公开(公告)号：DE602004030081D1

公开(公告)日：2010-12-30

申请号：DE602004030081

申请日：2004-09-27

Applicant: PANASONIC CORP

Inventor： SAITO RYUICHI ,  KAGATA HIROSHI ,  KATSUMATA MASAAKI

IPC: H01L23/12 ,  H05K3/28 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H03H9/10 ,  H05K1/03 ,  H05K3/30

公开(公告)号：DE60239133D1

公开(公告)日：2011-03-24

申请号：DE60239133

申请日：2002-07-11

Applicant: PANASONIC CORP

Inventor： HASHIMOTO AKIRA ,  KATSUMATA MASAAKI

IPC: H05K3/20 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

公开(公告)号：GB2437465B

公开(公告)日：2010-11-17

申请号：GB0714966

申请日：2006-02-01

Applicant: MATSUSHITA ELECTRIC IND CO LTD ,  PANASONIC CORP

Inventor： SUGAYA YASUHIRO ,  YAMAMOTO YOSHIYUKI ,  ASAHI TOSHIYUKI ,  MIKI KATSUMASA ,  KATSUMATA MASAAKI ,  SAITOU YOSHIYUKI ,  NAKAYAMA TAKESHI

IPC: H05K1/18 ,  H01L23/31 ,  H01L23/498

Abstract: A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.

公开(公告)号：EP2571340A4

公开(公告)日：2014-01-08

申请号：EP12776691

申请日：2012-04-19

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KATSUMATA MASAAKI ,  KONDOU TOSHIKAZU

IPC: H05K1/09 ,  B05C11/10 ,  H01B1/20 ,  H01B13/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01B1/02 ,  H01B1/12 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4084 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

公开(公告)号：EP2571341A4

公开(公告)日：2013-12-11

申请号：EP12777429

申请日：2012-04-19

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KONDOU TOSHIKAZU ,  KATSUMATA MASAAKI

IPC: H05K1/09 ,  B05C11/10 ,  H01B1/20 ,  H01B13/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01B1/02 ,  H01B1/12 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4084 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

公开(公告)号：EP2590488A4

公开(公告)日：2013-10-23

申请号：EP12816628

申请日：2012-07-24

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KATSUMATA MASAAKI ,  KONDOU TOSHIKAZU

IPC: H05K3/40 ,  B05C11/10 ,  H01B13/00 ,  H05K1/09 ,  H05K3/46

CPC classification number: H05K3/0094 ,  H01B1/20 ,  H01B1/22 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.

公开(公告)号：EP2164311A4

公开(公告)日：2011-03-23

申请号：EP08763924

申请日：2008-05-28

Applicant: PANASONIC CORP

Inventor： KITA TAKAYUKI ,  KATSUMATA MASAAKI ,  NAKAMURA TADASHI ,  FUKASAWA KOTA ,  FURUGOORI KAZUHIRO

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/183 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/19105 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T156/1062 ,  Y10T428/24273 ,  Y10T428/24893 ,  Y10T428/24917 ,  H01L2224/0401

Abstract: An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.

公开(公告)号：EP1365451A4

公开(公告)日：2010-06-23

申请号：EP02801549

申请日：2002-10-11

Applicant: PANASONIC CORP

Inventor： HAYAMA MASAAKI ,  HIGASHITANI HIROSHI ,  YASUHO TAKEO ,  KATSUMATA MASAAKI ,  HANDA HIROYUKI

IPC: H05K3/46 ,  G06K19/077 ,  H01F17/00 ,  H01F27/40 ,  H01L21/48 ,  H01L23/538 ,  H01L25/00 ,  H05K1/00 ,  H05K1/16 ,  H05K1/18 ,  H01L23/12

CPC classification number: H01L21/4857 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01F17/0013 ,  H01F27/40 ,  H01F2017/0026 ,  H01L23/5388 ,  H01L23/645 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/086 ,  H05K2201/10416 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/01005

公开(公告)号：EP1648028A4

公开(公告)日：2010-05-26

申请号：EP05737236

申请日：2005-04-28

Applicant: PANASONIC CORP

Inventor： TSUNEOKA MICHIAKI ,  SUGAYA YASUHIRO ,  KATSUMATA MASAAKI ,  FUJIWARA JOJI

IPC: H01L23/00 ,  H05K3/46 ,  H01L23/12 ,  H01L23/28 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K1/186 ,  H01L24/97 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0263 ,  H05K1/167 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/4614 ,  H05K2201/0715 ,  H05K2203/061

公开(公告)号：JP2013004937A

公开(公告)日：2013-01-07

申请号：JP2011137977

申请日：2011-06-22

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： KATSUMATA MASAAKI ,  MATSUOKA YASUYUKI ,  KAWAUCHI KOJI

IPC: H01L23/00 ,  H01L23/12 ,  H05K1/02

Abstract: PROBLEM TO BE SOLVED: To solve a conventional problem such that, in a high density mounting board sheet including plural pieces of high density mounting board and a peripheral frame, a marking method is used for discriminating an acceptable part suitable for mounting semiconductor chips and electronic components, etc. and a part having a problem which is not suitable for mounting those parts; but since the marking method is easily affected by scattered light from a peripheral portion of a plating layer causing a problem for automatic optical recognition.SOLUTION: In a high density mounting board sheet 13 including plural pieces of high density mounting boards 11 and a peripheral frame 12, a discrimination mark 15 for discriminating an acceptable part suitable for mounting semiconductor chips and electronic components and a part having a problem which is not suitable for mounting those parts is formed with a wiring 19, and peripheral portion of the wiring 19 is coated with a resist 17 to thereby reduce scattered light 32 from the peripheral portion. Thus, the optical automatic recognition performance is enhanced.

Abstract translation: 要解决的问题为了解决常规问题，在包括多个高密度安装板和周边框架的高密度安装板片材中，使用标记方法来区分适合于安装半导体的可接受部件 芯片和电子部件等，以及具有不适合安装这些部件的问题的部分; 但是由于标记方法容易受到来自电镀层的周边部分的散射光的影响，导致自动光学识别的问题。 解决方案：在包括多个高密度安装板11和周边框架12的高密度安装板片13中，用于区分适合于安装半导体芯片和电子部件的可接受部分的鉴别标记15和具有 不适于安装这些部件的问题由布线19形成，并且布线19的周边部分涂覆有抗蚀剂17，从而从周边部分减少散射光32。 因此，增强了光学自动识别性能。 版权所有（C）2013，JPO＆INPIT