公开(公告)号：DE112015001346T5

公开(公告)日：2016-12-01

申请号：DE112015001346

申请日：2015-03-19

Applicant: OLYMPUS CORP

Inventor： SEDIKO TAKANORI ,  NAKAMURA MIKIO ,  SATAKE NAU

IPC: H01L23/12 ,  A61B1/04 ,  B23K1/00 ,  B23K3/00 ,  B23K101/42 ,  H01L21/56 ,  H05K3/34

Abstract: Beschrieben wird ein Herstellungsverfahren für eine Baueinheit zur einfachen Herstellung einer Baueinheit mit einem Stift und einem elektronischen Bauteil, welche auf der gleichen Oberfläche angeordnet sind, sowie eine Zusammenbauschablone, eine Herstellungsvorrichtung für die Baueinheit, eine Abbildungsvorrichtung und eine Endoskopvorrichtung. Das Herstellungsverfahren für die Baueinheit gemäß der vorliegenden Erfindung ist ein Verfahren zur Herstellung der Baueinheit mit einer Mehrzahl von Stiften und einer Mehrzahl von elektronischen Bauteilen, welche miteinander mit der gleichen Oberfläche eines Substrats verbunden sind. Das Verfahren enthält einen Setzschritt (Schritt S1) des Einsetzens der Mehrzahl von Stiften und der Mehrzahl von elektronischen Bauteilen in Ausrichtung und einen Verbindungsschritt (Schritt S4) des Anordnens der Mehrzahl von Stiften und der Mehrzahl von elektronischen Bauteilen, welche in Ausrichtung sind, auf einer Stufe einer Befestigungsvorrichtung, des Absenkens einer Kopfeinheit der Befestigungsvorrichtung, welche das Substrat angesaugt hält und des Verbindens der Stifte und der elektronischen Bauteile gemeinsam mit einer Oberfläche des Substrats durch Aufbringen von Wärme und Druck, während Lot, das auf einen Lötpunkt seitens des Substrats aufgebracht ist und der Verbindungsabschnitt des Stifts in Kontakt miteinander sind.

公开(公告)号：DE112015001346T8

公开(公告)日：2017-02-09

申请号：DE112015001346

申请日：2015-03-19

Applicant: OLYMPUS CORP

Inventor： SEKIDO TAKANORI ,  NAKAMURA MIKIO ,  SATAKE NAU

IPC: H01L23/12 ,  A61B1/04 ,  B23K1/00 ,  B23K3/00 ,  B23K101/42 ,  H01L21/56 ,  H05K3/34

公开(公告)号：EP2624304A4

公开(公告)日：2014-12-24

申请号：EP11828748

申请日：2011-09-08

Applicant: OLYMPUS CORP

Inventor： NAKAMURA MIKIO

IPC: H01L31/0232 ,  A61B1/04 ,  G02B6/42 ,  H01L27/14 ,  H01L33/00 ,  H01L33/48

CPC classification number: G02B6/43 ,  A61B1/00013 ,  A61B1/00126 ,  A61B1/051 ,  G02B6/3624 ,  G02B6/4202 ,  G02B6/4206 ,  G02B6/424 ,  G02B6/428

Abstract: Provided are a photoelectric conversion connector which enables a high-speed signal transmission between an imaging element with a large number of pixels and a signal processing device and whose size can be reduced, and an optical transmission module. The photoelectric conversion connector is provided with an aligning and connecting part 43 that allows connecting, to a substrate 34, an optical element 32 and an optical fiber 38 that inputs or outputs an optical signal, the aligning and connecting part 43 is provided on a surface different from a surface on which the optical element 32 is mounted of the substrate, the optical fiber 38 is connected to the substrate 34 via the aligning and connecting part 43, and the optical element 32 and the optical fiber 38 are mounted and arranged in line along a direction of a thickness of the substrate 34.

公开(公告)号：EP2557632A4

公开(公告)日：2014-05-21

申请号：EP11765403

申请日：2011-03-23

Applicant: OLYMPUS CORP

Inventor： YAMADA JUNYA ,  NAKAMURA MIKIO

IPC: H01R9/05 ,  H01R4/02

CPC classification number: H01R9/0515 ,  H01R4/02

公开(公告)号：EP2687144A4

公开(公告)日：2014-11-05

申请号：EP11860522

申请日：2011-11-24

Applicant: OLYMPUS CORP

Inventor： SATAKE NAU ,  MOTOHARA HIROYUKI ,  YAMADA JUNYA ,  SEKIDO TAKANORI ,  NAKAMURA MIKIO

IPC: A61B1/00 ,  A61B1/04 ,  A61B1/05 ,  G02B23/24

CPC classification number: H04N7/18 ,  A61B1/00096 ,  A61B1/0011 ,  A61B1/051 ,  G02B23/2423 ,  G02B23/2484

公开(公告)号：EP2518834A4

公开(公告)日：2013-04-24

申请号：EP10839188

申请日：2010-12-08

Applicant: OLYMPUS CORP

Inventor： NAKAMURA MIKIO

IPC: H01R9/05 ,  H01R12/59 ,  H01R12/62 ,  H05K9/00

CPC classification number: H01R12/598 ,  H01R12/62

Abstract: A cable connecting structure includes a coaxial cable (1) that has a conductive film (21) formed on a surface of a center conductor (12) exposed at a distal end surface (11); and a substrate (3) that has a center conductor connecting electrode (311) formed on a connection side surface (31) for connecting the center conductor (12). The distal end surface (11) of the coaxial cable (1) and the connection side surface (31) of the substrate (3) are arranged so as to face each other. The conductive film (21) formed on the center conductor (12) and the center conductor connecting electrode (311) are connected by a conductive material.

公开(公告)号：EP2194576A4

公开(公告)日：2010-10-06

申请号：EP08832607

申请日：2008-09-16

Applicant: OLYMPUS CORP

Inventor： NAKAMURA MIKIO ,  KONDO YU

IPC: H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/14

CPC classification number: H05K3/30 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/19 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/274 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K1/144 ,  H05K3/284 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10318 ,  H05K2203/025 ,  H05K2203/1316 ,  Y10T29/49117 ,  Y10T29/4913 ,  H01L2924/00

Abstract: There is provided a stacked mounting structure in which, it is possible to realize a narrowing of pitch and to secure a height which enables to mount components to be mounted, and a method of manufacturing stacked mounting structure. The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.

Abstract translation: 提供了一种堆叠安装结构，其中可以实现节距变窄并且确保能够安装待安装部件的高度，以及制造堆叠安装结构的方法。 堆叠的安装结构包括多个构件，其具有安装和操作要安装在至少一个主表面上的部件所需的安装区域，以及用于操作要安装的部件的信号传送用连接区域，以及 设置在相互面对构件之间的连接区域上的导电构件和导电构件的横截面与连接区域相同或更小，并且导电构件的端部从主表面延伸 一个构件直到另一个构件的主表面，并且导电构件的高度调节安装区域的距离。

公开(公告)号：EP2805668A4

公开(公告)日：2015-10-07

申请号：EP13738302

申请日：2013-01-09

Applicant: OLYMPUS CORP

Inventor： NAKAMURA MIKIO

IPC: A61B1/04 ,  A61B1/00 ,  A61B1/045 ,  H04B1/74 ,  H04N5/225 ,  H04N7/18

CPC classification number: A61B1/00006 ,  A61B1/00013 ,  A61B1/00018 ,  A61B1/00036 ,  A61B1/00057 ,  A61B1/042 ,  A61B1/045 ,  H04N7/183 ,  H04N2005/2255

公开(公告)号：EP2568783A4

公开(公告)日：2014-01-22

申请号：EP11777459

申请日：2011-05-02

Applicant: OLYMPUS CORP

Inventor： NAKAMURA MIKIO

IPC: H05K3/40 ,  H01R12/53 ,  H05K1/18 ,  H05K3/32 ,  H05K9/00

CPC classification number: H05K3/403 ,  H05K3/32 ,  H05K2201/10356 ,  Y10T29/49117

公开(公告)号：JP2008130659A

公开(公告)日：2008-06-05

申请号：JP2006311551

申请日：2006-11-17

Applicant: Olympus Corp ,  オリンパス株式会社

Inventor： NAKAMURA MIKIO ,  KONDO TAKESHI

IPC: H05K1/02 ,  A61B1/04 ,  G02B23/24

Abstract: PROBLEM TO BE SOLVED: To provide a circuit board module which allows many mounting components to be housed in the tip of a thin movable mechanism of an endoscope without affecting the move of the movable mechanism and increasing the length of an unmovable hard portion.
SOLUTION: The circuit board module 100 is for use in an electronic endoscope 10 having an insertion portion 101 composed of a flexible tube 102 and a movable tip 103. The movable tip 103 of the electronic endoscope 10 is composed of a tip hard portion 104 and a bendable portion 105. The circuit board module 100 has a flexible circuit board 108 which carries a plurality of electronic components 111 housed in the movable tip 103. The flexible circuit board 108 has a plurality of component mounting areas 201a, etc., and deformation areas 202a, etc., that connect the component mounting areas 201a, etc. The flexible circuit board 108 is formed to extend across the tip hard portion 104 and the bendable portion 105.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种电路板模块，其允许许多安装部件容纳在内窥镜的细移动机构的末端中，而不会影响可移动机构的移动并增加不可移动的硬部分的长度 。 电路板模块100用于电子内窥镜10，电子内窥镜10具有由柔性管102和可移动尖端103组成的插入部分101.电子内窥镜10的可移动尖端103由尖端硬 部分104和可弯曲部分105.电路板模块100具有柔性电路板108，其容纳容纳在可移动尖端103中的多个电子部件111.柔性电路板108具有多个部件安装区域201a等。 ，以及连接部件安装区域201a等的变形区域202a等。柔性电路板108形成为贯穿顶端硬质部分104和可弯曲部分105.延伸部分（C）2008， JPO＆INPIT