Abstract:
The present invention relates to a lamp tube (10), comprising a tube body (1) made of glass, characterized in that, the tube body (1) comprises a first portion (2) and a second portion (3), wherein at least one of an inner circumferential wall (A1) and an outer circumferential wall (A2) of the second portion (3) is provided with a structure for reducing transparency. In addition, the present invention further relates to a process for manufacturing the lamp tube, and an illumination apparatus comprising the lamp tube.
Abstract:
The present disclosure relates to a light emitting module, comprising: a circuit board on which a light emitting element is arranged; a lens assembly arranged on the circuit board to cover the light emitting element; and a housing made of a molding material and at least partially surrounding the circuit board and the lens assembly to form the light emitting module, wherein a fastener for firmly retaining the lens assembly to the housing is formed by the molding material while forming the housing using the molding material. The present disclosure also relates to a method for producing the light emitting module. The light emitting module according to the present disclosure can firmly retain the lens assembly by a housing made of a molding material. In addition, the light emitting module has advantages such as a simple production process, a compact structure, a low cost and so on.
Abstract:
The present invention relates to an illuminating device (100) having a housing (1) and an electronic assembly (2) accommo- dated in the housing (1), characterized by further comprising at least one adjusting mechanism (3) arranged on at least one side of the electronic assembly (2), the adjusting mechanism (3) is in operative connection with the electronic assembly (2) and can be operated from outside of the housing (1) so that the electronic assembly (2) is tensionedly held in the housing (1).
Abstract:
The present invention relates to a circuit board (1) for mounting at least one light source (10), comprising a substrate (2) and a plurality of printed electrical conductors (3) printed on the substrate (2), characterized in that, at least one the printed electrical conductor (3) comprises a first region (4) for arranging the light sources (10), the circuit board (1) further comprises reflectors (5) which are disposed between the printed electrical conductors (3) adjacent to each other and cover other regions of the printed electrical conductors (3) than the first region (4), wherein the reflectors (5) are insulating reflectors. The circuit board is easy to manufacture, has relatively high reflective property, and can efficiently reflect the light emitted from the light source. In addition, the present invention further provides a method for manufacturing the circuit board, and an illumination device comprising the circuit board.
Abstract:
The disclosure relates to a mounting profile, a separable signage module capable of emitting light, and an illumination system. According to one embodiment of the disclosure, at least one wire is fixed on the mounting profile; wherein the mounting profile is configured to: be adapted to mount at least one separable signage module on the mounting profile, and in a mounting state, each of the at least one wire contacts a corresponding power supply terminal of each of the at least one separable signage module. The technical solution of the disclosure has at least one of the following advantageous technical effects: easier design, lower assembling cost, convenient production line arrangement, and easier installation.
Abstract:
Various embodiments may relate to an illuminating device including a housing, an electronic assembly accommodated in the housing, and at least one adjusting mechanism arranged on at least one side of the electronic assembly, the adjusting mechanism is in operative connection with the electronic assembly and is operated from outside of the housing so that the electronic assembly is tensionedly held in the housing.
Abstract:
An LED lighting assembly may include: a substrate, a metal layer applied on the substrate, and an LED chip provided on the metal layer, wherein the metal layer comprises a first region for heat dissipation and two second regions for electric conduction, and the first region and the two second regions are electrically insulated from each other, and wherein the LED chip is provided in the first region and is respectively electrically connected with the two second regions via wires.