3.
    发明专利
    未知

    公开(公告)号:DE1521440A1

    公开(公告)日:1970-01-08

    申请号:DE1521440

    申请日:1965-06-23

    Abstract: In the electroless deposition of e.g. Cu, Ni, Co, Cd, and Sn, a cyanide compound is added in an amount less than 500 milligrams/1. The substrate may be paper, glass, ceramic, synthetic resins or a metal, e.g. Ni, Co, Fe, steel, Pd, Pt, Au, Cu, brass, Mn, Cr, W, Ti, Sn, Ag or Mo. An oxidizing agent, e.g. borohydrides, amine boranes, hydrazines, hypophosphites, hydrosulphites, hydroxyl amines, and formaldehyde may be added. A sequestering agent e.g. ethylene diamine, diethylene triamine, triethylene tetramine, E.D.T.A., citric and tartaric acid, ammonia, Rochelle salts, nitrilo triacetic acid, gluconic acid and gluconates, and triethanolamine, and a surfactant e.g. organic phosphate esters or oxyethylated sodium salts may also be added. Noncatalytic surfaces may be sensitized with stannous chloride and a precious metal salt.

Patent Agency Ranking