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    WAVELENGTH CONVERTER FOR AN LED, METHOD OF MAKING, AND LED CONTAINING SAME
    1.
    发明申请
    WAVELENGTH CONVERTER FOR AN LED, METHOD OF MAKING, AND LED CONTAINING SAME 审中-公开
    用于LED的波长转换器，制造方法和包含其的LED

    公开(公告)号：WO2012106282A1

    公开(公告)日：2012-08-09

    申请号：PCT/US2012/023222

    申请日：2012-01-31

    Applicant: OSRAM SYLVANIA Inc. ,  KUNDALIYA, Darshan ,  SCOTCH, Adam M. ,  RAUKAS, Madis ,  HAMBY, David ,  MISHRA, Kalish ,  STOUGH, Matthew

    Inventor： KUNDALIYA, Darshan ,  SCOTCH, Adam M. ,  RAUKAS, Madis ,  HAMBY, David ,  MISHRA, Kalish ,  STOUGH, Matthew

    IPC: C09K11/77

    CPC classification number: H01L33/502 ,  C09K11/7701 ,  C09K11/7721 ,  C09K11/7774 ,  C30B23/025 ,  C30B23/066 ,  C30B29/68 ,  Y10T428/24942

    Abstract: A wavelength converter for an LED is described that comprises a substrate of monocrystalline garnet having a cubic crystal structure, a first lattice parameter and an oriented crystal face. An epitaxial layer is formed directly on the oriented crystal face of the substrate. The layer is comprised of a monocrystalline garnet phosphor having a cubic crystal structure and a second lattice parameter that is different from the first lattice parameter wherein the difference between the first lattice parameter and the second lattice parameter results in a lattice mismatch within a range of 15%. The strain induced in the phosphor layer by the lattice mismatch shifts the emission of the phosphor to longer wavelengths when a tensile strain is induced and to shorter wavelengths when a compressive strain is induced. Preferably, the wavelength converter is mounted on the light emitting surface of a blue LED to produce an LED light source.

    Abstract translation: 描述了一种用于LED的波长转换器，其包括具有立方晶体结构的单晶石榴石基底，第一晶格参数和取向晶体面。 外延层直接形成在基板的取向晶面上。 该层由具有立方晶体结构的单晶石榴石荧光体和不同于第一晶格参数的第二晶格参数组成，其中第一晶格参数和第二晶格参数之间的差异导致在15的范围内的晶格失配 ％。 通过晶格失配在荧光体层中诱发的应变当诱发拉伸应变时将磷光体的发射移动到更长的波长，并且当产生压缩应变时将其发射到较短的波长。 优选地，波长转换器安装在蓝色LED的发光表面上以产生LED光源。

    SYSTEM FOR ATTACHING DEVICES TO FLEXIBLE SUBSTRATES
    2.
    发明申请
    SYSTEM FOR ATTACHING DEVICES TO FLEXIBLE SUBSTRATES 审中-公开

    公开(公告)号：WO2015034664A3

    公开(公告)日：2015-03-12

    申请号：PCT/US2014/051627

    申请日：2014-08-19

    Applicant: OSRAM SYLVANIA INC.

    Inventor： SPEER, Richard S. ,  HAMBY, David ,  SCOTCH, Adam M.

    IPC: H01L21/60 ,  H01L23/498

    Abstract: This disclosure is directed to a system for attaching devices to flexible substrates. A device may be coupled to a flexible substrate in a manner that prevents adhesive from contacting conductive ink while the adhesive is harmful. If conductive epoxy is used to anchor conductive pads in the device to the flexible substrate, conductive epoxy may be applied beyond the edge of the device over which conductive ink may be applied to make electrical connections. Holes may also be formed in the flexible substrate allowing conductive epoxy to be exposed on a surface of the flexible substrate opposite to the device location, the conductive ink connections being made on the opposite surface. The conductive ink may also be applied directly to the conductive pads when extended beyond the device's edge. The flexible substrate may be preprinted with circuit paths, the conductive ink coupling the device to the circuit paths.

    ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY
    4.
    发明申请
    ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY 审中-公开
    方向独立的设备配置和组装

    公开(公告)号：WO2015047757A1

    公开(公告)日：2015-04-02

    申请号：PCT/US2014/055480

    申请日：2014-09-12

    Applicant: OSRAM SYLVANIA INC.

    Inventor： HAMBY, David W. ,  SCOTCH, Adam M. ,  VENK, Sridharan ,  LENEF, Alan

    IPC: H01L25/16 ,  H01L33/00 ,  H05K1/11 ,  H05K3/30

    CPC classification number: H01L33/62 ,  H01L24/83 ,  H01L33/38 ,  H01L2924/12041 ,  H05K1/111 ,  H05K3/303 ,  H05K2201/0939 ,  H05K2201/09809 ,  H05K2201/10106 ,  H05K2203/048 ,  H05K2203/0776 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

    Abstract: The present disclosure is directed to orientation-independent device configuration and assembly. An electronic device may comprise conductive pads arranged concentrically on a surface of the device. The conductive pads on the device may mate with conductive pads in a device location in circuitry. Example conductive pads may include at least a first circular conductive pad and a second ring-shaped conductive pad arranged to concentrically surround the first conductive pad. The concentric arrangement of the conductive pads allows for orientation-independent placement of the device in the circuitry. In particular, the conductive pads of the device will mate correctly with the conductive pads of the circuitry regardless of variability in device orientation. In one embodiment, the device may also be configured for use with fluidic self-assembly (FSA). For example, a device housing may be manufactured with pockets that cause the device to attain neutral buoyancy during manufacture.

    Abstract translation: 本公开涉及定向无关的装置配置和组装。 电子设备可以包括同心地布置在设备的表面上的导电垫。 器件上的导电焊盘可与电路中的器件位置中的导电焊盘配合。 示例性导电焊盘可以包括至少第一圆形导电焊盘和布置成同心地围绕第一导电焊盘的第二环形导电焊盘。 导电焊盘的同心布置允许器件在电路中的定向无关放置。 特别地，器件的导电焊盘将正确地与电路的导电焊盘配合，而不管器件取向如何变化。 在一个实施例中，该装置还可被配置为与流体自组装（FSA）一起使用。 例如，装置壳体可以制造成具有在制造期间使装置达到中性浮力的凹穴。

    LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE
    5.
    发明申请
    LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE 审中-公开
    LED照明设备，系统和制造方法

    公开(公告)号：WO2013002946A1

    公开(公告)日：2013-01-03

    申请号：PCT/US2012/040285

    申请日：2012-05-31

    Applicant: OSRAM SYLVANIA INC. ,  HAMBY, David W. ,  SCOTCH, Adam M. ,  SELVERIAN, John H.

    Inventor： HAMBY, David W. ,  SCOTCH, Adam M. ,  SELVERIAN, John H.

    IPC: F21V5/00

    CPC classification number: F21V5/007 ,  F21K9/20 ,  F21K9/64 ,  F21V17/16 ,  F21Y2105/10 ,  F21Y2115/10

    Abstract: A light emitting diode (LED) lighting apparatus including an array of first optic elements overlying an array of LED chips, wherein each of the LED chips is configured to emit light of a first wavelength range through a light emitting surface of the overlying first optic element. The array of first optic elements are also underlying an array of second optic elements, wherein each of the second optic elements is configured to convert light of the first wavelength range to be emitted through the light emitting surface of the underlying first optic element to light of a second wavelength range different from the first wavelength range.

    Abstract translation: 一种发光二极管（LED）照明装置，包括覆盖LED芯片阵列的第一光学元件的阵列，其中每个LED芯片被配置为通过覆盖的第一光学元件的发光表面发射第一波长范围的光 。 第一光学元件的阵列也在第二光学元件的阵列的下面，其中每个第二光学元件被配置成将要通过下面的第一光学元件的发光表面发射的第一波长范围的光转换成 与第一波长范围不同的第二波长范围。

    DEPOSITION OF ESD PROTECTION ON PRINTED CIRCUIT BOARDS
    7.
    发明申请
    DEPOSITION OF ESD PROTECTION ON PRINTED CIRCUIT BOARDS 审中-公开
    印刷电路板上ESD保护的沉积

    公开(公告)号：WO2013003525A1

    公开(公告)日：2013-01-03

    申请号：PCT/US2012/044512

    申请日：2012-06-28

    Applicant: OSRAM SYLVANIA INC. ,  SCOTCH, Adam M. ,  HAMBY, David

    Inventor： SCOTCH, Adam M. ,  HAMBY, David

    IPC: H05K1/02 ,  H05K1/18

    CPC classification number: H05K1/189 ,  H05K1/0259 ,  H05K1/16 ,  H05K2201/0329 ,  H05K2201/10106

    Abstract: A method and apparatus for providing electro-static discharge (ESD) protection to light emitting diode (LED) systems on printed circuit boards (PCBs). Protection is provided by ESD diodes deposited on the PCBs configured as flexible substrates. Various deposition techniques are employed including chemical vapor deposition, pulsed laser deposition and atomic layer deposition.

    Abstract translation: 一种用于向印刷电路板（PCB）上的发光二极管（LED）系统提供静电放电（ESD）保护的方法和装置。 保护由沉积在配置为柔性基板的PCB上的ESD二极管提供。 采用各种沉积技术，包括化学气相沉积，脉冲激光沉积和原子层沉积。

    LED LIGHT SOURCE
    8.
    发明申请
    LED LIGHT SOURCE 审中-公开
    LED光源

    公开(公告)号：WO2011159484A1

    公开(公告)日：2011-12-22

    申请号：PCT/US2011/038895

    申请日：2011-06-02

    Applicant: OSRAM SYLVANIA INC. ,  LAPATOVICH, Walter P. ,  HAMBY, David ,  KOENIGSBERG, William D. ,  SCOTCH, Adam M.

    Inventor： LAPATOVICH, Walter P. ,  HAMBY, David ,  KOENIGSBERG, William D. ,  SCOTCH, Adam M.

    IPC: F21V29/00

    CPC classification number: F21V29/56 ,  F21K9/00 ,  F21V7/06 ,  F21V7/08 ,  F21V7/09 ,  F21V7/22 ,  F21V29/004 ,  F21V29/86 ,  F21V29/89 ,  F21Y2107/30 ,  F21Y2115/10

    Abstract: A lamp (10) has a concave reflector (12) that includes an opening (14) in the bottom thereof and is substantially symmetrically arrayed about a longitudinal axis (16). A light source (18) is positioned in the opening (14) and has a symmetry axis (19) that is coaxial with the longitudinal axis (16) of the reflector (12). The light source (18) comprises a hollow ceramic member (20) with an inner surface (22) and an outer surface (24). First and second electrically conductive traces (26, 28) and first and second rows (29, 31) of first and second electrically conductive pads (30, 32) connected by the electrically conductive traces (26, 28) are formed on the outer surface (24). Light emitting diodes (34) are associated with at least some of the electrically conductive pads (30, 32); and a heat-conducting mechanism (36) is contained within the hollow ceramic member (20) for removing heat generated by the light emitting diodes (34) when the light emitting diodes (34) are operating.

    Abstract translation: 灯（10）具有在其底部包括开口（14）并围绕纵向轴线（16）基本上对称排列的凹面反射器（12）。 光源（18）定位在开口（14）中并且具有与反射器（12）的纵向轴线（16）同轴的对称轴线（19）。 光源（18）包括具有内表面（22）和外表面（24）的中空陶瓷构件（20）。 通过导电迹线（26,28）连接的第一和第二导电迹线（26,28）和由导电迹线（26,28）连接的第一和第二导电焊盘（30,32）的第一和第二行（29,31）形成在外表面 （24）。 发光二极管（34）与至少一些导电焊盘（30,32）相关联; 并且在所述中空陶瓷构件（20）内容纳有导热机构（36），用于当所述发光二极管（34）工作时除去由所述发光二极管（34）产生的热量。

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