公开(公告)号：DE602005007945D1

公开(公告)日：2008-08-21

申请号：DE602005007945

申请日：2005-02-14

Applicant: PIONEER CORP

Inventor： OKUDA YOSHIYUKI ,  ASO SABURO ,  YOSHIZAWA KATSUMI ,  YOSHIKAWA TAKAMASA ,  SATOH HIDEO ,  NEGISHI NOBUYASU ,  SAKEMURA KAZUYUKI

IPC: H01J31/26 ,  H01L27/146 ,  H01J29/04 ,  H01J29/96 ,  H01J31/38

Abstract: Disclosed is an image pickup device capable of greatly reducing delay in drive signals supplied to field emission devices, and cross-talk and the like that originate in these drive signals. The image pickup device comprises a photoelectric conversion film for receiving incident light on one side thereof; a field emission layer having an electron emitting surface apart from and facing the other side of the photoelectric conversion film, and including a plurality of electron emission devices; and a drive layer formed on a back side of the field emission layer and including a plurality of device drive circuits for supplying drive signals to each of back electrodes of the plurality of electron emission devices.

公开(公告)号：EP1739706A4

公开(公告)日：2008-12-03

申请号：EP05721570

申请日：2005-03-22

Applicant: PIONEER CORP ,  PIONEER MICRO TECHNOLOGY CORP

Inventor： SAKEMURA KAZUTO ,  ASO SABURO ,  HANIHARA KOJI ,  NEGISHI NOBUYASU ,  NAKADA TOMONARI ,  YOSHIKAWA TAKAMASA

IPC: H01J1/312 ,  H01J9/02 ,  H01J31/12

CPC classification number: H01J9/022 ,  B82Y10/00 ,  H01J1/312 ,  H01J31/127

Abstract: An electron emitting device is composed of a plurality of electron emitting elements. The electron emitting element is provided with a lower electrode (11) and an upper electrode (15) and emits an electron from an upper electrode side. In the electron emitting device, a space is formed between the electron emitting elements and the upper electrode extends over the space on a bridge part (15a). The space is formed by providing a through hole or a notched part (15a) on the bridge part, and etching a stacked body under the upper electrode by using the bridge part as a mask. The upper electrodes of the adjacent electron emitting elements are electrically connected by the bridge part without bringing the upper electrodes into contact with the electron emitting element side planes and a substrate. Therefore, a current path can be shortened and a possibility of disconnection can be reduced.