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    METHOD FOR PRODUCING A SECURITY ELEMENT AND TRANSFER FILM
    1.
    发明申请
    METHOD FOR PRODUCING A SECURITY ELEMENT AND TRANSFER FILM 审中-公开
    生产安全元件和转移膜的方法

    公开(公告)号：WO2010072339A8

    公开(公告)日：2010-11-11

    申请号：PCT/EP2009008871

    申请日：2009-12-11

    Applicant: OVD KINEGRAM AG ,  STREB CHRISTINA ,  EPP SASCHA MARIO ,  HANSEN ACHIM

    Inventor： STREB CHRISTINA ,  EPP SASCHA MARIO ,  HANSEN ACHIM

    IPC: B42D15/10 ,  B42D15/00

    CPC classification number: B42D25/47 ,  B32B2425/00 ,  B42D25/00 ,  B42D25/29 ,  B42D25/328 ,  B42D25/475

    Abstract: The invention relates to a method for producing a security element and a transfer film. The transfer film comprises a base film (10) comprising a first carrier film (11) and single or multi-ply decal layer. A first adhesive layer (30) and a second carrier film (40) are applied to the surface of the first carrier film (11) facing away from the decal layer, such that the first adhesive layer (30) is disposed between the first carrier film (11) and the second carrier film (40). The first adhesive layer (30) is activated in a first area (31) covering at least one first partial area (21) of the base film (10), and the first adhesive layer is not activated, not provided, only partially provided, or deactivated in a second area (32) adjacent to said first area (31). The first carrier film (11) is then at least partially separated along the boundary line defining the at least one first partial area (21) and separating the at least one first partial area (21) from a second partial area (22) of the base film (10). A second part of the base film (10) comprising the second partial area (22) is pulled off of the second carrier film (40), wherein the base film (10) adheres to the second carrier film (40) in the at least one first partial area (21) due to the activated first adhesive layer, and a first part of the base film (10) comprising the at least one first partial area (21) remains on the second carrier film (40).

    Abstract translation: 本发明涉及一种用于制造安全元件的方法和一种转印膜。 转印膜具有基膜（10），该基膜具有第一载体膜（11）和单层或多层装饰层。 第一粘合层（30）和第二载体箔（40）被施加到从所述第一载体箔（11），的装饰层表面背向侧，使得第一背衬膜（11）和所述第二载体箔之间的第一粘结层（30）（ 40）被安排。 所述第一粘合层（30）覆盖在第一区域（31），其具有至少在基片（10）的第一部分（21）至少部分地激活和邻近于该区域（31）第二部分（32），所述第一 粘合剂层（30）但未激活，未提供，仅部分提供或禁用。 然后，沿着其限定所述至少一个第一部分（21）和从所述基片（10）的第二部分（22），所述至少一个第一部分（21）分离的边界线的第一载体箔（11）至少部分地切断。 在基片（10）的全面第二部分的第二部分（22）从第二载体膜（40），其中所述基膜（10）抽出，由于激活的第一粘合剂层（其中至少在所述第二载体箔的第一部分（21） 40）并且围绕所述至少一个第一部分区域（21）的所述基膜（10）的第一部分保留在所述第二载体膜（40）上。

    METHOD FOR PRODUCING A SECURITY ELEMENT AND TRANSFER FILM
    3.
    发明申请
    METHOD FOR PRODUCING A SECURITY ELEMENT AND TRANSFER FILM 审中-公开
    用于生产安全要素和转移膜

    公开(公告)号：WO2010072339A3

    公开(公告)日：2010-09-16

    申请号：PCT/EP2009008871

    申请日：2009-12-11

    Applicant: OVD KINEGRAM AG ,  STREB CHRISTINA ,  EPP SASCHA MARIO ,  HANSEN ACHIM

    Inventor： STREB CHRISTINA ,  EPP SASCHA MARIO ,  HANSEN ACHIM

    IPC: B42D15/10 ,  B42D15/00

    CPC classification number: B42D25/47 ,  B32B2425/00 ,  B42D25/00 ,  B42D25/29 ,  B42D25/328 ,  B42D25/475

    Abstract: The invention relates to a method for producing a security element and a transfer film. The transfer film comprises a base film (10) comprising a first carrier film (11) and single or multi-ply decal layer. A first adhesive layer (30) and a second carrier film (40) are applied to the surface of the first carrier film (11) facing away from the decal layer, such that the first adhesive layer (30) is disposed between the first carrier film (11) and the second carrier film (40). The first adhesive layer (30) is activated in a first area (31) covering at least one first partial area (21) of the base film (10), and the first adhesive layer is not activated, not provided, only partially provided, or deactivated in a second area (32) adjacent to said first area (31). The first carrier film (11) is then at least partially separated along the boundary line defining the at least one first partial area (21) and separating the at least one first partial area (21) from a second partial area (22) of the base film (10). A second part of the base film (10) comprising the second partial area (22) is pulled off of the second carrier film (40), wherein the base film (10) adheres to the second carrier film (40) in the at least one first partial area (21) due to the activated first adhesive layer, and a first part of the base film (10) comprising the at least one first partial area (21) remains on the second carrier film (40).

    Abstract translation: 本发明涉及一种方法，用于制造安全元件和转印膜。 转印膜包括具有第一载体箔（11）和一层或多层装饰层的基材膜（10）。 第一粘合层（30）和第二载体箔（40）被施加到从所述第一载体箔（11），的装饰层表面背向侧，使得第一背衬膜（11）和所述第二载体箔之间的第一粘结层（30）（ 40）被布置。 所述第一粘合层（30）覆盖在第一区域（31），其具有至少在基片（10）的第一部分（21）至少部分地激活和邻近于该区域（31）第二部分（32），所述第一 粘合剂层（30）不被激活，不设置，仅部分地设置在或关闭。 分离边界线，然后，所述第一载体箔（11）沿其被限定在所述至少一个第一部分（21）和从所述基片（10）的第二部分（22），所述至少一个第一部分（21）至少部分地切断。 在基片（10）的全面第二部分的第二部分（22）从第二载体膜（40），其中所述基膜（10）抽出，由于激活的第一粘合剂层（其中至少在所述第二载体箔的第一部分（21） 附着40）并保持全面的，所述至少第二载体箔（40），在基膜（10）的第一部分的第一部分（21）。

    METHOD FOR PRODUCING A SECURITY ELEMENT AND TRANSFER FILM
    4.
    发明专利
    METHOD FOR PRODUCING A SECURITY ELEMENT AND TRANSFER FILM 未知

    公开(公告)号：CA2745913C

    公开(公告)日：2017-01-17

    申请号：CA2745913

    申请日：2009-12-11

    Applicant: OVD KINEGRAM AG

    Inventor： STREB CHRISTINA ,  EPP SASCHA MARIO ,  HANSEN ACHIM

    IPC: B32B7/06 ,  B32B7/12 ,  B32B37/12 ,  B32B38/06 ,  B32B38/10 ,  B42D25/328 ,  B42D25/45 ,  C09D5/20

    Abstract: The invention relates to a method for producing a security element, and to a transfer film. The transfer film has a base film (10) having a first carrier film (11) and a single- or multi-ply decorative layer. A first adhesive layer (30) is applied to that surface of the first carrier film (11) which faces away from the decorative layer, and a second carrier film (40) is applied in such a way that the first adhesive layer (30) is arranged between the first carrier film (11) and the second carrier film (40). The first adhesive layer (30) is activated in a first region (31), which at least partly covers at least one first partial region (21) of the base film (10), and the first adhesive layer (30) is not activated, not provided, only partly provided or deactivated, however, in a second region (32) adjoining said region (31). The first carrier film (11) is then at least partly severed along the boundary line defining the at least one first partial region (21) and separating the at least one first partial region (21) from a second partial region (22) of the base film (10). A second part of the base film (10), said second part comprising the second partial region (22), is removed from the second carrier film (40), wherein, in the at least one first partial region (21) the base film (10) adheres to the second carrier film (40) on account of the activated first adhesive layer and a first part of the base film (10), said first part comprising the at least one first partial region (21), remains on the second carrier film (40).

    Kartenkörper
    5.
    发明专利
    Kartenkörper 未知

    公开(公告)号：DE102010026152A1

    公开(公告)日：2012-01-05

    申请号：DE102010026152

    申请日：2010-07-05

    Applicant: OVD KINEGRAM AG

    Inventor： EPP SASCHA MARIO ,  PETERS JOHN ANTHONY DR ,  STAUB RENE ,  TOBERER ORVY EMANUEL

    IPC: G06K19/077

    Abstract: Die Erfindung betrifft einen Kartenkörper (9) zum Herstellen einer Chipkarte (1) und ein Verfahren zum Herstellen einer Chipkarte (1). Der Kartenkörper (9) umfasst eine im Kartenkörper (9) eingebettete Antenne (2) mit Leiterbahnen (6). Mindestens eine der Leiterbahnen (6) ist bereichsweise als mindestens eine Aufwölbung (16) ausgebildet ist. Zumindest ein Teil der mindestens einen Aufwölbung (16) ist in einem vorgegebenen räumlichen Bereich des Kartenkörpers (9) angeordnet, der als eine Ausnehmung (11) zur Aufnahme eines Chipmoduls (13) vorgesehen ist. Das Verfahren umfasst folgende Schritte: Ausformen einer Ausnehmung (11) in dem Kartenkörper (9) zur Aufnahme eines Chipmoduls (13), das an einer Oberfläche (14) erste Kontaktflächen (15) aufweist, derart, dass beim Ausformen zumindest ein Teil der mindestens einen Aufwölbung (16) entfernt wird und dadurch mindestens eine zweite Kontaktfläche (19) ausgebildet wird, die in einer die Ausnehmung (11) begrenzenden Oberfläche (12) des Kartenkörpers (9) liegt; und Anordnen des Chipmoduls (13) in der Ausnehmung (11) derart, dass eine elektrische Verbindung zwischen der mindestens einen zweiten Kontaktfläche (19) und einer der ersten Kontaktflächen (15) ausgebildet wird.

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