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    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for the component
    4.
    发明专利
    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for the component 审中-公开
    半导体元件发射和/或接收电磁辐射，以及组件的外壳

    公开(公告)号：JP2011054986A

    公开(公告)日：2011-03-17

    申请号：JP2010247343

    申请日：2010-11-04

    Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

    Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG ,  BRAUNE BERT ,  WAITL GUENTER

    IPC: H01L33/48 ,  H01L33/52 ,  H01L33/54

    CPC classification number: H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor component in which joining between a used encapsulant and a housing base has poor resistance to mechanical stress and a still risk of a layer separation of an encapsulant from the housing base is reduced. SOLUTION: A semiconductor component includes at least one semiconductor chip 1 that emits and/or receives radiation, the semiconductor chip 1 disposed in a recess 2 of a housing base 3. The recess 2 has: a chip well 21 in which the semiconductor chip 1 is fixed; and a trench 22 which runs at least partway around the chip well 21 inside the recess 2. The housing base 3 has a wall 23 between the chip well 21 and the trench 22. An apex of the wall, when viewed from a bottom face of the chip well, lies below a level of a surface of a housing body 3 from which the recess 2 leads into the housing body 3, and an encapsulant 4 extends outward from the chip well 21 over the wall into the trench 22. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种半导体部件，其中使用的密封剂和壳体基座之间的接合具有差的抗机械应力，并且减小了密封剂与壳体基底的层分离的风险。 解决方案：半导体部件包括发射和/或接收辐射的至少一个半导体芯片1，半导体芯片1设置在壳体基座3的凹部2中。凹部2具有：芯片阱21，其中 半导体芯片1固定; 以及沟槽22，其至少部分地围绕凹槽2内的芯片井21延伸。壳体基座3在芯片井21和沟槽22之间具有壁23。当从底部的底面观察时，壁的顶点 芯片阱位于壳体3的表面的水平面以下，凹部2从该主体3的表面引导到壳体3中，并且密封剂4从芯片井21向外延伸到壁上进入沟槽22中。 版权所有（C）2011，JPO＆INPIT

    Surface-mountable optoelectronic element
    5.
    发明专利
    Surface-mountable optoelectronic element 有权
    表面安装光电元件

    公开(公告)号：JP2011023770A

    公开(公告)日：2011-02-03

    申请号：JP2010248992

    申请日：2010-11-05

    Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

    Inventor： WAITL GUENTER ,  LUTZ ROBERT ,  BRUNNER HERBERT

    IPC: H01L33/48 ,  H01L31/02 ,  H01L33/58

    CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: PROBLEM TO BE SOLVED: To improve the radiation characteristics of an optoelectronic SMT element including a base, an optoelectronic transmitter or receiver in a notch of the base, an inclined inner wall surface of the notch, a pouring substance in the notch, and an optical device for closing the notch; to provide effectively regulatable radiation characteristics and to reduce the costs of the element. SOLUTION: The optical device 16 has a base surface 17 in a center range, the base surface is continued to a ring-shaped supporting surface 19 retreated from the base surface and located on the outside of the base surface in a radius direction through a transition slope 18, the base surface is located in the notch based on the transition slope, and when the optical device is mounted on an uncured pouring substance 14, the base surface is brought into contact with the pouring substance on the whole surface, and the pouring substance is arranged between the inclined inner wall surface forming a reflector and the transition slope. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：为了提高包括基座的缺口中的基座，光电发射器或接收器的光电SMT元件的辐射特性，凹口的倾斜内壁表面，凹口中的倾倒物质， 以及用于封闭所述凹口的光学装置; 以提供有效的可调节辐射特性并降低元件的成本。 解决方案：光学装置16具有中心范围的基底表面17，基底表面延续到从基部表面退回的环形支撑表面19，并且位于基底表面的外侧，半径方向 通过过渡斜面18，基础面基于过渡坡度位于凹口中，当光学装置安装在未固化的倾倒物质14上时，基面与整个表面上的倾倒物质接触， 并且倾倒物质布置在形成反射器的倾斜内壁表面和过渡斜坡之间。 版权所有（C）2011，JPO＆INPIT

    LIGHT-EMITTING COMPONENT PROVIDED WITH A LUMINESCENCE CONVERSION ELEMENT
    7.
    发明申请
    LIGHT-EMITTING COMPONENT PROVIDED WITH A LUMINESCENCE CONVERSION ELEMENT 审中-公开
    具有发光转换元件的发光组件

    公开(公告)号：WO2005008789A3

    公开(公告)日：2005-06-16

    申请号：PCT/DE2004001464

    申请日：2004-07-07

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BRAUNE BERT ,  WAITL GUENTER

    Inventor： BRAUNE BERT ,  WAITL GUENTER

    IPC: H01L33/44 ,  H01L33/50 ,  H01L33/00 ,  G02B5/20

    CPC classification number: H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: The invention relates to a light-emitting component provided with at least one primary radiation source which emits an electromagnetic primary radiation during the operation thereof, and at least one luminescence conversion element which is used to convert at least one part of the primary radiation is converted to radiation of a different wave length. A filter element provided with a plurality of nanoparticles is arranged upstream from the luminescence conversion element in the direction of radiation of the component. The nanoparticles comprise a filter substance which selectively reduces the intensity of radiation of at least one spectral partial range of undesired radiation by absorption.

    Abstract translation: 本发明包括具有其发射操作期间的电磁初级辐射的至少一个第一辐射源的发光器件，和借助于该初级辐射的至少一部分转换成波长变化辐射在至少一个发光转换元件。 发光转换元件是具有多个纳米颗粒的过滤器元件在组件的辐射方向，其中，所述纳米颗粒具有滤光物质，其选择性地减少通过吸收不期望的辐射的至少一个部分光谱区的辐射强度被设置下游。

    OPTOELECTRONIC COMPONENT
    9.
    发明申请
    OPTOELECTRONIC COMPONENT 审中-公开
    光电子器件

    公开(公告)号：WO2004051757A3

    公开(公告)日：2004-12-23

    申请号：PCT/DE0303923

    申请日：2003-11-27

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  ARNDT KARLHEINZ ,  BOGNER GEORG ,  WAITL GUENTER ,  WINTER MATTHIAS

    Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG ,  WAITL GUENTER ,  WINTER MATTHIAS

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/00 ,  H01L31/0203

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

    Abstract: The invention relates to an optoelectronic component containing an optoelectronic chip (1), a chip carrier (2) with a central region (3), on which the chip is fixed and terminals (41, 42, 43, 44), which run from the central region of the chip carrier (2) to the exterior of said chip. The chip and sections of the chip carrier are surrounded by a body (5). The respective projection of the body, in addition to that of the longitudinal axes of the terminals on the contact plane between the chip and the chip carrier are essentially point-symmetrical in relation to the central point of the chip. The invention also relates to an assembly comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced malfunctions of the components is reduced.

    Abstract translation: 本发明涉及一种包括光电芯片（1），一个芯片载体的光电元件（2），其具有一个中心区域（3），在其上的芯片被固定，并用连接件（41，42，43，44）从中心区 点对称-从向外的芯片载体（2），其中由主体（5）的芯片和芯片载体的部分是有包膜的延伸，并且其中所述主体的所述突起和在芯片和芯片载体之间的接触面的连接器的纵向轴线各自基本上 到芯片的中心。 此外，本发明涉及具有该部件的布置。 由于设备的对称设计，这具有减小设备的热机械故障的风险的优点。

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