公开(公告)号：AU2003256826A8

公开(公告)日：2004-02-16

申请号：AU2003256826

申请日：2003-07-25

Applicant: QUALCOMM INC

Inventor： GREGORICH TOM ,  LANE RYAN ,  REYES EDWARD ,  VEATCH MARK

IPC: H01L23/498 ,  H01L23/538 ,  H01L25/065

公开(公告)号：AU2002323184A1

公开(公告)日：2003-03-03

申请号：AU2002323184

申请日：2002-08-15

Applicant: QUALCOMM INC

Inventor： IRZHANN FIFIN ,  REYES EDWARD

IPC: H01L25/18 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07 ,  H01L23/48

Abstract: An integrated circuit package is constructed by attaching lower dies to a substrate that has bond fingers deposited on its surface. One lower die and its associated bond fingers are located offset from the center of the substrate. The lower dies are electrically coupled to the substrate's bond fingers with lower bond wires. An upper die is stacked on at least one of the lower dies. The upper die is electrically coupled, with bond wires, to the lower die upon which it is mechanically coupled. Each of the lower dies may be coupled to the other lower die with bond wire bridges that span the lower bond wires. The upper die may be electrically coupled, with bond wire bridges, to any or all of the lower dies.

公开(公告)号：DE602004018268D1

公开(公告)日：2009-01-22

申请号：DE602004018268

申请日：2004-01-30

Applicant: QUALCOMM INC

Inventor： REYES EDWARD ,  LANE RYAN ,  MARBURGER TIONA ,  GREGORICH TOM

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H05K3/34

Abstract: An area area package includes a plurality of solder balls not used as electrical connectors. These non-connected solder balls, or "dummy balls," provide protection to solder balls connected to live pins and therefore increase reliability of the area array package. The dummy balls may be placed in the corners, along the diagonals or in other high stress location on the area array package. To further increase reliability, a continuous copper ball land pad may be used to connect each group of corner dummy balls. Continuous copper pads help to reduce stress on the dummy balls. For center-depopulated BGA packages, an array of dummy balls may be used in the center of the package to prevent substrate bending and improve drop test reliability.

公开(公告)号：AT417357T

公开(公告)日：2008-12-15

申请号：AT04707086

申请日：2004-01-30

Applicant: QUALCOMM INC

Inventor： REYES EDWARD ,  LANE RYAN ,  MARBURGER TIONA ,  GREGORICH TOM

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H05K3/34

Abstract: An area area package includes a plurality of solder balls not used as electrical connectors. These non-connected solder balls, or "dummy balls," provide protection to solder balls connected to live pins and therefore increase reliability of the area array package. The dummy balls may be placed in the corners, along the diagonals or in other high stress location on the area array package. To further increase reliability, a continuous copper ball land pad may be used to connect each group of corner dummy balls. Continuous copper pads help to reduce stress on the dummy balls. For center-depopulated BGA packages, an array of dummy balls may be used in the center of the package to prevent substrate bending and improve drop test reliability.

公开(公告)号：BR0312958A

公开(公告)日：2007-07-10

申请号：BR0312958

申请日：2003-07-25

Applicant: QUALCOMM INC

Inventor： LANE RYAN ,  REYES EDWARD ,  VEATCH MARK ,  GREGORICH TOM

IPC: H01L23/498 ,  H01L23/538 ,  H01L25/065

公开(公告)号：AU2003256826A1

公开(公告)日：2004-02-16

申请号：AU2003256826

申请日：2003-07-25

Applicant: QUALCOMM INC

Inventor： VEATCH MARK ,  GREGORICH TOM ,  LANE RYAN ,  REYES EDWARD

IPC: H01L23/498 ,  H01L23/00

公开(公告)号：WO2004012262A3

公开(公告)日：2004-04-08

申请号：PCT/US0323405

申请日：2003-07-25

Applicant: QUALCOMM INC

Inventor： LANE RYAN ,  REYES EDWARD ,  VEATCH MARK ,  GREGORICH TOM

IPC: H01L23/498 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An area array package comprising a die attach area for attaching a die to a substrate, a network of staggered bond fingers, and a network of bond islands for coupling bond wires between the bond islands and die bond pads is provided. A network of package leads, for example, a network of solder balls in a ball grid array, is depopulated to permit greater trace route flexibility and via placement within the substrate. Stacked die and multi-chip packages are also disclosed. A method for accommodating a high pin-count die in an area array package is also included

Abstract translation: 提供了一种面阵列封装，其包括用于将管芯附着到衬底的管芯附着区域，交错键合指状物的网络和用于耦合键合岛和管芯键合焊盘之间的键合引线的键合岛网络。 封装引线网络（例如球栅阵列中的焊球网络）被消减以允许更大的迹线路由灵活性并且通过放置在衬底内。 还公开了堆叠裸片和多芯片封装。 还包括在面阵列封装中容纳高引脚数芯片的方法

公开(公告)号：WO2004068560A2

公开(公告)日：2004-08-12

申请号：PCT/US2004002716

申请日：2004-01-30

Applicant: QUALCOMM INC ,  REYES EDWARD ,  LANE RYAN ,  MARBURGER TIONA ,  GREGORICH TOM

Inventor： REYES EDWARD ,  LANE RYAN ,  MARBURGER TIONA ,  GREGORICH TOM

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H05K3/34 ,  H01L

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/09781 ,  Y02P70/613 ,  H01L2224/0401

Abstract: An area array package includes a plurality of solder balls not used as electrical connectors. These non-connected solder balls, or "dummy balls," provide protection to solder balls connected to live pins and therefore increase reliability of the area array package. The dummy balls may be placed in the corners, along the diagonals or in other high stress locations on the area array package. To further increase reliability, a continuous copper ball land pad may be used to connect each group of corner dummy balls. Continuous copper pads help to reduce stress on the dummy balls. For center-depopulated BGA packages, an array of dummy balls may be used in the center of the package to prevent substrate bending and improve drop test reliability.

Abstract translation: 面阵列封装包括多个不用作电连接器的焊球。 这些未连接的焊球或“虚拟球”为连接到带电引脚的焊球提供保护，并因此增加面阵列封装的可靠性。 虚拟球可以放置在面阵列封装的角落，对角线或其他高应力位置。 为了进一步提高可靠性，可以使用连续的铜球焊盘来连接每组角球模。 连续的铜垫有助于减少假球上的压力。 对于中心消失的BGA封装，可在封装中心使用一系列伪球，以防止衬底弯曲并提高跌落测试的可靠性。