公开(公告)号：DE602006011710D1

公开(公告)日：2010-03-04

申请号：DE602006011710

申请日：2006-11-07

Applicant: PANASONIC CORP

Inventor： NAKAMURA TADASHI ,  ECHIGO FUMIO ,  HIRAI SHOGO ,  SUGAWA TOSHIO

IPC: H01L23/12 ,  H05K3/46

Abstract: A plurality of double-sided boards using a film are attached to each other with a paste coupling layer sandwiched therebetween. In the paste coupling layer, a conductive paste is filled into a through hole formed in provisionally hardened resin, which is hardened. At the same time, second wirings are electrically coupled to each other by using the hardened conductive paste filled in the through holes that have been previously formed in the paste coupling layer. Thus, it is possible to provide a thinned multilayer printed wiring board without using an adhesive.

公开(公告)号：EP1890524A4

公开(公告)日：2009-07-01

申请号：EP07740830

申请日：2007-04-02

Applicant: PANASONIC CORP

Inventor： ECHIGO FUMIO ,  HIRAI SHOGO ,  NAKAMURA TADASHI

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K3/4614 ,  H05K3/4632 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49124

Abstract: A multilayer printed wiring board is characterized in that a thermal expansion coefficient in the thickness direction of an interlayer connecting material formed in a via hole is lower than that in the thickness direction of an electric insulating base material composed of an insulating material, an interlayer connection forming temperature is higher than a use environment temperature and a dimension in the thickness direction of the interlayer connecting material at a room temperature is more than that of the interlayer connecting material in the same wiring layer. As a result, since a material thermal expansion difference is generated in the thickness direction of the printed wiring board under the use environment, internal stress due to compression constantly operates to the interlayer connecting section. Therefore, the interlayer connecting section is compressed, and the multilayer printed wiring board having high connection reliability is obtained.

公开(公告)号：EP2009968A4

公开(公告)日：2012-12-05

申请号：EP08720606

申请日：2008-03-26

Applicant: PANASONIC CORP

Inventor： ASAHI TOSHIYUKI ,  SHIMASAKI YUKIHIRO ,  ECHIGO FUMIO

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/202 ,  H05K3/28 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/035 ,  H01L2224/0401

Abstract: A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity not less than 0.8 for an electromagnetic wave having a wavelength » = 0.002898/T at a temperature T ranging from 293K to 473K. This wiring board suppresses the temperature rise of the electronic component.

公开(公告)号：JP2012033879A

公开(公告)日：2012-02-16

申请号：JP2011105967

申请日：2011-05-11

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： SUGAYA YASUHIRO ,  KITAE TAKASHI ,  HASHIMOTO AKIRA ,  ECHIGO FUMIO

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To solve such a problem that the shape of a conductive via may be distorted significantly due to resin flow when a component is built in and thereby electrically stable via connection is not obtained, and a copper foil to be connected with the conductive via must satisfy the requirements of soldering.SOLUTION: A component built-in substrate 101 has a multilayer substrate 115 where a first insulation layer 102 and a second insulation layer 105 are laminated, a circuit component 112 mounted on a wiring pattern 111 on the inner layer side of the first insulation layer 102 which is the outermost layer of the multilayer substrate 115, and a housing section 114 which houses the circuit component 112. The space between the circuit component 112 and the multilayer substrate 115 is filled with a hardened matter of a second hardening resin 106, and a via 109 is formed of a conductive paste 110. The via 109 is constituted of a first metal region principally comprising an intermetallic compound and covering the periphery of surface contact area of Cu particles so as to straddle that area, and a second metal region principally comprising Bi.

Abstract translation: 解决的问题为了解决这样一个问题：导电通孔的形状可能由于树脂的流动而在构成内部并因而不能获得电连接的电气稳定性时可能会发生畸变，并且铜箔将被 与导电通孔连接必须满足焊接要求。 解决方案：组件内置基板101具有层叠第一绝缘层102和第二绝缘层105的多层基板115，安装在第一绝缘层102和第二绝缘层105的内层侧的布线图案111上的电路部件112 作为多层基板115的最外层的绝缘层102和容纳电路部件112的壳体部114.电路部件112与多层基板115之间的空间填充有第二硬化树脂106的硬化物 通孔109由导电膏110形成。通孔109由主要包含金属间化合物的第一金属区域构成，并覆盖Cu颗粒的表面接触面的周边以跨越该区域，第二金属 区域主要包含Bi。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2010263138A

公开(公告)日：2010-11-18

申请号：JP2009114301

申请日：2009-05-11

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： ASAHI TOSHIYUKI ,  TANI NAOYUKI ,  KITAGAWA SHOYO ,  ECHIGO FUMIO

IPC: H05K3/46 ,  H05K1/02

Abstract: PROBLEM TO BE SOLVED: To provide an electronic circuit apparatus for decreasing a temperature of a heat generating electronic component such as a semiconductor. SOLUTION: The electronic circuit apparatus 100 includes an electronic circuit 101, a casing 104 for housing the electronic circuit, and a mounting part 105 for fixing the electronic circuit in the casing. The electronic circuit is comprised of at least two or more electronic components 103 each including a heat generating electronic components and a multi-layered substrate 102 in which the electronic circuit is mounted on both sides and heat conductivity in a thickness direction is 1.0 W/mK or more. The multi-layered substrate includes a plurality of layers of wiring patterns 106, an insulating layer 107, a through-hole 108 electrically connecting wiring patterns and a resist 109. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于降低诸如半导体的发热电子部件的温度的电子电路装置。 电子电路装置100包括电子电路101，用于容纳电子电路的壳体104和用于将电子电路固定在壳体中的安装部105。 电子电路由至少两个以上的电子部件103构成，各电子部件103包括发热电子部件和多层基板102，电子电路安装在两侧，厚度方向的导热性为1.0W / m·K 或者更多。 多层基板包括多层布线图案106，绝缘层107，电连接布线图形的通孔108和抗蚀剂109.（C）2011，JPO＆INPIT

公开(公告)号：JP2009021468A

公开(公告)日：2009-01-29

申请号：JP2007183974

申请日：2007-07-13

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： ASAHI TOSHIYUKI ,  KITAGAWA SHOYO ,  ECHIGO FUMIO ,  KATSUMATA MASAAKI

IPC: H05K3/46 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board which hardly cracks even when its heat conductivity is increased. SOLUTION: At a center part of a heat conductive printed wiring board 10, a core layer 18 is formed by laminating one or more internal composite layers 12 including glass fiber 17 and one or more internal electrodes 14 respectively, and further an external layer composite layer 11 including no glass fiber 17 is formed on one or more surfaces of the core layer 18, thereby obtaining the heat conductive printed wiring board 10 which has high heat conductivity and hardly cracks. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供即使当其导热性增加时也难以破裂的印刷线路板。 解决方案：在导热印刷电路板10的中心部分，通过分别层压包括玻璃纤维17和一个或多个内部电极14的一个或多个内部复合层12，并且还具有外部 在芯层18的一个或多个表面上形成不包含玻璃纤维17的层复合层11，从而获得导热性高的导热性印刷电路板10，几乎不发生裂纹。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2009019150A

公开(公告)日：2009-01-29

申请号：JP2007183975

申请日：2007-07-13

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： ASAHI TOSHIYUKI ,  KITAGAWA SHOYO ,  ECHIGO FUMIO ,  KATSUMATA MASAAKI

IPC: C08J5/24 ,  B32B15/04 ,  B32B27/04 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To solve the problem of a conventional printed circuit board wherein it is easily cracked, when the heat transfer property thereof is enhanced.
SOLUTION: This heat transfer prepreg 11 produced by using a glass woven fabric 13 having a large aperture ratio and charging a heat transfer material 20 comprising an epoxy resin and an inorganic filler not only in the surface of the glass woven fabric 13 but also in the opening portions 18 of the glass woven fabric 13 is used as a prepreg used for producing a printed circuit board to provide a heat transfer printed circuit board 27 hardly cracked, even when the heat transfer property thereof is enhanced.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 解决的问题为了解决传统印刷电路板易于破裂的问题，当传热性能提高时。 解决方案：通过使用具有大孔径比的玻璃织物13并且不仅在玻璃织物13的表面中装载包含环氧树脂和无机填料的传热材料20而产生的该传热预浸料11，而且 玻璃织物13的开口部分18也用作制造印刷电路板的预浸料，以提供难以破裂的传热印刷电路板27，即使其传热性能增强。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2009010357A

公开(公告)日：2009-01-15

申请号：JP2008137578

申请日：2008-05-27

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： NAKAMURA SADASHI ,  ECHIGO FUMIO ,  KITA TAKAYUKI ,  FUKAZAWA KOUTA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a package configuration which easily materializes small size, low height and three-dimensional packaging so that it matches a high performance and a high-pin-count of a semiconductor required for mobile equipment which is compact, thin, lightweight, high-definition, multi-functional, etc.
SOLUTION: A three-dimensional printed wiring board 15 has a plurality of printed wiring boards having different shapes, each having a wiring line on a surface layer, and a connecting layer 3 connecting the printed wiring boards. The connecting layer 3 is made of an insulating layer containing resin, the connecting layer 3 has a through hole 9 formed at a predetermined position, and a via hole 7 is formed by filling a conductive paste 6 into the through hole.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了提供容易实现小尺寸，低高度和三维包装的封装结构，使得它匹配紧凑的移动设备所需的高性能和高引脚数的半导体 薄，轻，高清晰度，多功能等。解决方案：三维印刷线路板15具有多个印刷线路板，其形状不同，每个印刷线路板在表面层上具有布线，以及 连接印刷线路板的连接层3。 连接层3由包含树脂的绝缘层制成，连接层3具有形成在预定位置的通孔9，并且通过将导电浆料6填充到通孔中而形成通孔7。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2015032806A

公开(公告)日：2015-02-16

申请号：JP2013163882

申请日：2013-08-07

Applicant: パナソニック株式会社 ,  Panasonic Corp

Inventor： NAKAMURA SADASHI ,  HIMORI GOJI ,  KOMATSU SHINGO ,  ECHIGO FUMIO

IPC: H05K1/09 ,  H01B1/00 ,  H01B1/22 ,  H05K1/11 ,  H05K3/40

Abstract: 【課題】鉛フリーのニーズに対応することができる多層配線基板を提供する。【解決手段】ビアホール導体を有する配線基板であって、ビアホール導体は金属部分と樹脂部分とを含み、金属部分は、第一金属領域と、第二金属領域と、第三金属領域とを有し、結合体を形成する銅粒子同士が互いに面接触することにより面接触部を形成しており、第二金属領域の少なくとも一部分が第一金属領域に接触している配線基板用の合金ビアペーストであって、少なくとも、表面に第1反応性吸着層を有する銅粒子と、表面に第2反応性吸着層を有するSn−Bi半田粒子と、液状反応性樹脂または液状有機溶剤のいずれか一つ以上の液状成分と、を有する合金ビアペースト。【選択図】図22

Abstract translation: 要解决的问题：提供能够满足无铅需要的多层布线板。解决方案：在具有通孔导体的布线板中，通孔导体包括金属部分和树脂部分。 金属部分具有第一金属区域，第二金属区域和第三金属区域，其中形成聚集体的铜颗粒通过彼此进行表面接触而形成表面接触部分，并且第二金属区域的至少一部分是 与第一金属区域接触，用于布线板的合金通孔糊。 所述合金通孔糊具有至少具有表面上的第一反应性吸附层的铜颗粒的液体组分中的一种或多种，​​表面上具有第二反应性吸附层的Sn-Bi焊料颗粒和液体反应性树脂或液体有机物 溶剂。

公开(公告)号：JP2009170753A

公开(公告)日：2009-07-30

申请号：JP2008008859

申请日：2008-01-18

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： NAKAMURA SADASHI ,  ECHIGO FUMIO ,  KATSUMATA MASAAKI

IPC: H05K3/46 ,  H05K3/22

CPC classification number: H05K3/4626 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/4069 ,  H05K3/462 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/10121 ,  H05K2201/10378 ,  H05K2203/061 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To solve the problem wherein a printed wiring board for use in cell phones, and the like, often shows warpage due to heating and cooling, in a solder reflow process, and the like, making it difficult to manufacture high-precision devices, such a, as camera modules. SOLUTION: A multi layer printed wiring board 11 rarely showing warpage is attained by allowing a moderating connection layer provided on an inner layer to absorb stress generated due to heating and cooling in a solder reflow process, and the like, as well as, a mounting body 16 for a camera module, an optical module, or the like, is attained by using the multilayer printed wiring board 11. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题为了解决在手机等中使用的印刷电路板经常由于加热和冷却而显示翘曲的问题，在回流焊接过程等中，使得难以 制造高精度器件，如相机模块。 解决方案：通过允许设置在内层上的缓和连接层来吸收由于在回流焊接过程中的加热和冷却而产生的应力等，很少出现翘曲的多层印刷线路板11以及 ，通过使用多层印刷线路板11实现用于相机模块，光学模块等的安装体16。版权所有（C）2009，JPO＆INPIT