在它们之间具有界面，并且通过电镀和导热材料的通孔彼此一体地连接，从而沿着该界面提供多个连接位置。 有机基质优选由聚合物材料如环氧树脂制成。 优选的纤维由沥青基石墨制成。 由于芯材密度的显着降低，实现了相对于普通钼芯印刷线路板的显着的重量。 通常优选的当前印刷布线板结构在芯的相对侧上具有几个电路层和两个芯片承载层，其中每个层和芯具有各自的界面，其中每个层以多个整体连接到芯 的连接站点，按照电路设计的要求，沿着相应的接口。 由于沿着各个界面的多个连接位置，因为热量传播通过这些连接部位从而实现了从整个印刷线路板结构的非常有效的热传递和最终的散热，所以从层到核心出现了优异的导热性。