公开(公告)号：AT417357T

公开(公告)日：2008-12-15

申请号：AT04707086

申请日：2004-01-30

Applicant: QUALCOMM INC

Inventor： REYES EDWARD ,  LANE RYAN ,  MARBURGER TIONA ,  GREGORICH TOM

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H05K3/34

Abstract: An area area package includes a plurality of solder balls not used as electrical connectors. These non-connected solder balls, or "dummy balls," provide protection to solder balls connected to live pins and therefore increase reliability of the area array package. The dummy balls may be placed in the corners, along the diagonals or in other high stress location on the area array package. To further increase reliability, a continuous copper ball land pad may be used to connect each group of corner dummy balls. Continuous copper pads help to reduce stress on the dummy balls. For center-depopulated BGA packages, an array of dummy balls may be used in the center of the package to prevent substrate bending and improve drop test reliability.

公开(公告)号：DE602004018268D1

公开(公告)日：2009-01-22

申请号：DE602004018268

申请日：2004-01-30

Applicant: QUALCOMM INC

Inventor： REYES EDWARD ,  LANE RYAN ,  MARBURGER TIONA ,  GREGORICH TOM

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H05K3/34

Abstract: An area area package includes a plurality of solder balls not used as electrical connectors. These non-connected solder balls, or "dummy balls," provide protection to solder balls connected to live pins and therefore increase reliability of the area array package. The dummy balls may be placed in the corners, along the diagonals or in other high stress location on the area array package. To further increase reliability, a continuous copper ball land pad may be used to connect each group of corner dummy balls. Continuous copper pads help to reduce stress on the dummy balls. For center-depopulated BGA packages, an array of dummy balls may be used in the center of the package to prevent substrate bending and improve drop test reliability.

公开(公告)号：WO2004068560A2

公开(公告)日：2004-08-12

申请号：PCT/US2004002716

申请日：2004-01-30

Applicant: QUALCOMM INC ,  REYES EDWARD ,  LANE RYAN ,  MARBURGER TIONA ,  GREGORICH TOM

Inventor： REYES EDWARD ,  LANE RYAN ,  MARBURGER TIONA ,  GREGORICH TOM

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H05K3/34 ,  H01L

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/09781 ,  Y02P70/613 ,  H01L2224/0401

Abstract: An area array package includes a plurality of solder balls not used as electrical connectors. These non-connected solder balls, or "dummy balls," provide protection to solder balls connected to live pins and therefore increase reliability of the area array package. The dummy balls may be placed in the corners, along the diagonals or in other high stress locations on the area array package. To further increase reliability, a continuous copper ball land pad may be used to connect each group of corner dummy balls. Continuous copper pads help to reduce stress on the dummy balls. For center-depopulated BGA packages, an array of dummy balls may be used in the center of the package to prevent substrate bending and improve drop test reliability.

Abstract translation: 面阵列封装包括多个不用作电连接器的焊球。 这些未连接的焊球或“虚拟球”为连接到带电引脚的焊球提供保护，并因此增加面阵列封装的可靠性。 虚拟球可以放置在面阵列封装的角落，对角线或其他高应力位置。 为了进一步提高可靠性，可以使用连续的铜球焊盘来连接每组角球模。 连续的铜垫有助于减少假球上的压力。 对于中心消失的BGA封装，可在封装中心使用一系列伪球，以防止衬底弯曲并提高跌落测试的可靠性。