公开(公告)号：WO2014022619A3

公开(公告)日：2014-04-24

申请号：PCT/US2013053135

申请日：2013-08-01

Applicant: OSRAM SYLVANIA INC

Inventor： SERRE JEFFERY ,  LENEF ALAN ,  SCOTCH ADAM

IPC: H01L21/60 ,  H01L21/98 ,  H01L23/488 ,  H01L33/62

CPC classification number: H05K3/3431 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0684 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/29082 ,  H01L2224/29105 ,  H01L2224/29113 ,  H01L2224/325 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/83907 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95146 ,  H01L2224/97 ,  H01L2924/01322 ,  H05K1/111 ,  H05K3/3468 ,  H05K13/0465 ,  H05K2201/10992 ,  H05K2203/044 ,  H05K2203/047 ,  H05K2203/048 ,  H01L2924/00012 ,  H01L2924/0105

Abstract: A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder (12) disposed on a layer of a base solder (14) which is disposed on the solder pad (16) of an electrical component substrate(18). The self-assembly solder (12) has a liquidus temperature less than a first temperature and the base solder (14) has a solidus temperature greater than the first temperature. The self-assembly solder (12) liquefies at the first temperature during a fluidic self assembly method to cause electrical components (10) to adhere to the substrate (18). After attachment, the substrate(18) is removed from the bath (20) and heated so that the base solder (14) and self-assembly solder (12) combine to form a composite alloy (22) which forms the final electrical solder connection between the component (10) and the solder pad (16) on the substrate (18).

Abstract translation: 描述了用于流体自组装的双焊料层，电组件衬底和使用其的方法。 双焊料层包括设置在基底焊料（14）的层上的自组装焊料层（12），该层设置在电气部件基板（18）的焊盘（16）上。 自组装焊料（12）具有低于第一温度的液相线温度，并且基底焊料（14）的固相线温度大于第一温度。 自组装焊料（12）在流体自组装方法期间在第一温度下液化，以使电组件（10）粘附到衬底（18）上。 在附着之后，将衬底（18）从浴（20）中移出并加热，使得基底焊料（14）和自组装焊料（12）组合形成复合合金（22），其形成最终的电焊接 在组件（10）和衬底（18）上的焊盘（16）之间。

公开(公告)号：WO2014182773A2

公开(公告)日：2014-11-13

申请号：PCT/US2014037082

申请日：2014-05-07

Applicant: OSRAM SYLVANIA INC

Inventor： VENK SRIDHARAN ,  SCOTCH ADAM ,  HAMBY DAVID

IPC: H05K1/14

CPC classification number: H01L24/80 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K1/141 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/284 ,  H05K3/305 ,  H05K3/368 ,  H05K3/4069 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/10106 ,  H01L2924/00

Abstract: Described herein are electronic assemblies including a subassembly film and methods for making the same. In some embodiments, a first subassembly is formed by placing an electronic die at a die placement location on a subassembly film. A second subassembly may be formed by placing the first subassembly at a subassembly placement position on a base layer, such that electrical contacts/traces on the first film overlap with electrical contacts/traces at a subassembly connection point on the base layer. Placement of the die on the subassembly film may be performed with automatic placement machinery that has a placement accuracy that is greater than that required to place the first subassembly on the base layer. As a result, the costly and time consuming manual inspection of die placement may be avoided.

Abstract translation: 这里描述的是包括子组件膜的电子组件及其制造方法。 在一些实施例中，通过将电子管芯放置在子组件膜上的管芯放置位置来形成第一子组件。 可以通过将第一子组件放置在基底层上的子组件放置位置来形成第二子组件，使得第一膜上的电接触/迹线与基底层上的子组件连接点处的电触点/迹线重叠。 可以使用具有大于将第一子组件放置在基层上所需的放置精度的自动放置机械来执行模具在子组件薄膜上的放置。 结果，可以避免成本高且耗时的针头放置的手动检查。

公开(公告)号：WO2014022619A2

公开(公告)日：2014-02-06

申请号：PCT/US2013053135

申请日：2013-08-01

Applicant: OSRAM SYLVANIA INC

Inventor： SERRE JEFFERY ,  LENEF ALAN ,  SCOTCH ADAM

IPC: H01L21/60

CPC classification number: H05K3/3431 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0684 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/29082 ,  H01L2224/29105 ,  H01L2224/29113 ,  H01L2224/325 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/83907 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95146 ,  H01L2224/97 ,  H01L2924/01322 ,  H05K1/111 ,  H05K3/3468 ,  H05K13/0465 ,  H05K2201/10992 ,  H05K2203/044 ,  H05K2203/047 ,  H05K2203/048 ,  H01L2924/00012 ,  H01L2924/0105

Abstract: A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.

Abstract translation: 描述了用于流体自组装的双焊料层，电组件衬底和使用其的方法。 双焊料层包括设置在基底焊料层上的自组装焊料层，其设置在电组件衬底的焊盘上。 自组装焊料具有低于第一温度的液相线温度，并且基底焊料的固相线温度大于第一温度。 在流体自组装方法期间，自组装焊料在第一温度下液化，以使电组件粘附到衬底上。 附着后，将衬底从浴中取出并加热，使得基底焊料和自组装焊料组合形成复合合金，其形成组件和衬底上的焊盘之间的最终电焊接连接。