公开(公告)号：AT420060T

公开(公告)日：2009-01-15

申请号：AT02009012

申请日：2002-04-23

Applicant: PLANSEE SE

Inventor： ROEDHAMMER PETER

IPC: C04B37/00 ,  F16B5/08 ,  B23K20/00 ,  B23K103/16 ,  C04B37/02

Abstract: A gas tight metal foil is tightly pressed on the surface contour of carbon fiber reinforced carbon structural components by canning process, followed by die/isostatic pressing. The components are joined to a composite component by forming material-to-material bonding between metal foils and adjoining joining surfaces. An Independent claim is also included for composite component.

公开(公告)号：DE502004006435D1

公开(公告)日：2008-04-17

申请号：DE502004006435

申请日：2004-09-29

Applicant: PLANSEE SE

Inventor： ROEDHAMMER PETER

IPC: H01J35/10 ,  B23K1/19 ,  B23K35/00 ,  B23K35/02 ,  B23K35/32 ,  B32B7/04 ,  C22C14/00 ,  C22C16/00

Abstract: A composite body which can withstand high thermal stresses is formed by high-temperature soldering at least a part of a high-temperature-resistant, metallic or nonmetallic component and at least a part of a high-temperature-resistant, nonmetallic component. Prior to soldering, a metallic barrier layer, which is impervious to the solder melt, of one or more elements selected from the group consisting of V, Nb, Ta, Cr, Mo, W, Ti, Zr, Hf and alloys thereof, is deposited on that surface of each nonmetallic component which is to be soldered. Solder material, barrier layer and soldering conditions are adapted to one another in such a manner that during the soldering operation the metallic barrier layer remains at least partially in the solid state, so that after the soldering operation it is still present in a thickness of at least 10 μm at least over the majority of the soldering surface.

公开(公告)号：AT12462U2

公开(公告)日：2012-05-15

申请号：AT22012

申请日：2012-01-09

Applicant: PLANSEE SE

Inventor： ROEDHAMMER PETER ,  SCHATTE JUERGEN ,  GLATZ WOLFGANG ,  MUELLER THOMAS

IPC: H01J35/10

公开(公告)号：AT388481T

公开(公告)日：2008-03-15

申请号：AT04761054

申请日：2004-09-29

Applicant: PLANSEE SE

Inventor： ROEDHAMMER PETER

IPC: H01J35/10 ,  B23K1/19 ,  B23K35/00 ,  B23K35/02 ,  B23K35/32 ,  B32B7/04 ,  C22C14/00 ,  C22C16/00

Abstract: A composite body which can withstand high thermal stresses is formed by high-temperature soldering at least a part of a high-temperature-resistant, metallic or nonmetallic component and at least a part of a high-temperature-resistant, nonmetallic component. Prior to soldering, a metallic barrier layer, which is impervious to the solder melt, of one or more elements selected from the group consisting of V, Nb, Ta, Cr, Mo, W, Ti, Zr, Hf and alloys thereof, is deposited on that surface of each nonmetallic component which is to be soldered. Solder material, barrier layer and soldering conditions are adapted to one another in such a manner that during the soldering operation the metallic barrier layer remains at least partially in the solid state, so that after the soldering operation it is still present in a thickness of at least 10 μm at least over the majority of the soldering surface.

公开(公告)号：AT12462U3

公开(公告)日：2013-05-15

申请号：AT22012

申请日：2012-01-09

Applicant: PLANSEE SE

Inventor： ROEDHAMMER PETER ,  SCHATTE JUERGEN ,  GLATZ WOLFGANG ,  MUELLER THOMAS

IPC: H01J35/10

Abstract: Die vorliegende Erfindung betrifft eine Röntgendrehanode (2) mit einer ringförmigen Brennbahn (16), wobei die Brennbahn-Oberfläche eine gerichtete Schleifstruktur (18) aufweist. Dabei ist über den Umfang der ringförmigen Brennbahn (16) hinweg und über die radiale Erstreckung der Brennbahn (16) hinweg die Ausrichtung der Schleifstruktur (18) relativ zu einer tangentialen Referenzrichtung (8) in dem jeweiligen Oberflächenabschnitt jeweils mit einem Winkel im Bereich von einschließlich 15° bis einschließlich 90° geneigt. Die Erfindung betrifft ferner ein entsprechendes Verfahren zum Herstellen einer Röntgendrehanode (2).

公开(公告)号：AT522920T

公开(公告)日：2011-09-15

申请号：AT08799932

申请日：2008-09-25

Applicant: PLANSEE SE

Inventor： ROEDHAMMER PETER ,  GLATZ WOLFGANG ,  TABERNIG BERNHARD ,  WAGNER HANNES

IPC: H01J35/08

Abstract: An X-ray anode includes a coating and a support body. In addition to a strength-imparting region, the support body has a region formed of a diamond-metal composite material. The diamond-metal composite material is formed of 40 to 90% by volume diamond particles, 10 to 60% by volume binding phase(s) formed of a metal or an alloy of the metals of the group consisting of Cu, Ag, Al and at least one carbide of the elements of the group consisting of Tr, Zr, Hf, V, Nb, Ta, Cr, Mo, W, B, and Si. The highly heat-conductive region can be form-lockingly connected at the back to a heat-dissipating region, for example formed of Cu or a Cu alloy. The X-ray anode has improved heat dissipation and lower composite stress.