公开(公告)号：SG194064A1

公开(公告)日：2013-11-29

申请号：SG2013073978

申请日：2012-04-05

Applicant: PANASONIC CORP

Inventor： OKA HIROAKI ,  NAKATANI MASAYA ,  HAYAMA MASAAKI ,  TANEMURA AKINA

Abstract: A diagnosis kit is configured to detect whether or not an extraneous5 organism exists in a red blood cell by using a biological specimen containing the red blood cell, and a stain solution capable of staining nucleic acid. The kit includes at least one diagnosis plate. The diagnosis plate includes a first chamber configured to store the stain solution and to have the biological specimen injected into the stain solution, a channel connected to the first10 chamber, and a test plate connected to the channel. A second chamber is connected with the test plate. The channel is configured to extract the red blood cell. The second chamber can collect a part of the biological specimen and a part of the stain solution. This diagnosis kit can detect extraneous organisms in the red blood cells easily with a small amount of the biological15 specimen. Figure 2

公开(公告)号：EP1233528A4

公开(公告)日：2009-07-22

申请号：EP01974706

申请日：2001-10-05

Applicant: PANASONIC CORP

Inventor： SATO YUKI ,  TSURUNARI TETSUYA ,  MURAKAMI KOZO ,  OMORI YOSHIHARU ,  HAYAMA MASAAKI

IPC: H01L25/00 ,  H01P1/10 ,  H03H9/25 ,  H03H9/72 ,  H03K17/00 ,  H04B1/40 ,  H04B1/48 ,  H04B1/50

CPC classification number: H04B1/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/19105 ,  H04B1/406 ,  H04B1/48 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A small-sized high-frequency composite switch module for selecting one of transmission/reception signals in frequency bands. The module comprises a multilayer body including a dielectric layer, a demultiplexing/multiplexing circuit, a switch circuit, a low-pass filter (LPF), a conductive pattern forming at least one of the demultiplexing/multiplexing circuit, the switch circuit, and the LPF and provided on the dielectric layer, a surface acoustic wave (SAW) filter mounted on the multilayer body, a cap portion provided on the surface of the SAW filter and adapted for hermetically sealing the space formed by the cap portion and enabling surface acoustic wave vibration, and a semiconductor switch element mounted on the multilayer body and constituting a part of the switch circuit.

公开(公告)号：EP1365451A4

公开(公告)日：2010-06-23

申请号：EP02801549

申请日：2002-10-11

Applicant: PANASONIC CORP

Inventor： HAYAMA MASAAKI ,  HIGASHITANI HIROSHI ,  YASUHO TAKEO ,  KATSUMATA MASAAKI ,  HANDA HIROYUKI

IPC: H05K3/46 ,  G06K19/077 ,  H01F17/00 ,  H01F27/40 ,  H01L21/48 ,  H01L23/538 ,  H01L25/00 ,  H05K1/00 ,  H05K1/16 ,  H05K1/18 ,  H01L23/12

CPC classification number: H01L21/4857 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01F17/0013 ,  H01F27/40 ,  H01F2017/0026 ,  H01L23/5388 ,  H01L23/645 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/086 ,  H05K2201/10416 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/01005

公开(公告)号：EP1478023A4

公开(公告)日：2008-12-31

申请号：EP03705323

申请日：2003-02-19

Applicant: PANASONIC CORP

Inventor： HIGASHITANI HIROSHI ,  YASUHO TAKEO ,  HAYAMA MASAAKI

IPC: H05K1/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H05K3/46

CPC classification number: G01R31/02 ,  G01R31/28 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/16 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0723 ,  H05K2203/063 ,  H05K2203/1147 ,  H05K2203/167 ,  H05K2203/171 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A module part, comprising mounting parts (1), wherein a circuit substrate (3) having one or more mounting parts (1) mounted on at least one surface thereof and a connection circuit substrate (5) having recessed parts (4) or holes for fitting the mounting parts (1) therein at portions corresponding to at least one or more mounting parts (1) mounted on one surface of the circuit substrate (3) are formed integrally with each other by stacking, whereby the reliability of an inter-layer connection can be assured, a plurality of mounting parts can be accurately and densely incorporated therein, a high reliability can be provided, and a size can be reduced.

公开(公告)号：JP2014232055A

公开(公告)日：2014-12-11

申请号：JP2013113447

申请日：2013-05-29

Applicant: 株式会社島津製作所 ,  Shimadzu Corp ,  パナソニック株式会社 ,  Panasonic Corp

Inventor： SHIMADA TAKASHI ,  AOKI TOMOKAGE ,  SATO TAKAAKI ,  NAKATANI MASAYA ,  HAYAMA MASAAKI

IPC: G01N27/64 ,  G01N27/62

CPC classification number: H01J49/0418 ,  G01N33/6851

Abstract: 【課題】MALDI質量分析において、測定対象物質やマトリックスの不均一性に起因する検出精度の低下を最小限に抑えることのできる測定基板を提供する。【解決手段】MALDI質量分析用測定基板10を、上面を有するベース板11と、前記上面の少なくとも一部に敷設された、配向方向が前記上面の面内にある高配向性グラファイトシートから成るカーボンシート12で構成する。高配向性グラファイトシートは面内方向において高い熱伝導率を有し、それに垂直な方向には低い熱伝導率を有するため、レーザ照射によりマトリックス物質において生成された熱エネルギーは、前記高配向性グラファイトシートを通じて速やかに面内方向に伝達される。これにより、レーザ照射箇所において熱エネルギーは均一となり、マトリックス物質による測定対象試料の昇華及びイオン化の反応が均等に行われるようになって、検出精度の低下が防止される。【選択図】図1

Abstract translation: 要解决的问题：提供一种能够使MALDI质量分析中测量对象材料和基质的不均匀性导致的检测精度的劣化最小化的测量板。解决方案：用于MALDI质量分析的测量板10由以下部分构成：基板 11具有顶面; 以及由顶板的平面中的取向方向为高取向性的石墨片构成的碳片12，至少布置在顶面的一部分。 由于高取向性石墨片在面内方向上具有高导热性，并且在垂直于面内方向的方向上具有低导热性，所以通过激光照射在基体材料中产生的热能迅速地在内部传播， 平面方向穿过高取向石墨片。 因此，激光照射部的热能变得均匀，能够均匀地进行基体材料的测定对象样品的升华和离子化的反应，能够防止检测精度的恶化。

公开(公告)号：JP2013076625A

公开(公告)日：2013-04-25

申请号：JP2011216347

申请日：2011-09-30

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： SATO YUKI ,  YAMAMOTO KENJU ,  HAYAMA MASAAKI

IPC: G01N29/12 ,  G01N29/00

Abstract: PROBLEM TO BE SOLVED: To improve the sensing accuracy of an elastic wave sensor.SOLUTION: An elastic wave sensor 1 includes: a piezoelectric body 2; a plurality of electrodes 3 and 4 formed on the piezoelectric body 2; a reaction portion 5 formed on a transmission passage between the plurality of electrodes 3 and 4 on the piezoelectric body 2; and a detecting portion (not shown) for detecting characteristics of elastic waves excited by the electrode 3. The reaction portion 5 has a fiber-shape. By the characteristics, a surface area of the reaction portion 5 is enlarged, and the mass of a detection object adsorbed by the reaction portion 5 is increased. Therefore, the sensing accuracy of the elastic wave sensor 1 is improved.

Abstract translation: 要解决的问题：提高弹性波传感器的感测精度。 解决方案：弹性波传感器1包括：压电体2; 形成在压电体2上的多个电极3和4; 形成在压电体2上的多个电极3和4之间的传输路径上的反应部分5; 以及用于检测由电极3激发的弹性波的特性的检测部分（未示出）。反应部分5具有纤维形状。 通过特征，反应部5的表面积增大，被反应部5吸附的检测体的质量增加。 因此，提高了弹性波传感器1的感测精度。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2010067989A

公开(公告)日：2010-03-25

申请号：JP2009261639

申请日：2009-11-17

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： HAYAMA MASAAKI ,  TSUNEOKA MICHIO ,  KAWAMOTO EIJI ,  MURAKAMI KAZUHIRO ,  HASHIMOTO KOJI ,  ANPO TAKEO

IPC: H05K9/00 ,  H01L21/60 ,  H01L23/31 ,  H01L23/552 ,  H01L23/60 ,  H05K1/02 ,  H05K3/28

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/60 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H01L2224/29075 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To reduce the height of a module component and realize full shielding effects. SOLUTION: The module component includes a package component 3, comprising an electronic component mounted on a circuit board 1, a seal 4 for sealing the package component 3 with resin and a metallic film 2 covering the surface of the seal 4. An end surface of a ground pattern 5 is exposed, on a side face substantially the same as a side face of the seal of four outer peripheral faces of the circuit board 1, to make the metallic film 2 conductive with the end surface of the ground pattern 5, and the thin and reliably shielded module component thus constituted is provided. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：降低模块组件的高度，实现全屏蔽效果。 解决方案：模块组件包括一个封装组件3，它包括一个安装在电路板1上的电子元件，一个用树脂密封封装组件3的密封件4和一个覆盖密封件4表面的金属膜2。 接地图案5的端面在与电路板1的四个外周面的密封件的侧面基本相同的侧面上露出，以使金属膜2与接地图案的端面导通 并且提供如此构成的薄且可靠地屏蔽的模块部件。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2013092446A

公开(公告)日：2013-05-16

申请号：JP2011234886

申请日：2011-10-26

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： HAYAMA MASAAKI ,  KAMIGUCHI HIROTERU ,  OSHIMA AKIYOSHI

IPC: G01N29/24 ,  G01N29/02

Abstract: PROBLEM TO BE SOLVED: To provide an acoustic wave sensor with an improved sensing accuracy.SOLUTION: An acoustic wave sensor 1 includes: a piezoelectric member 2; plural electrodes 3 and 4 formed on the piezoelectric member 2; a reaction part 5 formed on a propagation path between the plural electrodes 3 and 4 on the piezoelectric member 2; and a detection section (not shown) that detects the characteristics of elastic waves excited by the electrode 3. The reaction part 5 is composed of plural particles integrally combined with each other being piled up to branch from each other. With this, a larger surface of the reaction part 5 is ensured, and the amount of detection target matters adsorbed by the reaction part 5 increases; thus an improved sensing accuracy of the acoustic wave sensor 1 is achieved.

Abstract translation: 要解决的问题：提供具有改进的感测精度的声波传感器。 解决方案：声波传感器1包括：压电元件2; 形成在压电元件2上的多个电极3和4; 形成在压电构件2上的多个电极3和4之间的传播路径上的反应部分5; 以及检测由电极3激发的弹性波的特性的检测部（未示出）。反应部5由彼此一体地组合的多个颗粒组成，彼此堆积以分支。 由此，确保了反应部5的较大的表面，并且由反应部5吸附的检测对象物的量增加; 从而实现了声波传感器1的改进的感测精度。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2010080968A

公开(公告)日：2010-04-08

申请号：JP2009261640

申请日：2009-11-17

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： HAYAMA MASAAKI ,  TSUNEOKA MICHIO ,  KAWAMOTO EIJI ,  MURAKAMI KAZUHIRO ,  HASHIMOTO KOJI ,  ANPO TAKEO

IPC: H05K9/00 ,  H01L21/56 ,  H01L21/60 ,  H01L23/28 ,  H01L23/31 ,  H01L23/552 ,  H01L23/60 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K3/28

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/60 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H01L2224/29075 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To achieve a low profile and adequate shield effect in a module component. SOLUTION: A method of manufacturing a module component includes: a step of loading mounted components 3 composed of electronic components on a circuit board 1; a step of sealing these mounted components 3 with a resin to form a sealed body 4; a step of exposing a grounding pattern 5 on four sides of an outer periphery of the circuit board, which are almost the same as the sides of the sealed body 4; a step of covering surfaces of the sealed body 4 with a metal film 2; and a step of electrically connecting the metal film 2 and the grounding pattern 5. With this method, a thin and securely shielded module component is provided. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了在模块组件中实现低调和足够的屏蔽效果。 解决方案：一种制造模块部件的方法包括：将由电子部件构成的安装部件3装载在电路板1上的步骤; 用树脂密封这些安装部件3以形成密封体4的步骤; 将接地图案5暴露在与密封体4的侧面几乎相同的电路板的外周的四边上的步骤; 用金属膜2覆盖密封体4的表面的步骤; 以及电连接金属膜2和接地图案5的步骤。利用该方法，提供了薄且牢固地屏蔽的模块部件。 版权所有（C）2010，JPO＆INPIT