公开(公告)号：WO0165294A3

公开(公告)日：2002-03-07

申请号：PCT/US0106659

申请日：2001-02-28

Applicant: ONIX MICROSYSTEMS INC

Inventor： CHAU KELVIN

IPC: G02B6/42 ,  G02B6/43 ,  H05K3/30 ,  H05K3/34

CPC classification number: G02B6/43 ,  G02B6/422 ,  G02B6/4231 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10484 ,  Y02P70/613

Abstract: For any optically interconnected assembly, the packaging tasks include alignment of one or multiple optical devices (712), and attachement of aligned modules to a common substrate (702). The concept disclosed here is a packaging method to assemble pre-aligned optical modules (712) on a common structure called motherboard (702). The apparatus consists of two components: device carrier (704) or motherboard (702) with openings on the sides and adjustable plugs (706) in the form of pins or balls. The method and apparatus utilize plugs (706) as connection bridges between device carriers (704) and motherboard (702), allowing solid contacts and a rigid aligned structure among modules (712). The direct benefits include relaxation of dimensional tolerances on parts and elimination of the need for high-precision spacers.

Abstract translation: 对于任何光学互连组件，包装任务包括一个或多个光学装置（712）的对准，以及将对齐的模块附着到公共衬底（702）。 这里公开的概念是将预定对准的光学模块（712）组装在称为主板（702）的公共结构上的封装方法。 该装置由两部分组成：装置载体（704）或在侧面具有开口的主板（702）和以销或球形式的可调塞（706）。 该方法和装置利用插头（706）作为装置载体（704）和母板（702）之间的连接桥，允许模块之间的固体触点和刚性对准结构（712）。 直接的优点包括放宽零件的尺寸公差，消除对高精度垫片的需求。

公开(公告)号：AU5079101A

公开(公告)日：2001-09-12

申请号：AU5079101

申请日：2001-02-28

Applicant: ONIX MICROSYSTEMS INC

Inventor： CHAU KELVIN

IPC: G02B6/42 ,  G02B6/43 ,  H05K3/30 ,  H05K3/34

Abstract: An apparatus and method for aligning one or more optical fibers is disclosed. The apparatus includes a carrier having one or more through holes and one or more plugs, each of which is sized to be received in one or more of the three or more through holes. The carrier is adapted to receive one or more waveguides. The waveguides may be aligned by inserting a plug into each of one or more through holes in a carrier; attaching a waveguide to the carrier; aligning the carrier to align the one or more waveguides with respect to an optical device attached to a substrate; and tacking one or more of the plugs to the substrate to maintain the alignment of the waveguides with respect to the optical device.