公开(公告)号：WO1992019462A1

公开(公告)日：1992-11-12

申请号：PCT/US1992002875

申请日：1992-04-06

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  PARTHASARATHI, Arvind ,  BRADEN, Jeffrey, S.

IPC: B44C01/22

CPC classification number: H05K3/002 ,  H01L21/4839 ,  H01L23/145 ,  H01L23/49572 ,  H01L2924/0002 ,  H05K3/0041 ,  H05K3/386 ,  H05K3/4092 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09063 ,  H05K2203/063 ,  H05K2203/1545 ,  H01L2924/00

Abstract: A method for the manufacture of an electronic circuit is provided. A substrate (10) is provided with an indexing means (14) and personality windows (16) by etching. An adhesive is deposited on one surface of the substrate (10) to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the nonconductive substrate (10) and patterned into a plurality of circuit traces (22). These steps may be repeated a plurality of times for a multi-metal layer structure.

公开(公告)号：WO1997044821A1

公开(公告)日：1997-11-27

申请号：PCT/US1997007249

申请日：1997-05-02

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  MAHULIKAR, Deepak ,  PARTHASARATHI, Arvind ,  HOFFMAN, Paul, R. ,  BRADEN, Jeffrey, S.

IPC: H01L23/02

CPC classification number: H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: There is disclosed a package for housing an integrated circuit device having a metallic base component (12). The base component (12) is coated with a dielectric layer (42) and conductive circuit traces (22) are formed on this dielectric layer (42). External leads (32) are electrically interconnected (48) to an outer end (26) of the circuit traces (22) adjacent to the perimeter (28) of the metallic substrate (12). The external leads (32) extend along sidewalls (40) of the metallic substrate (12) terminating proximate to the opposing side (38) of the substrate (12). An electrically insulating material (50) is disposed between the external leads (32) and the sidewalls (40) of the metal substrate (12) providing electrical isolation. In a second embodiment of the invention, a single row of solder balls is disposed about the periphery of the metallic substrate and bonded to the outer ends of the circuit traces.

Abstract translation: 公开了一种用于容纳具有金属基底部件（12）的集成电路器件的封装。 基底部件（12）涂覆有电介质层（42），并且在该电介质层（42）上形成导电电路迹线（22）。 外部引线（32）与邻近金属基底（12）的周边（28）的电路迹线（22）的外端（26）电互连（48）。 外部引线（32）沿着靠近基板（12）的相对侧（38）终止的金属基板（12）的侧壁（40）延伸。 电绝缘材料（50）设置在提供电隔离的金属基板（12）的外部引线（32）和侧壁（40）之间。 在本发明的第二实施例中，单排焊球围绕金属基板的周边设置并结合到电路迹线的外端。

公开(公告)号：WO1991010573A1

公开(公告)日：1991-07-25

申请号：PCT/US1990007593

申请日：1990-12-20

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  PARTHASARATHI, Arvind

IPC: B44C01/22

CPC classification number: B32B15/01 ,  H01L23/49534 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/386 ,  H05K3/4092 ,  Y10T29/49121 ,  H01L2924/00

Abstract: A multi-metal layer interconnect tape (30) is provided. The tape (30) is not supported by a dielectric carrier. A thin dielectric adhesive layer (22) separates at least two self supporting metal foil layers (11, 12). In one embodiment of the invention, conductive vias (20) electrically interconnect leads (14') formed in a first metal foil layer (11) with ground (18) and power (16) circuits formed in a second metal foil layer (12). The metal foil layers (11, 12) are in close proximity so the vias (20) have a low aspect ratio. The vias (20) may be readily coated with continuous film of a conductive metal (26) and are much easier to clean than conventional vias having significantly higher aspect ratios.

公开(公告)号：WO1996030942A1

公开(公告)日：1996-10-03

申请号：PCT/US1996003258

申请日：1996-03-11

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  HOFFMAN, Paul, R. ,  MAHULIKAR, Deepak ,  BRATHWAITE, George, A. ,  SOLOMON, Dawit ,  PARTHASARATHI, Arvind

IPC: H01L23/02

CPC classification number: H01L23/49827 ,  H01L23/057 ,  H01L23/10 ,  H01L23/13 ,  H01L23/24 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/163 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/05599

Abstract: There is provided a metallic component (20) for an electronic package (40). The component (20) is coated with an electrically non-conductive layer (24) and has a plurality of conductive circuit traces (26) on a surface. The circuit traces (26) are soldered (34) directly to the input/output pads (18) of an integrated circuit device (10) and to a second plurality of circuit traces (50). The component (20) may include a heat sink to enhance dissipation of heat from the encapsulated integrated circuit device (10).

Abstract translation: 提供了一种用于电子封装（40）的金属部件（20）。 组件（20）涂覆有非导电层（24），并且在表面上具有多个导电电路迹线（26）。 电路迹线（26）直接焊接（34）到集成电路器件（10）的输入/输出焊盘（18）和第二多个电路迹线（50）。 组件（20）可以包括散热器，以增强来自封装的集成电路器件（10）的热量散失。

公开(公告)号：WO1993014518A1

公开(公告)日：1993-07-22

申请号：PCT/US1993000393

申请日：1993-01-08

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  PARTHASARATHI, Arvind ,  MAHULIKAR, Deepak

IPC: H01L23/48

CPC classification number: H01L23/10 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48618 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85418 ,  H01L2224/85871 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: There is provided a lead frame (12) with enhanced adhesion to a polymer resin (28). The lead frame (12) is coated with a thin layer (20) containing chromium, zinc or a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames (12) exhibit improved adhesion to a polymeric resin (28).

Abstract translation: 提供了对聚合物树脂（28）具有增强的粘合性的引线框架（12）。 引线框架（12）涂覆有包含铬，锌或铬和锌的混合物的薄层（20）。 锌与铬的比例超过约4:1的铬和锌的混合物是最优选的。 涂覆的引线框架（12）表现出对聚合物树脂（28）的改善的粘合性。

公开(公告)号：WO1998000293A1

公开(公告)日：1998-01-08

申请号：PCT/US1996011328

申请日：1996-07-01

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  PARTHASARATHI, Arvind ,  BRENNEMAN, William, L.

IPC: B32B09/00

CPC classification number: H01R43/24 ,  B32B7/04 ,  B32B15/08 ,  H01R13/405 ,  H05K1/056 ,  H05K3/202 ,  H05K3/384 ,  H05K3/44 ,  H05K2203/0307 ,  H05K2203/0361 ,  Y10S428/901 ,  Y10T428/249955

Abstract: There is provided a composite material (10) particularly suited for electrical and electronic applications having a metallic core (12) with a desired surface (14) finish. An acicular superficial coating layer (16) having an apparent thickness of less than 27.5 nanometers is adjacent to at least a portion of the metallic core (12). The superficial coating layer (16) is removable from the metallic core (12) without appreciable change to the metallic core (12) surface (14) finish.

Abstract translation: 提供了特别适用于具有期望表面（14）表面的金属芯（12）的电气和电子应用的复合材料（10）。 表面厚度小于27.5纳米的针状表面涂层（16）与金属芯（12）的至少一部分相邻。 表面涂层（16）可从金属芯（12）上移除，金属芯（12）表面（14）的光洁度没有明显变化。

公开(公告)号：WO1997002600A1

公开(公告)日：1997-01-23

申请号：PCT/US1996010982

申请日：1996-06-27

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  PARTHASARATHI, Arvind

IPC: H01L23/28

CPC classification number: H01L23/3737 ,  H01L23/3736 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: An electronic package (10) having improved thermal performance. In the case of a plastic (30) package, the inner ends (20) of the leads (18) of the lead frame are attached to a heat slug (12) by a high thermal conductivity material (32) such as solder or a polymeric material. In the case of a metal package, the inner ends of the leads of the lead frame are attached to the metal base component by a high thermal conductivity material.

Abstract translation: 一种具有改进的热性能的电子封装（10）。 在塑料（30）封装的情况下，引线框架的引线（18）的内端（20）通过高导热性材料（32）（例如焊料）附着到散热块（12） 聚合材料。 在金属封装的情况下，引线框架的引线的内端通过高导热性材料附接到金属基底部件。

公开(公告)号：WO1995027308A1

公开(公告)日：1995-10-12

申请号：PCT/US1995003468

申请日：1995-03-20

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  PARTHASARATHI, Arvind ,  HOFFMAN, Paul, R. ,  LIANG, Dexin ,  MAHULIKAR, Deepak ,  PASQUALONI, Anthony, M.

IPC: H01L23/02

CPC classification number: H01L24/32 ,  H01L23/04 ,  H01L23/24 ,  H01L23/295 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: There is provided an electronic package (70) where the package components (52, 54) define a cavity (56). A semiconductor device (16) and a portion (18) of a leadframe (20) occupy part of the cavity (56). Substantially the remainder of the cavity (56) is filled with a polymer (26) so that an outermost surface (74) of the polymer (26) is coplanar with a surface (76) of one of the package components (54).

Abstract translation: 提供了一种电子封装（70），其中封装部件（52,54）限定空腔（56）。 引线框架（20）的半导体器件（16）和部分（18）占据空腔（56）的一部分。 基本上，空腔（56）的其余部分填充有聚合物（26），使得聚合物（26）的最外表面（74）与包装部件（54）之一的表面（76）共面。

公开(公告)号：WO1995009437A1

公开(公告)日：1995-04-06

申请号：PCT/US1994010439

申请日：1994-09-16

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  MAHULIKAR, Deepak ,  PARTHASARATHI, Arvind

IPC: H01L21/56

CPC classification number: H01L24/32 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

Abstract: There is disclosed a process for the assembly of an electronic package (30) in which the outer lead ends (14) of a leadframe (50) are solderable (38) to external circuitry (36) without the necessity of a tin or solder coat. An oxidation resistant layer (44) is deposited on the leadframe (50) prior to package (30) assembly. The oxidation resistant layer (44) is removed prior to outer lead (14) soldering (38) providing a clean, oxide free metallic surface (46) for soldering (38).

Abstract translation: 公开了一种用于组装电子封装（30）的方法，其中引线框架（50）的外部引线端（14）可焊接（38）到外部电路（36），而不需要锡或焊料涂层 。 在封装（30）组装之前，在引线框架（50）上沉积抗氧化层（44）。 在外引线（14）焊接（38）之前去除抗氧化层（44），提供用于焊接（38）的清洁的，无氧化物的金属表面（46）。

公开(公告)号：EP0838091A1

公开(公告)日：1998-04-29

申请号：EP96924307.0

申请日：1996-06-27

Applicant: OLIN CORPORATION

Inventor： PARTHASARATHI, Arvind

IPC: H01L23

CPC classification number: H01L23/3737 ,  H01L23/3736 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: An electronic package having improved thermal performance. In the case of a plastic package, the inner ends of the leads of the lead frame are attached to a heat slug by a high thermal conductivity material such as solder or a polymeric material. In the case of a metal package, the inner ends of the leads of the leadframe are attached to the metal base component by a high thermal conductivity material.