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    Surface-mountable photoelectric element
    1.
    发明专利
    Surface-mountable photoelectric element 审中-公开
    表面安装光电元件

    公开(公告)号：JP2007036294A

    公开(公告)日：2007-02-08

    申请号：JP2006294397

    申请日：2006-10-30

    Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

    Inventor： ARNDT KARLHEINZ

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/64

    CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/00014

    Abstract: PROBLEM TO BE SOLVED: To guarantee improvement of heat radiation from a chip, and in that case, to prevent remarkable change in the dimension of casing and increase in risk of delamination. SOLUTION: External terminals are initially bent toward the rear surface of a base in the outside of the base, and are bent toward the center of the base in the lower side of the base in a further extending portion. Thermal conductive terminals each initially extend from a chip supporting member to two opposite directions, in view from the top of a conductor frame, and are further bent in the same directions. A terminal section is arranged between the thermal conductive terminals, and the thermal conductive terminals and the terminal section protrude on and from various positions having intervals on one side of a cover. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了保证芯片的热辐射的改善，并且在这种情况下，防止套管的尺寸显着变化并增加分层的风险。 解决方案：外部端子最初在基座的外侧朝向底座的后表面弯曲，并且在另一个延伸部分中朝向底座的下侧的基部的中心弯曲。 导热端子从导体框架的顶部开始，从芯片支撑构件开始延伸到两个相反的方向，并且进一步沿相同的方向弯曲。 端子部分布置在导热端子之间，并且导热端子和端子部分在具有盖的一侧上的间隔的多个位置上突出。 版权所有（C）2007，JPO＆INPIT

    Optoelectronic device
    2.
    发明专利
    Optoelectronic device 审中-公开
    光电器件

    公开(公告)号：JP2009239313A

    公开(公告)日：2009-10-15

    申请号：JP2009167744

    申请日：2009-07-16

    Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

    Inventor： ARNDT KARLHEINZ ,  FARCHTCHIAN NADIR

    IPC: H01L25/075 ,  H01L33/56

    CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/3025 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To emit more light forward, and to achieve more uniform light emission and more favorable contrast.
    SOLUTION: An optoelectronic device includes a plurality of semiconductor chips. The semiconductor chip is disposed in a recessed part of a base body or a casing absorbing, at least partially, radiation emitted from the semiconductor chip. A sidewall of the recessed part is achieved black. The semiconductor chip is, at least partially, embedded in a chip cover in the recessed part. The chip cover is permeable to radiation from the semiconductor chip, and includes radiation scattering particles. Ratio of the radiation scattering particles in the chip cover is 0.75-1.25%. The chip cover is constructed for the emission from the semiconductor chip to spread, scatter, and deflect toward a radiation output combining surface of the chip cover before the emission from the semiconductor chip collides with a side surface of an adjoining LED chip.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：向前发射更多的光，并实现更均匀的光发射和更有利的对比度。 光电子器件包括多个半导体芯片。 半导体芯片设置在基体或壳体的凹部中，至少部分地吸收从半导体芯片发射的辐射。 凹陷部分的侧壁被实现为黑色。 半导体芯片至少部分地嵌入在凹部中的芯片盖中。 芯片盖可以透过来自半导体芯片的辐射，并且包括辐射散射颗粒。 芯片盖辐射散射颗粒的比例为0.75-1.25％。 在从半导体芯片的发射与相邻的LED芯片的侧表面相撞之前，芯片盖被构造用于从半导体芯片发射以散布，散射和偏转到芯片盖的辐射输出组合表面。 版权所有（C）2010，JPO＆INPIT

    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for the component
    4.
    发明专利
    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for the component 审中-公开
    半导体元件发射和/或接收电磁辐射，以及组件的外壳

    公开(公告)号：JP2011054986A

    公开(公告)日：2011-03-17

    申请号：JP2010247343

    申请日：2010-11-04

    Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

    Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG ,  BRAUNE BERT ,  WAITL GUENTER

    IPC: H01L33/48 ,  H01L33/52 ,  H01L33/54

    CPC classification number: H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor component in which joining between a used encapsulant and a housing base has poor resistance to mechanical stress and a still risk of a layer separation of an encapsulant from the housing base is reduced. SOLUTION: A semiconductor component includes at least one semiconductor chip 1 that emits and/or receives radiation, the semiconductor chip 1 disposed in a recess 2 of a housing base 3. The recess 2 has: a chip well 21 in which the semiconductor chip 1 is fixed; and a trench 22 which runs at least partway around the chip well 21 inside the recess 2. The housing base 3 has a wall 23 between the chip well 21 and the trench 22. An apex of the wall, when viewed from a bottom face of the chip well, lies below a level of a surface of a housing body 3 from which the recess 2 leads into the housing body 3, and an encapsulant 4 extends outward from the chip well 21 over the wall into the trench 22. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种半导体部件，其中使用的密封剂和壳体基座之间的接合具有差的抗机械应力，并且减小了密封剂与壳体基底的层分离的风险。 解决方案：半导体部件包括发射和/或接收辐射的至少一个半导体芯片1，半导体芯片1设置在壳体基座3的凹部2中。凹部2具有：芯片阱21，其中 半导体芯片1固定; 以及沟槽22，其至少部分地围绕凹槽2内的芯片井21延伸。壳体基座3在芯片井21和沟槽22之间具有壁23。当从底部的底面观察时，壁的顶点 芯片阱位于壳体3的表面的水平面以下，凹部2从该主体3的表面引导到壳体3中，并且密封剂4从芯片井21向外延伸到壁上进入沟槽22中。 版权所有（C）2011，JPO＆INPIT

    Surface-mountable photoelectric element
    6.
    发明专利
    Surface-mountable photoelectric element 审中-公开
    表面安装光电元件

    公开(公告)号：JP2007036295A

    公开(公告)日：2007-02-08

    申请号：JP2006294398

    申请日：2006-10-30

    Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

    Inventor： ARNDT KARLHEINZ

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/64

    CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/00014

    Abstract: PROBLEM TO BE SOLVED: To guarantee improvement of heat radiation from a chip, and in that case, to prevent remarkable change in the dimension of casing and increase in risk of delamination.
    SOLUTION: External terminals of a chip supporting member provided on a conductor frame and external terminals of a terminal section protrude from a cover, and all the terminals are molded so as to be simultaneously placed on a terminal board or a wiring board in a state where the terminals are mounted on the terminal board for mounting an element or the circuit board. At least three terminals are configured as thermal conductive terminals thermoconductively connected to the chip supporting member. The terminals protrude from the cover on various positions with intervals on at least two sides of the cover. Loss heat to be generated during operation of the element is radiated to the terminal board or the wiring board at three different points, and distributed with a large area.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了保证芯片的热辐射的改善，并且在这种情况下，防止套管的尺寸显着变化并增加分层的风险。

    解决方案：设置在导体框架上的芯片支撑构件的外部端子和端子部分的外部端子从盖子突出，并且所有端子被模制以同时放置在端子板或布线板上 端子安装在用于安装元件或电路板的端子板上的状态。 至少三个端子被配置为导热连接到芯片支撑构件的导热端子。 端子在盖的至少两侧上以间隔在各种位置从盖突出。 在元件运行期间产生的热损失在三个不同点被辐射到端子板或布线板，并且分布在大面积上。 版权所有（C）2007，JPO＆INPIT

    Surface-mountable photoelectric element
    7.
    发明专利
    Surface-mountable photoelectric element 审中-公开
    表面安装光电元件

    公开(公告)号：JP2007036293A

    公开(公告)日：2007-02-08

    申请号：JP2006294396

    申请日：2006-10-30

    Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

    Inventor： ARNDT KARLHEINZ

    IPC: H01L31/02 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64

    CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/00014

    Abstract: PROBLEM TO BE SOLVED: To guarantee improvement of heat radiation from a chip, and in that case, to prevent remarkable change in the dimension of a casing and increase in risk of delamination.
    SOLUTION: An external terminal of a chip supporting member and external terminals of a first terminal portion and a second terminal portion protrude from a cover. The external terminals are initially bent toward the rear surface of a base on the outside of the base, and are bent toward the center of the base on the lower part of the base in a further extending portion, or are bent so as to separate from the base as the curved terminals. A thermal conduction terminal protrudes from the chip supporting member in two directions opposite to each other in two opposite sides of the cover in view of from the top of a conductive frame.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了保证芯片的热辐射的改善，并且在这种情况下，为了防止壳体尺寸的显着变化并增加分层的风险。 解决方案：芯片支撑构件的外部端子和第一端子部分和第二端子部分的外部端子从盖突出。 外部端子最初朝向基座的外侧的基部的后表面弯曲，并且在另一个延伸部分中朝向基部的下部弯曲到基部的中心，或者被弯曲以与 基座为弯曲端子。 从导电框架的顶部看，导热端子从盖片支撑构件的两个相反的两个方向在盖的两个相对侧突出。 版权所有（C）2007，JPO＆INPIT

    METHOD FOR TRANSMITTING INFORMATION TO VEHICLE AND TRANSMISSION/RECEPTION DEVICE
    8.
    发明专利
    METHOD FOR TRANSMITTING INFORMATION TO VEHICLE AND TRANSMISSION/RECEPTION DEVICE 失效

    公开(公告)号：JP2000222684A

    公开(公告)日：2000-08-11

    申请号：JP2000025520

    申请日：2000-02-02

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： ARNDT KARLHEINZ

    IPC: G08G1/09 ,  B60R99/00 ,  B60T7/16 ,  B60T7/22 ,  B60W30/00 ,  G08G1/16

    Abstract: PROBLEM TO BE SOLVED: To easily and inexpensively improve safety in traffic guidance and road traffic by using an LED whose emission driven by a pulse is strong as an indication device which can visually be recognized. SOLUTION: The brake light of a preceding vehicle is realized by the array of plural LEDs which brightly emit light and is driven by a pulse by a fixed frequency at the time of braking, for example. A reception device 4 constituted in the front area of a subsequent vehicle receives a light signal transmitted from the LED of the brake light and converts it into an electric signal 5. A micro controller 6 calculates a difference between the frequency detected by a reception signal 5 and a reference frequency and calculates relative speed between a preceding vehicle and a self-vehicle from the differential value. When it is detected that relative speed becomes faster or it exceeds a limit value even after prescribed response time passes, an alarm signal 7 is displayed on a visual display device or an acoustic display device 8 and a driver accordingly recognizes the continuity or the urgency of a situation.

    OPTOELECTRONIC COMPONENT
    9.
    发明申请
    OPTOELECTRONIC COMPONENT 审中-公开
    光电子器件

    公开(公告)号：WO2004051757A3

    公开(公告)日：2004-12-23

    申请号：PCT/DE0303923

    申请日：2003-11-27

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  ARNDT KARLHEINZ ,  BOGNER GEORG ,  WAITL GUENTER ,  WINTER MATTHIAS

    Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG ,  WAITL GUENTER ,  WINTER MATTHIAS

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/00 ,  H01L31/0203

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

    Abstract: The invention relates to an optoelectronic component containing an optoelectronic chip (1), a chip carrier (2) with a central region (3), on which the chip is fixed and terminals (41, 42, 43, 44), which run from the central region of the chip carrier (2) to the exterior of said chip. The chip and sections of the chip carrier are surrounded by a body (5). The respective projection of the body, in addition to that of the longitudinal axes of the terminals on the contact plane between the chip and the chip carrier are essentially point-symmetrical in relation to the central point of the chip. The invention also relates to an assembly comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced malfunctions of the components is reduced.

    Abstract translation: 本发明涉及一种包括光电芯片（1），一个芯片载体的光电元件（2），其具有一个中心区域（3），在其上的芯片被固定，并用连接件（41，42，43，44）从中心区 点对称-从向外的芯片载体（2），其中由主体（5）的芯片和芯片载体的部分是有包膜的延伸，并且其中所述主体的所述突起和在芯片和芯片载体之间的接触面的连接器的纵向轴线各自基本上 到芯片的中心。 此外，本发明涉及具有该部件的布置。 由于设备的对称设计，这具有减小设备的热机械故障的风险的优点。

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