公开(公告)号：US20200161082A1

公开(公告)日：2020-05-21

申请号：US16601901

申请日：2019-10-15

Applicant: NuFlare Technology, Inc.

Inventor： Hiromu INOUE ,  Ryoichi HIRANO ,  Masataka SHIRATSUCHI ,  Riki OGAWA

IPC: H01J37/22 ,  H01J37/244 ,  H01J37/28

Abstract: According to one aspect of the present invention, a multiple electron beam inspection apparatus includes a reference image generation circuit generating reference images corresponding to the secondary electron images, in accordance with an image generation characteristic of a secondary electron image by irradiation of one beam; and a correction circuit generating corrected reference images in which, on the basis of deviation information between a figure pattern of the secondary electron image by irradiation of the one beam of the multiple primary electron beams and a figure pattern of a secondary electron image by irradiation of another beam different from the one beam of the multiple primary electron beams, a shape of a figure pattern of a reference image corresponding to the figure pattern of the secondary electron image by the irradiation of the another beam in the reference images is corrected.

公开(公告)号：US20220301138A1

公开(公告)日：2022-09-22

申请号：US17805734

申请日：2022-06-07

Applicant: NuFlare Technology, Inc.

Inventor： Hiromu INOUE

IPC: G06T7/00 ,  G01N21/956 ,  G01N21/95

Abstract: According to one aspect of the present invention, a pattern inspection apparatus includes a uniform sizing processing circuit configured to resize a line width of a design pattern being a basis of the figure pattern by using a uniform sizing amount which has been set in advance; a reference image generation circuit configured to generate a reference image corresponding to the secondary electron image by performing image development on data of the design pattern whose line width has been resized; and a line-width dependent correction circuit configured to correct a line width of a figure pattern in the secondary electron image by using a correction amount which has been set in advance depending on a line width size.

公开(公告)号：US20210010959A1

公开(公告)日：2021-01-14

申请号：US16907925

申请日：2020-06-22

Applicant: NuFlare Technology, Inc.

Inventor： Masataka SHIRATSUCHI ,  Riki OGAWA ,  Hiromu INOUE

IPC: G01N23/2251 ,  H01J37/30 ,  H01J37/317

Abstract: Provided is an inspection apparatus including: an irradiation source irradiating a first pattern formed on an inspection target object with an electron beam; a detection circuit acquiring a first inspection image generated from the first pattern by irradiation; a filter circuit performing smoothing using a local region having a first size in a direction parallel to a first outline included in the first inspection image and a second size smaller than the first size in a direction perpendicular to the first outline and acquiring a second inspection image including a second outline generated by the smoothing; and a comparison circuit comparing the second inspection image with a predetermined reference image.

公开(公告)号：US20140104412A1

公开(公告)日：2014-04-17

申请号：US14049040

申请日：2013-10-08

Applicant: NUFLARE TECHNOLOGY, INC.

Inventor： Hiromu INOUE ,  Nobutaka KIKUIRI

IPC: G06T7/00 ,  H04N7/18

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148 ,  H04N7/183

Abstract: A first output value evaluation device obtains an average value of output values of optical image data for each of unit regions and creates a distribution map of an average value in an inspected region. A first defect history management device creates a distribution map related with the shape of the pattern from the distribution map of the average value and holds the created distribution map. A second output value evaluation device obtains at least one of a variation value and deviation of the output value of each pixel in the unit region. A defect determination device compares the obtained value with a threshold value. A second defect history management device holds information of the output value determined as a defect in the defect determination device. A defect/defect history analysis device analyzes, and checks the information from the first defect history management device and the second defect history management device.

Abstract translation: 第一输出值评估装置获得每个单位区域的光学图像数据的输出值的平均值，并创建检查区域中的平均值的分布图。 第一缺陷历史管理装置从平均值的分布图中创建与图案的形状相关的分布图，并保存所创建的分布图。 第二输出值评估装置获得单位区域中每个像素的输出值的变化值和偏差中的至少一个。 缺陷确定装置将获得的值与阈值进行比较。 第二缺陷历史管理装置保存在缺陷确定装置中确定为缺陷的输出值的信息。 缺陷/缺陷历史分析装置分析并检查来自第一缺陷历史管理装置和第二缺陷历史管理装置的信息。

公开(公告)号：US20230170183A1

公开(公告)日：2023-06-01

申请号：US17995441

申请日：2021-02-03

Applicant: NuFlare Technology, Inc.

Inventor： Riki OGAWA ,  Ryoichi HIRANO ,  Shinji SUGIHARA ,  Hiromu INOUE

IPC: H01J37/317 ,  H01J37/244 ,  H01J37/28

CPC classification number: H01J37/3177 ,  H01J37/28 ,  H01J37/244 ,  H01J2237/2817

Abstract: A multi-electron beam inspection apparatus includes a multi-detector that includes a plurality of detection sensors each of which detects a secondary electron beam emitted due to that a target object is irradiated with a primary electron beam individually preset in multiple secondary electron beams emitted because the target object is irradiated with multiple primary electron beams, a reference image data generation circuit that generates reference image data of a position irradiated with each primary electron beam, based on design data serving as a basis of the pattern formed on the target object, a synthesis circuit that synthesizes, for each primary electron beam, the reference image data of the position irradiated with a primary electron beam concerned and portions of reference image data of positions irradiated with other primary electron beams different from the primary electron beam concerned, and a comparison circuit that compares synthetic reference image data having been synthesized, and secondary electron image data based on a value detected by the detection sensor which detects a secondary electron beam due to irradiation with the primary electron beam concerned.

公开(公告)号：US20230018318A1

公开(公告)日：2023-01-19

申请号：US17805759

申请日：2022-06-07

Applicant: NuFlare Technology, Inc.

Inventor： Ryoichi HIRANO ,  Yasuhiro YAMASHITA ,  Hiromu INOUE

IPC: G06T7/00 ,  G01N21/956 ,  G01N21/88

Abstract: A pattern inspection apparatus includes an illumination optical system to illuminate an inspection substrate on which a pattern is formed, an offset calculation circuit to calculate an offset amount which depends on an image accumulation time of each of a plurality of photo sensor elements arrayed two-dimensionally, a time delay integration (TDI) sensor to include the plurality of photo sensor elements, to acquire an image of the inspection substrate by receiving a transmitted light or a reflected light from the inspection substrate by the plurality of photo sensor elements, to correct, using the offset amount, a pixel value of optical image data of an acquired image, and to output the optical image data having been corrected, and a comparison circuit to compare an optical image formed by the optical image data output from the TDI sensor with a reference image.

公开(公告)号：US20160034632A1

公开(公告)日：2016-02-04

申请号：US14814793

申请日：2015-07-31

Applicant: NuFlare Technology, Inc.

Inventor： Hiromu INOUE

IPC: G06F17/50

CPC classification number: G03F1/84

Abstract: In a position measuring method, a mask including first patterns to be transferred and second patterns not to be transferred is prepared. The position coordinates of the second patterns are measured with a position measuring apparatus and an inspection system. First position correction data is generated based on the position coordinates of the second patterns. A difference is obtained between the measured position coordinates of the second patterns and the first position correction data is corrected using the obtained difference. Second position correction data is generated from the corrected first position correction data. An optical image including the position coordinates of the first and second patterns is acquired. The position coordinates of the first patterns of the optical image are corrected using a difference between the position coordinates of the second patterns of the optical image and of the second patterns based on the second position correction data.

Abstract translation: 在位置测量方法中，准备包括要传送的第一图案和不被转印的第二图案的掩模。 用位置测量装置和检查系统测量第二图案的位置坐标。 基于第二图案的位置坐标生成第一位置校正数据。 在所测量的第二图案的位置坐标之间获得差异，并且使用所获得的差异校正第一位置校正数据。 从校正的第一位置校正数据生成第二位置校正数据。 获取包括第一和第二图案的位置坐标的光学图像。 基于第二位置校正数据，使用光学图像的第二图案的位置坐标与第二图案的位置之间的差校正光学图像的第一图案的位置坐标。

公开(公告)号：US20140204202A1

公开(公告)日：2014-07-24

申请号：US14153199

申请日：2014-01-13

Applicant: NuFlare Technology, Inc.

Inventor： Riki OGAWA ,  Hiromu INOUE ,  Masatoshi HIRONO

IPC: G06T7/00

CPC classification number: G01N21/956 ,  B82Y40/00 ,  G01N21/9503 ,  G01N2021/8848

Abstract: An inspection apparatus comprising, an optical system emitting light having a predetermined wavelength, illuminating a sample while the light is converted into light having a polarization plane not in the range of −5 degrees to 5 degrees and 85 degrees to 95 degrees with respect to a direction of a repetitive pattern on the sample, an optical system for acquiring an image and forming said image on an image sensor using a lens, a half-wave plate, a first image sensor, a second image sensor, an inspection analyzer, wherein these differ in a transmission axis direction, a processor that obtains an average gray level and a standard deviation in each predetermined unit region of the image, and a defect detector, wherein a resolution limit defined by a wavelength of the light source and a numerical aperture of the lens is a value in which the pattern is not resolved.

Abstract translation: 一种检查装置，包括：发光具有预定波长的光的光学系统，在光被转换成具有不在-5度至5度和85度至95度的范围内的偏振面的光时相对于 样品上的重复图案的方向，用于获取图像的光学系统，并且使用透镜，半波片，第一图像传感器，第二图像传感器，检查分析器在图像传感器上形成所述图像，其中这些 在透射轴方向上不同，获得图像的每个预定单位区域中的平均灰度级和标准偏差的处理器，以及缺陷检测器，其中由光源的波长和数值孔径限定的分辨率极限 镜头是不能解析图案的值。