ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY
    2.
    发明申请
    ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY 审中-公开
    方向独立的设备配置和组装

    公开(公告)号:WO2015047757A1

    公开(公告)日:2015-04-02

    申请号:PCT/US2014/055480

    申请日:2014-09-12

    Abstract: The present disclosure is directed to orientation-independent device configuration and assembly. An electronic device may comprise conductive pads arranged concentrically on a surface of the device. The conductive pads on the device may mate with conductive pads in a device location in circuitry. Example conductive pads may include at least a first circular conductive pad and a second ring-shaped conductive pad arranged to concentrically surround the first conductive pad. The concentric arrangement of the conductive pads allows for orientation-independent placement of the device in the circuitry. In particular, the conductive pads of the device will mate correctly with the conductive pads of the circuitry regardless of variability in device orientation. In one embodiment, the device may also be configured for use with fluidic self-assembly (FSA). For example, a device housing may be manufactured with pockets that cause the device to attain neutral buoyancy during manufacture.

    Abstract translation: 本公开涉及定向无关的装置配置和组装。 电子设备可以包括同心地布置在设备的表面上的导电垫。 器件上的导电焊盘可与电路中的器件位置中的导电焊盘配合。 示例性导电焊盘可以包括至少第一圆形导电焊盘和布置成同心地围绕第一导电焊盘的第二环形导电焊盘。 导电焊盘的同心布置允许器件在电路中的定向无关放置。 特别地,器件的导电焊盘将正确地与电路的导电焊盘配合,而不管器件取向如何变化。 在一个实施例中,该装置还可被配置为与流体自组装(FSA)一起使用。 例如,装置壳体可以制造成具有在制造期间使装置达到中性浮力的凹穴。

    LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE
    3.
    发明申请
    LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE 审中-公开
    LED照明设备,系统和制造方法

    公开(公告)号:WO2013002946A1

    公开(公告)日:2013-01-03

    申请号:PCT/US2012/040285

    申请日:2012-05-31

    Abstract: A light emitting diode (LED) lighting apparatus including an array of first optic elements overlying an array of LED chips, wherein each of the LED chips is configured to emit light of a first wavelength range through a light emitting surface of the overlying first optic element. The array of first optic elements are also underlying an array of second optic elements, wherein each of the second optic elements is configured to convert light of the first wavelength range to be emitted through the light emitting surface of the underlying first optic element to light of a second wavelength range different from the first wavelength range.

    Abstract translation: 一种发光二极管(LED)照明装置,包括覆盖LED芯片阵列的第一光学元件的阵列,其中每个LED芯片被配置为通过覆盖的第一光学元件的发光表面发射第一波长范围的光 。 第一光学元件的阵列也在第二光学元件的阵列的下面,其中每个第二光学元件被配置成将要通过下面的第一光学元件的发光表面发射的第一波长范围的光转换成 与第一波长范围不同的第二波长范围。

    LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE
    6.
    发明公开
    LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE 有权
    LEDBELEUCHTUNGSGERÄT,SYSTEM UND VERFAHREN ZUR HERSTELLUNG

    公开(公告)号:EP2726778A1

    公开(公告)日:2014-05-07

    申请号:EP12727713.5

    申请日:2012-05-31

    Abstract: A light emitting diode (LED) lighting apparatus including an array of first optic elements overlying an array of LED chips, wherein each of the LED chips is configured to emit light of a first wavelength range through a light emitting surface of the overlying first optic element. The array of first optic elements are also underlying an array of second optic elements, wherein each of the second optic elements is configured to convert light of the first wavelength range to be emitted through the light emitting surface of the underlying first optic element to light of a second wavelength range different from the first wavelength range.

    Abstract translation: 一种发光二极管(LED)照明设备,包括覆盖LED芯片阵列的第一光学元件的阵列,其中每个LED芯片被配置为通过上覆的第一光学元件的发光表面发射第一波长范围的光 。 第一光学元件的阵列也位于第二光学元件阵列的下方,其中每个第二光学元件被配置成将要通过下面的第一光学元件的发光表面发射的第一波长范围的光转换成 与第一波长范围不同的第二波长范围。

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