公开(公告)号：WO2003075623A2

公开(公告)日：2003-09-12

申请号：PCT/IL2003/000161

申请日：2003-03-03

Applicant: PRINTAR LTD. ,  ZOHAR, Ron ,  MOZEL, Jacob ,  VILK, Ran

Inventor： ZOHAR, Ron ,  MOZEL, Jacob ,  VILK, Ran

IPC: H05K

CPC classification number: H05K3/0091 ,  H05K3/28 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/081 ,  H05K2203/1509

Abstract: A method and apparatus for applying ink, according to a soldermask pattern, to a printed circuit board having elevated pads defining pad edges, the method including flooding the printed circuit board with ink such that the ink advances to the pad edges and is stopped thereby and thereat, without climbing onto the elevated pads.

Abstract translation: 一种用于根据焊接掩模图案将油墨施加到具有限定焊盘边缘的凸起焊盘的印刷电路板的方法和装置，所述方法包括用油墨浸渍印刷电路板，使得油墨前进到焊盘边缘并由此停止， 在那里，没有爬上升高的垫。

公开(公告)号：WO2005069734A3

公开(公告)日：2005-08-04

申请号：PCT/IL2005/000083

申请日：2005-01-23

Applicant: PRINTAR LTD. ,  MOZEL, Jacob ,  VILK, Ran ,  HALAHMI, Izhar

Inventor： MOZEL, Jacob ,  VILK, Ran ,  HALAHMI, Izhar

IPC: C09D11/00

Abstract: The present invention discloses liquid thermosetting inks useful for ink-jet applications, such as industrial solder masks; and to a method of producing the same. More specifically, a liquid thermosetting ink for ink-jet applications comprising one resin or more; at least one solid latent curing agent characterized by a maximal particle size of less than two microns; an inert filler having fine particles. The invention also discloses a method of producing a liquid thermosetting ink for ink-jet applications, in the manner that one-pack or two-pack ink characterized by a viscosity lower than 50 Cp at application temperature, surface tension lower than 80 dyn/cm at application temperature, and glass transition temperature of cured ink of greater than 120°C.

公开(公告)号：WO2005069733A2

公开(公告)日：2005-08-04

申请号：PCT/IL2005/000082

申请日：2005-01-23

Applicant: Printar Ltd. ,  MOZEL, Jacob ,  VILK, Ran ,  HALAHMI, Izhar

Inventor： MOZEL, Jacob ,  VILK, Ran ,  HALAHMI, Izhar

IPC: C08G59/18 ,  C08L63/00 ,  C09D11/00 ,  C09D11/02 ,  C09D11/10 ,  H05K1/16 ,  H05K3/28

CPC classification number: C08G59/18 ,  C09D11/101 ,  H05K1/162 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2203/013

Abstract: The present invention discloses reactive fine particles and especially fine latent curing agents. The reactive fine particle comprising one or more functional compounds A, or its precursors, having a maximal size of less than 2 microns; and one or more inert particles B, having at least the maximal size of 2 microns, carrying said functional compounds A at the outer surface and/or in its inner portion. The present invention also discloses a method for producing reactive fine particles wherein said compounds A to inert particles B weight ratio is ranging from 0.01A:100B to 50A:100B. The present invention also encompasses any use or end product comprising said novel particles or said method.

Abstract translation: 本发明公开了反应性细颗粒，特别是精细的潜在固化剂。 包含一种或多种功能化合物A或其前体的反应性细颗粒具有小于2微米的最大尺寸; 和一种或多种具有至少最大尺寸为2微米的惰性颗粒B，其在外表面和/或其内部部分载有所述官能化合物A. 本发明还公开了一种反应性微粒的制造方法，其中所述化合物A与惰性粒子B的重量比为0.01A:100B至50A:100B。 本发明还包括包含所述新型颗粒或所述方法的任何用途或最终产品。

公开(公告)号：EP1481575A2

公开(公告)日：2004-12-01

申请号：EP03743491.7

申请日：2003-03-03

Applicant: Printar Ltd.

Inventor： ZOHAR, Ron ,  MOZEL, Jacob ,  VILK, Ran

IPC: H05K3/02 ,  H01K3/10 ,  B05D5/12 ,  B05D5/00 ,  B05D3/02 ,  B05D3/00 ,  C08F2/48 ,  C08J7/06

CPC classification number: H05K3/0091 ,  H05K3/28 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/081 ,  H05K2203/1509

Abstract: A method and apparatus for applying ink, according to a soldermask pattern, to a printed circuit board (360) having elevated pads defining pad edges, the method including flooding the printed circuit board (360) with ink such that the ink advances, without climbing onto the elevated pads.