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    METHODS OF PRODUCING ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM
    1.
    发明申请
    METHODS OF PRODUCING ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM 审中-公开

    公开(公告)号：WO2014182773A3

    公开(公告)日：2014-11-13

    申请号：PCT/US2014/037082

    申请日：2014-05-07

    Applicant: OSRAM SYLVANIA INC.

    Inventor： VENK, Sridharan ,  SCOTCH, Adam ,  HAMBY, David

    IPC: H05K1/14 ,  H05K3/28 ,  H05K3/40 ,  H01L33/48 ,  H01L33/62 ,  H05K3/30 ,  H05K3/36

    Abstract: Described herein are methods of making electronic assemblies including a subassembly film. In some embodiments, a first subassembly is formed by placing an electronic die at a die placement location on a subassembly film. A second subassembly may be formed by placing the first subassembly at a subassembly placement position on a base layer, such that electrical contacts/traces on the first film overlap with electrical contacts/traces at a subassembly connection point on the base layer. Placement of the die on the subassembly film may be performed with automatic placement machinery that has a placement accuracy that is greater than that required to place the first subassembly on the base layer. As a result, the costly and time consuming manual inspection of die placement may be avoided.

    TECHNIQUES FOR ADHERING SURFACE MOUNT DEVICES TO A FLEXIBLE SUBSTRATE
    2.
    发明申请
    TECHNIQUES FOR ADHERING SURFACE MOUNT DEVICES TO A FLEXIBLE SUBSTRATE 审中-公开
    用于将表面安装装置附接到柔性基板的技术

    公开(公告)号：WO2015171983A1

    公开(公告)日：2015-11-12

    申请号：PCT/US2015/029829

    申请日：2015-05-08

    Applicant: OSRAM SYLVANIA INC.

    Inventor： SPEER, Richard ,  HAMBY, David ,  SCOTCH, Adam

    IPC: H05K1/18 ,  H05K3/32

    CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K1/028 ,  H05K1/0326 ,  H05K1/111 ,  H05K1/118 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0145 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611

    Abstract: Techniques are disclosed for attaching SMDs to a flexible substrate using conductive epoxy bond pads. Each bond pad includes a set of elongated strips of conductive epoxy that are applied and cured onto the flexible substrate in an adjacent and parallel fashion. The bond pads are used to attach SMDs to the flexible substrate and also provide the conductive contacts for a printed circuit. A circuit may be printed on the flexible substrate using conductive ink that partially covers the bond pads, leaving a portion of the pads exposed. A second layer or strip of conductive epoxy may be applied over and across the exposed portions of the bond pad strips in order to attach an SMD. The number, size, and orientation of the epoxy bond pad strips may be determined by the amount of bending the flexible substrate is expected to withstand and/or the orientation of the bend.

    Abstract translation: 公开了使用导电环氧树脂接合垫将SMD连接到柔性基板上的技术。 每个接合焊盘包括一组细长的导电环氧树脂条，其以相邻和平行的方式施加并固化到柔性基板上。 接合焊盘用于将SMD连接到柔性基板上，并且还为印刷电路提供导电触点。 可以使用部分覆盖接合焊盘的导电油墨将电路印刷在柔性基板上，从而使一部分焊盘露出。 导电环氧树脂的第二层或带可以施加在接合焊盘条的暴露部分上并跨越接合焊盘条的暴露部分，以便附接SMD。 环氧接合焊盘条的数量，尺寸和取向可以由柔性基板预期承受的弯曲量和/或弯曲的取向来确定。

    CERAMIC WAVELENGTH CONVERTER HAVING A HIGH REFLECTIVITY REFLECTOR
    3.
    发明申请
    CERAMIC WAVELENGTH CONVERTER HAVING A HIGH REFLECTIVITY REFLECTOR 审中-公开
    陶瓷波导转换器具有高反射率反射器

    公开(公告)号：WO2015112946A1

    公开(公告)日：2015-07-30

    申请号：PCT/US2015/012838

    申请日：2015-01-26

    Applicant: OSRAM SYLVANIA INC.

    Inventor： LENEF, Alan ,  AVALLON, James ,  SCOTCH, Adam

    IPC: H01L33/50 ,  F21K99/00

    CPC classification number: H01L33/505 ,  C04B37/026 ,  C04B2237/062 ,  C04B2237/066 ,  C04B2237/068 ,  C04B2237/121 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/708 ,  C04B2237/72 ,  C09K11/7774

    Abstract: There is herein described a ceramic wavelength converter having a high reflectivity reflector. The ceramic wavelength converter is capable of converting a primary light into a secondary light and the reflector comprises a reflective metal layer and a dielectric buffer layer between the ceramic wavelength converter and the reflective metal layer. The buffer layer is non-absorbing with respect to the secondary light and has an index of refraction that is less than an index of refraction of the ceramic wavelength converter. Preferably the reflectivity of the reflector is at least 80%, more preferably at least 85% and even more preferably at least 95% with respect to the secondary light emitted by the converter.

    Abstract translation: 这里描述了具有高反射率反射器的陶瓷波长转换器。 陶瓷波长转换器能够将一次光转换成二次光，反射器包括反射金属层和陶瓷波长转换器与反射金属层之间的介质缓冲层。 缓冲层相对于次级光不吸收，并且具有小于陶瓷波长转换器的折射率的折射率。 优选地，反射器的反射率相对于由转换器发射的次级光是至少80％，更优选至少85％，甚至更优选至少95％。

    ELECTROSTATIC DISCHARGE PROTECTION FOR ELECTRICAL COMPONENTS, DEVICES INCLUDING SUCH PROTECTION AND METHODS FOR MAKING THE SAME
    5.
    发明申请
    ELECTROSTATIC DISCHARGE PROTECTION FOR ELECTRICAL COMPONENTS, DEVICES INCLUDING SUCH PROTECTION AND METHODS FOR MAKING THE SAME 审中-公开
    电气元件的静电放电保护，包括这种保护的装置及其制造方法

    公开(公告)号：WO2014099772A1

    公开(公告)日：2014-06-26

    申请号：PCT/US2013/075376

    申请日：2013-12-16

    Applicant: OSRAM SYLVANIA INC.

    Inventor： HAMBY, David ,  SCOTCH, Adam

    IPC: H01L25/16

    CPC classification number: H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge ("ESD") events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against low level ESD events by one or more diodes that are electrically coupled thereto. The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material. Devices including ESD protection and methods for manufacturing such devices are also described.

    Abstract translation: 描述了用于保护诸如发光二极管的电气部件的系统和方法。 在一些实施例中，通过提供固有水平的ESD保护的电路板来保护电气部件免受高电平静电放电（“ESD”）事件的影响。 同时，通过与电耦合到其上的一个或多个二极管来保护这种电气部件免受低电平ESD事件的影响。 一个或多个二极管可以是包括至少一层p型半导体材料和至少一层n型半导体材料的薄膜二极管。 还描述了包括ESD保护的装置和用于制造这种装置的方法。

    DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONENT SUBSTRATE AND METHOD EMPLOYING SAME
    6.
    发明申请
    DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONENT SUBSTRATE AND METHOD EMPLOYING SAME 审中-公开
    用于流体自组装的双焊料层和电子元件基板及使用该元件的方法

    公开(公告)号：WO2014022619A8

    公开(公告)日：2014-02-06

    申请号：PCT/US2013/053135

    申请日：2013-08-01

    Applicant: OSRAM SYLVANIA INC.

    Inventor： SERRE, Jeffery ,  LENEF, Alan ,  SCOTCH, Adam

    IPC: H01L21/60

    Abstract: A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.

    Abstract translation: 描述了用于流体自组装的双焊料层，电气元件基板以及使用其的方法。 双焊料层包括设置在设置在电气元件基板的焊盘上的基础焊料层上的自组装焊料层。 自组装焊料具有低于第一温度的液相线温度，并且基础焊料的固相线温度高于第一温度。 在流体自组装方法期间，自组装焊料在第一温度下液化，以使电子组件粘附到基底。 在连接之后，将衬底从槽中移出并加热，使得基础焊料和自组装焊料结合以形成复合合金，该合金在衬底上的组件和焊料焊盘之间形成最终的电子焊料连接。

    TECHNIQUES FOR ADHERING SURFACE MOUNT DEVICES TO A FLEXIBLE SUBSTRATE
    7.
    发明公开
    TECHNIQUES FOR ADHERING SURFACE MOUNT DEVICES TO A FLEXIBLE SUBSTRATE 审中-公开
    芙蓉蓉

    公开(公告)号：EP3141091A1

    公开(公告)日：2017-03-15

    申请号：EP15725930.0

    申请日：2015-05-08

    Applicant: Osram Sylvania Inc.

    Inventor： SPEER, Richard ,  HAMBY, David ,  SCOTCH, Adam

    IPC: H05K1/18 ,  H05K3/32

    Abstract: Techniques are disclosed for attaching SMDs to a flexible substrate using conductive epoxy bond pads. Each bond pad includes a set of elongated strips of conductive epoxy that are applied and cured onto the flexible substrate in an adjacent and parallel fashion. The bond pads are used to attach SMDs to the flexible substrate and also provide the conductive contacts for a printed circuit. A circuit may be printed on the flexible substrate using conductive ink that partially covers the bond pads, leaving a portion of the pads exposed. A second layer or strip of conductive epoxy may be applied over and across the exposed portions of the bond pad strips in order to attach an SMD. The number, size, and orientation of the epoxy bond pad strips may be determined by the amount of bending the flexible substrate is expected to withstand and/or the orientation of the bend.

    Abstract translation: 公开了使用导电环氧树脂接合垫将SMD连接到柔性基板上的技术。 每个接合焊盘包括一组细长的导电环氧树脂条，其以相邻和平行的方式施加并固化到柔性基板上。 接合焊盘用于将SMD连接到柔性基板上，并且还为印刷电路提供导电触点。 可以使用部分覆盖接合焊盘的导电油墨将电路印刷在柔性基板上，从而使一部分焊盘露出。 导电环氧树脂的第二层或带可以施加在接合焊盘条的暴露部分上并跨越接合焊盘条的暴露部分，以便附接SMD。 环氧接合焊盘条的数量，尺寸和取向可以由柔性基板预期承受的弯曲量和/或弯曲的取向来确定。

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