公开(公告)号：DE1665374B1

公开(公告)日：1971-09-09

申请号：DE1665374

申请日：1967-06-27

Applicant: PHOTOCIRCUITS CORP

Inventor： W SCHNEBLE FREDERICK ,  F MCCORMACK JOHN ,  J DR ZEBLINSKY RUDOLPH ,  WILLIAMSON DUFF ,  POLICHETTE JOSEPH

IPC: H05K3/46 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/42 ,  H05K3/00

公开(公告)号：DE1665395B1

公开(公告)日：1971-03-04

申请号：DE1665395

申请日：1967-11-29

Applicant: PHOTOCIRCUITS CORP

Inventor： WILLIAM SCHNEBLE FREDERICK ,  F MCCORMACK JOHN ,  JOHN ZEBLISKY RUDOLPH ,  POLICHETTE JOSEPH ,  DUFF WILLIAMSON JOHN

IPC: C23C18/16 ,  C23C18/20 ,  H01B1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/42

公开(公告)号：DE1817355A1

公开(公告)日：1969-08-07

申请号：DE1817355

申请日：1968-12-28

Applicant: PHOTOCIRCUITS CORP

Inventor： HODOLEY SVETLANA ,  F MCCORMACK JOHN

IPC: C23C18/40 ,  C23B5/02

Abstract: 1,218,850. Electroless deposition of copper. PHOTO-CIRCUITS CORP. Dec.19, 1968 [Dec.28, 1967], No.60309/68. Heading C7F. Cu is electrolessly deposited on to e.g. sensitized insulating substrates from a solution comprising a water soluble Cu salt, a complexing agent for cupric ions, a pH adjuster, a reducing agent and 0À001-30 mgms/litre of Os which is preferably added as osmium tetroxide or potassuim osmiate. The Cu salt may be the sulphate, halide, nitrate or acetate, the reducing agents may be formaldehyde, paraformaldehyde, trioxane, 1-hydroxymethyl 5, 5- dimethyl hydantoin, glyoxal, hoxohydrides, boranes and hypophosphites. The complexing agent is the tetrasodium salt of ethylene-diaminetetraacetic acid and less than 5 gms/litre surfactants such as organic phosphate esters and oxyethylated sodium salts may be added. 0À02-0À1 mole/litre of P as organic and inorganic phosphorus compounds, up to 300 p.p. m of S may also be added. Test pieces of steel are treated in the solution.

公开(公告)号：DE1621307A1

公开(公告)日：1971-06-03

申请号：DE1621307

申请日：1967-01-25

Applicant: PHOTOCIRCUITS CORP

Inventor： W SCHNEBLE FREDERICK ,  F MCCORMACK JOHN ,  J ZEBRISKY RUSOLPH

IPC: C23C18/40 ,  C23C18/52 ,  C23C3/02

公开(公告)号：DE1621311A1

公开(公告)日：1970-07-23

申请号：DE1621311

申请日：1967-05-03

Applicant: PHOTOCIRCUITS CORP

Inventor： ZEBLISKY RUDOLPH ,  F MCCORMACK JOHN ,  W SCHNEBLE FREDERICK

IPC: C23C18/16 ,  C23C18/40 ,  C23C18/52 ,  C09D5/00

Abstract: 1,145,578. Printed circuits. PHOTOCIRCUITS CORP. 4 May, 1967 [6 May, 1966], No. 20684/67. Heading H1R. [Also in Division C7] Portions of an insulating substrate, such as a plastics material, of which many suitable examples are listed, are sensitized in the form of a desired printed circuit form, e.g. by treatment with an acidic aqueous solution of stannous chloride followed by a dilute acid aqueous solution of Pd chloride, or by treatment with a single acidic solution containing stannous chloride and a precious metal chloride such as Pd chloride. Cu or other metal is then deposited on one or more surfaces of the substrate, and on the walls of holes through it, by electroless deposition from a solution on to the sensitized parts of the substrate, said solution including a compound containing a cyanide radical complexed with a metal from Group VIII of the Periodic Table.

公开(公告)号：DE1621309A1

公开(公告)日：1971-06-03

申请号：DE1621309

申请日：1967-01-31

Applicant: PHOTOCIRCUITS CORP

Inventor： W SCHNEBLE FREDERICK ,  F MCCORMACK JOHN ,  J ZEBLISKY RUDOLPH

IPC: C23C18/40 ,  C23C18/52 ,  C23C3/02

公开(公告)号：DE1521442A1

公开(公告)日：1969-10-23

申请号：DE1521442

申请日：1965-10-12

Applicant: PHOTOCIRCUITS CORP

Inventor： W SCHNEBLE FREDERICK ,  F MCCORMACK JOHN ,  J ZEBLISKY RUDOLPH ,  D WILLIAMSON JOHN ,  POLICHETTE JOHN

IPC: C23C18/16 ,  H05K1/03 ,  H05K1/05 ,  H05K3/18