Abstract:
The present invention discloses liquid thermosetting inks useful for ink-jet applications, such as industrial solder masks; and to a method of producing the same. More specifically, a liquid thermosetting ink for ink-jet applications comprising one resin or more; at least one solid latent curing agent characterized by a maximal particle size of less than two microns; an inert filler having fine particles. The invention also discloses a method of producing a liquid thermosetting ink for ink-jet applications, in the manner that one-pack or two-pack ink characterized by a viscosity lower than 50 Cp at application temperature, surface tension lower than 80 dyn/cm at application temperature, and glass transition temperature of cured ink of greater than 120°C.
Abstract:
An ultraviolet curable composition for printing on a printed circuit board using an inkjet printer comprising a mixture of reactive monomers and oligomers, at least one pigment, at least one photoinitiator, and at least one additive. The monomer/oligomer mixture is formulated so that the ink has a high viscosity of about 40-200 cp at 25 DEG C, and a low viscosity of about 10-20cp at a high temperatures of about 50-80 DEG C. The cured image is able to withstand dipping in a solder bath at 260 DEG C without substantial degradation.
Abstract:
The present invention discloses reactive fine particles and especially fine latent curing agents. The reactive fine particle comprising one or more functional compounds A, or its precursors, having a maximal size of less than 2 microns; and one or more inert particles B, having at least the maximal size of 2 microns, carrying said functional compounds A at the outer surface and/or in its inner portion. The present invention also discloses a method for producing reactive fine particles wherein said compounds A to inert particles B weight ratio is ranging from 0.01A:100B to 50A:100B. The present invention also encompasses any use or end product comprising said novel particles or said method.
Abstract:
A method and apparatus for applying ink, according to a soldermask pattern, to a printed circuit board (360) having elevated pads defining pad edges, the method including flooding the printed circuit board (360) with ink such that the ink advances, without climbing onto the elevated pads.
Abstract:
The invention relates to a heat curable ink composition for printing on printed circuit boards using an ink jet printer, comprising at least one non-aqueous solvent, at least one pigment, a melamine based resin system, at least one additive, and at least one dispersing agent. The melamine based resin system comprises a crosslinking agent and a polymer capable of reacting with said crosslinking agent. The invention also relates to a method for printing a legend onto a printed circuit board comprising ink jet printing the heat curable ink composition onto a printed circuit board.