公开(公告)号：EP2451259A4

公开(公告)日：2013-07-03

申请号：EP10820151

申请日：2010-09-30

Applicant: PANASONIC CORP

Inventor： KASHIWAGI TAKAFUMI ,  SAKAI YUKIO ,  TADA NOBUHIRO ,  HIRUMA TAKAYUKI

IPC: H05K3/46 ,  H01L23/00 ,  H01L23/28

CPC classification number: H05K3/284 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2203/1316 ,  Y10T29/4913 ,  H01L2224/81 ,  H01L2924/00012

公开(公告)号：JP2011159786A

公开(公告)日：2011-08-18

申请号：JP2010020043

申请日：2010-02-01

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： KASHIWAGI TAKAFUMI ,  SAKAI YUKIO ,  TADA NOBUHIRO

IPC: H05K9/00 ,  H05K1/11 ,  H05K3/40

CPC classification number: H01L2924/01029

Abstract: PROBLEM TO BE SOLVED: To provide a circuit module that comprises a circuit board, an electronic component mounted on a wiring pattern provided to a surface layer of the circuit board, an insulating resin for sealing them, a conductive resin layer provided on the insulating resin and made of metal paste etc., and so on, and can have excellent shielding effect even with a thin layer.
SOLUTION: The module 101 includes a substrate portion 103, the electronic component 104, a mold portion 102 sealing them, and a shield portion 112 covering upward inner layer wiring 107 exposed in a section thereof while having a first corner slope portion 110, downward inner layer wiring 109 exposed while having a second corner slope portion 111, and a surface of the mold portion 102 and composed of a metal film formed by sputtering, and the shield portion 112 has a base electrode layer 116 of at least 0.01 to 0.50 μm in thickness and a copper electrode layer 117 of 0.1 to 10 μm in thickness consisting principally of copper.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种电路模块，其包括电路板，安装在设置在电路板的表面层上的布线图案上的电子部件，用于密封它们的绝缘树脂，设置在 绝缘树脂，金属糊等制成，即使是薄层也可以具有优异的屏蔽效果。 解决方案：模块101包括基板部分103，电子部件104，密封它们的模具部分102以及覆盖在其一部分中暴露的向上内层布线107的屏蔽部分112，同时具有第一拐角斜面部分110 ，具有第二角部倾斜部111而露出的向下内层布线109以及由溅射形成的金属膜构成的模具部102的表面，屏蔽部112具有至少0.01〜 厚度为0.50μm的铜电极层117的厚度为0.1〜10μm，主要由铜构成。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2011159788A

公开(公告)日：2011-08-18

申请号：JP2010020045

申请日：2010-02-01

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： TADA NOBUHIRO ,  KASHIWAGI TAKAFUMI ,  SAKAI YUKIO

IPC: H01L23/00 ,  H01L23/28 ,  H05K1/02 ,  H05K3/28

CPC classification number: H01L24/97 ,  H01L21/568 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/1531 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: PROBLEM TO BE SOLVED: To provide a means of stabilizing electric connections of a circuit board, an electronic component mounted on a wiring pattern provided in a surface layer of the circuit board, an insulating resin sealing them, and a metal film provided on the insulating resin and constituting a shield.
SOLUTION: A module 101 includes: a substrate portion 103; the electronic component 104; a mold portion 102 sealing them; a shield portion 112 which covers upward inner layer wiring 107 exposed in a cross-section thereof while having a first shear droop portion 110, downward inner layer wiring 109 exposed while having a second shear droop portion, and a surface of the mold portion 102 and which is composed of a metal film formed by sputtering; and a resin portion 118 covering more than a part of the shield portion 112, the module 101 has enhanced reliability by covering grooves 116 formed on side faces of the substrate portion 103 with the resin portion 118.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种稳定电路板的电连接的装置，安装在设置在电路板的表面层中的布线图案上的电子部件，密封它们的绝缘树脂和提供的金属膜 在绝缘树脂上形成屏蔽。 解决方案：模块101包括：基板部分103; 电子部件104; 密封它们的模具部分102; 遮盖部分112，其覆盖在其内部暴露于其横截面的向上的内层布线107，同时具有第一剪切下垂部分110，向下的内层布线109，同时具有第二剪切下垂部分，以及模具部分102的表面和 其由溅射形成的金属膜构成; 以及覆盖屏蔽部112的一部分以上的树脂部118，通过在树脂部118上覆盖形成在基板部103的侧面的槽116，模块101具有提高的可靠性。（C）2011 ，JPO＆INPIT

公开(公告)号：JP2011159787A

公开(公告)日：2011-08-18

申请号：JP2010020044

申请日：2010-02-01

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： KASHIWAGI TAKAFUMI ,  SAKAI YUKIO ,  TADA NOBUHIRO

IPC: H05K3/46 ,  H01L23/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  H05K9/00

CPC classification number: H01L2224/16225 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To solve the problem that a conventional circuit module comprising a circuit board, an electronic component mounted on a wiring pattern provided to a surface layer of the circuit board, an insulating resin for sealing them, a conductive resin layer provided on the insulating resin and made of metal paste and the like can not have necessary shielding properties. SOLUTION: A module 101 includes a substrate portion 103, an electronic component 104, a mold portion 102 sealing them, and a shield portion 112 covering upward inner layer wiring 107 exposed in a section thereof while having a first corner slope portion 110, downward inner layer wiring 109 exposed while having a second corner slope portion 111, and a surface of the mold portion 102 and composed of a metal film formed by sputtering, and the second corner slope portion 111 is made larger in size, area, etc., than the first corner slop portion 110 to enhance shielding characteristics on a back-electrode-108 side of the substrate portion 103 where the shield portion 112 is likely to be less in thickness. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题为了解决包括电路板的常规电路模块，安装在设置在电路板的表面层上的布线图案上的电子部件，用于密封它们的绝缘树脂的问题，导电树脂 绝缘树脂上设置的由金属糊等制成的层不能具有必要的屏蔽性。 解决方案：模块101包括基板部分103，电子部件104，密封它们的模具部分102以及覆盖在其一部分中暴露的向上内层布线107的屏蔽部分112，同时具有第一角部倾斜部分110 ，具有第二拐角倾斜部分111的暴露的向下的内层布线109以及由溅射形成的金属膜构成的模具部分102的表面，并且使第二拐角斜面部分111的尺寸，面积等变得更大 比第一角落部分110，以增强屏蔽部分112可能较小厚度的基板部分103的背面电极108侧的屏蔽特性。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2011077430A

公开(公告)日：2011-04-14

申请号：JP2009229433

申请日：2009-10-01

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： KASHIWAGI TAKAFUMI ,  SAKAI YUKIO ,  HIRUMA TAKAYUKI

IPC: H05K3/46 ,  H01L23/02 ,  H01L23/24 ,  H01L23/28 ,  H01L25/00

CPC classification number: H01L2224/16225 ,  H01L2924/01029

Abstract: PROBLEM TO BE SOLVED: To provide a module capable of solving a problem such that there may occur whitened portions and cracks in dividing when a module part is intended to manufacture by dividing a sealing structure body, which is composed of a circuit substrate, parts mounted on the circuit substrate, and a sealing portion sealing them, into pluralities by dicing. SOLUTION: The module 101 includes a circuit substrate 110 in which copper foils 106 of one or more layers are built in by impregnating an epoxy resin into a core material, a sealing portion 109 sealing one or more electronic parts 107 mounted on the circuit substrate 110 and the electronic parts 107 on the circuit substrate 110, and a metal film 102 covering a side surface of the circuit substrate 110 and a surface of the sealing portion 109. The sealing portion 109 and the circuit substrate 110 are approximately same square, and a part of the copper foil 106 exposes at a plurality of side surfaces of the circuit substrate 109. A width of an exposed portion 111 of the copper foil 106 is 200 μm or less, and the copper foil 106 and the metal film 102 are electrically connected through the exposed portion 111, thereby occurrence of whitening or cracks can be prevented. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够解决问题的模块，当通过将由电路基板构成的密封结构体分开来制造模块部分时，可能发生白化部分和分裂时的裂纹 ，安装在电路基板上的部件和通过切割将其密封的密封部分多个。 解决方案：模块101包括电路基板110，其中通过将环氧树脂浸渍到芯材中而构建一层或多层铜箔106;密封部分109，其密封安装在该芯材上的一个或多个电子部件107 电路基板110和电路基板110上的电子部件107以及覆盖电路基板110的侧面的金属膜102和密封部109的表面。密封部109和电路基板110大致相同的方形 铜箔106的一部分在电路基板109的多个侧面露出。铜箔106的露出部111的宽度为200μm以下，铜箔106和金属膜102 通过暴露部分111电连接，从而可以防止发白或发生裂纹。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010258137A

公开(公告)日：2010-11-11

申请号：JP2009104970

申请日：2009-04-23

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： KASHIWAGI TAKAFUMI ,  TADA NOBUHIRO ,  SAKAI YUKIO ,  NAKAGUCHI MASAHISA

IPC: H01L23/02 ,  H01L21/60 ,  H01L23/08

CPC classification number: H01L2224/16225

Abstract: PROBLEM TO BE SOLVED: To solve such problems that the electrical characteristics of a high-frequency module will change if resin seal is performed to the module, as the resin contacts semiconductor components and wiring on a circuit board; and that high shielding property cannot be obtained by a shielding method to add a magnetic body to the sealing resin. SOLUTION: This high-frequency module includes a semiconductor component mounted on a circuit board in a facedown manner, and the front surface wiring connected to the semiconductor component, both of which are covered with a first sealing material and a conductive material; and space is formed between the semiconductor component and the circuit board. The conductive material is configured to connect to a ground wiring pattern on the circuit board through a hole formed in the first sealing material, and the first sealing material and the conductive material are covered with a second sealing material. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了解决如果对模块执行树脂密封，则高频模块的电气特性将发生变化的问题，因为树脂与半导体部件和电路板上的布线接触; 并且通过用于向密封树脂添加磁性体的屏蔽方法不能获得高屏蔽性。 解决方案：该高频模块包括以面向下方式安装在电路板上的半导体部件和连接到半导体部件的前表面布线，两者均被第一密封材料和导电材料覆盖; 并且在半导体部件和电路基板之间形成空间。 导电材料被配置为通过形成在第一密封材料中的孔连接到电路板上的接地布线图案，并且第一密封材料和导电材料被第二密封材料覆盖。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010212410A

公开(公告)日：2010-09-24

申请号：JP2009056198

申请日：2009-03-10

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： IWAMIYA HIROKI ,  SAKAI YUKIO

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/12 ,  H01L25/00

CPC classification number: H01L24/97 ,  H01L23/552 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a module part having high reliability on an electrical connection between a ground pattern on the underside of a circuit board and a metallic film.
SOLUTION: The module part is equipped with: first circuit boards 104; parts 108 mounted on the first circuit board 104, sealing 109 sealing the parts 108 on the first circuit board 104; and the metallic film 101 coating the side face of the first circuit board 104 and the periphery of the sealing 109. The metallic film 101 is connected electrically to wiring 106 exposed from the side faces of the first circuit board 104 while being thinned towards the inside from the outside of the first circuit board 104 on a first ground pattern 110 formed on two sides or more in the outer periphery of the underside of the first circuit board 104.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供在电路板的底面上的接地图案和金属膜之间的电连接上具有高可靠性的模块部件。

解决方案：模块部件配备有：第一电路板104; 安装在第一电路板104上的部分108，密封第一电路板104上的部分108的密封件109; 并且金属膜101涂覆第一电路板104的侧面和密封件109的周边。金属膜101电连接到从第一电路板104的侧面露出的布线106，同时向内侧变薄 从第一电路板104的外部在形成在第一电路板104的下侧的外侧上的两侧或更多侧的第一接地图案​​110上。（C）2010，JPO和INPIT

公开(公告)号：JP2009123869A

公开(公告)日：2009-06-04

申请号：JP2007295429

申请日：2007-11-14

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： IWAMIYA HIROKI ,  FUJIWARA SHIROJI ,  SAKAI YUKIO

IPC: H01L23/12 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide a module using a spacer substrate with high reliability in electric connection with an external substrate.
SOLUTION: The module 1 includes a base substrate 2, a first circuit component 3 mounted on the base substrate 2, and a plurality of substrates including a first spacer substrate 4, a second spacer substrate 5, a third spacer substrate 6 and a fourth spacer substrate 7 provided on the base substrate 2 and around the first circuit component 3. In addition, a plurality of the spacer substrates 4-7 are provided having intervals 8 between each other. The module 1 thus constituted allows resin to be injected through the interval 8 into a cavity surrounded by the spacer substrates 4-7, the base substrate 2 and the external substrate after the external substrate is mounted.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种使用具有与外部基板电连接的高可靠性的间隔基板的模块。 解决方案：模块1包括基底基板2，安装在基底基板2上的第一电路部件3和多个基板，包括第一间隔基板4，第二间隔基板5，第三间隔基板6和 设置在基底基板2上并围绕第一电路部件3的第四间隔基板7.此外，多个间隔基板4-7设置成彼此间隔8。 如此构成的模块1，在安装外部基板之后，通过间隔8将树脂注入到由间隔基板4-7，基底基板2和外部基板包围的空腔中。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2011159785A

公开(公告)日：2011-08-18

申请号：JP2010020042

申请日：2010-02-01

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： KASHIWAGI TAKAFUMI ,  SAKAI YUKIO ,  TADA NOBUHIRO

IPC: H05K3/46 ,  H01L25/00 ,  H05K1/02 ,  H05K3/00

CPC classification number: H01L2224/16225 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To solve the problem that a conventional circuit module comprising a circuit board, an electronic component mounted on a wiring pattern provided to a surface layer of the circuit board, an insulating resin for sealing them, a conductive resin layer provided on the insulating resin and made of metal paste etc., and so on can not have necessary shielding properties.
SOLUTION: A module 101 includes a substrate portion 103, an electronic component 104, a mold portion 102 sealing them, and a shield portion 112 covering upward inner layer wiring 107 exposed in a section thereof while having a first corner slope portion 110, downward inner layer wiring 109 exposed while having a second corner slope portion, and a surface of the mold portion 102 and formed by sputtering, and then has higher shielding properties and reliability by providing a plurality of grooves 116 on a side surface of the substrate portion 103 and filling more than some of the grooves 116 with part of the downward inner layer wiring 109.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题为了解决包括电路板的常规电路模块，安装在设置在电路板的表面层上的布线图案上的电子部件，用于密封它们的绝缘树脂的问题，导电树脂 绝缘树脂上设置的由金属糊等制成的层不能具有必要的屏蔽性能。 解决方案：模块101包括基板部分103，电子部件104，密封它们的模具部分102以及覆盖在其一部分中暴露的向上内层布线107的屏蔽部分112，同时具有第一角部倾斜部分110 ，具有第二拐角部分的暴露的向下的内层布线109以及通过溅射形成的模具部分102的表面，然后通过在基板的侧表面上设置多个凹槽116而具有更高的屏蔽性和可靠性 部分103并且用一部分向下的内层布线109填充比一些凹槽116.版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2009021327A

公开(公告)日：2009-01-29

申请号：JP2007181926

申请日：2007-07-11

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： SAKAI YUKIO ,  IWAMIYA HIROKI

IPC: H05K1/14 ,  H05K1/02

Abstract: PROBLEM TO BE SOLVED: To enhance electric isolation between an electronic component and a circuit board of a circuit board device.
SOLUTION: A circuit board device 7 includes a motherboard 8, the electronic component 9 disposed on the motherboard 8, a spacer 10 disposed on the motherboard 8 and at a periphery of the electronic component 9, and the circuit board 11 disposed on the space 10 and above the electronic component 9, wherein the spacer 10 is larger in height than the electronic component 9 and a gap 12 is formed between a top surface of the electronic component 9 and a reverse surface of the circuit board 11. With this configuration, the circuit board device 7 has the gap 12 between the reverse surface of the circuit board 11 and the top surface of the electronic component 9, so the electric isolation between the electronic component 9 and circuit board 11 can be enhanced.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了增强电路板装置的电子部件和电路板之间的电隔离。 电路板装置7包括母板8，设置在母板8上的电子部件9，设置在母板8上并位于电子部件9周边的间隔件10，以及布置在电路板11上的电路板11 电子部件9上方的空间10，其中间隔件10的高度高于电子部件9，并且在电子部件9的顶表面和电路板11的反面之间形成间隙12.由此， 电路板装置7在电路板11的背面与电子部件9的上表面之间具有间隙12，能够提高电子部件9与电路基板11之间的电气隔离。 版权所有（C）2009，JPO＆INPIT