公开(公告)号：AU2017316274A1

公开(公告)日：2019-01-31

申请号：AU2017316274

申请日：2017-07-25

Applicant: QUALCOMM INC

Inventor： KAKADE MANOJ ,  XU HAIYONG ,  ZANG RUEY KAE ,  LI YUE ,  ZHANG XIAONAN ,  HAU-RIEGE CHRISTINE

IPC: H01L21/60

Abstract: The present disclosure provides packages and methods for fabricating packages. A package (701) may comprise a wafer-level package (WLP) layer comprising first and second WLP contacts and first and second conductive pillars disposed on the first and second WLP contacts. Each conductive pillar comprises a surface opposite the WLP contact that forms an array pad (750-759). The array pads have different sizes. The package further comprises a mold (740) over the WLP layer and at least partially surrounding the conductive pillars, wherein the mold compound and the first array pads form a substantially planar LGA contact surface that is configured to couple the package to a land grid array.

公开(公告)号：SG11201900340QA

公开(公告)日：2019-03-28

申请号：SG11201900340Q

申请日：2017-07-25

Applicant: QUALCOMM INC

Inventor： KAKADE MANOJ ,  XU HAIYONG ,  ZANG RUEY KAE ,  LI YUE ,  ZHANG XIAONAN ,  HAU-RIEGE CHRISTINE

IPC: H01L21/60

Abstract: The present disclosure provides packages and methods for fabricating packages. A package may comprise a wafer-level package (WLP) layer comprising a WLP contact and a component within the WLP layer associated with a component depth. A conductive pillar is disposed on the WLP contact and comprises an opposite surface that forms an array pad. The package further comprises a mold over the WLP layer and at least partially surrounding the conductive pillar, wherein the mold compound and the array pad form a substantially planar land grid array (LGA) contact surface that is configured to couple the package to a land grid array. The LGA contact surface has a height that is equal to a selected LGA component height, and the selected LGA component height is equal to a difference between a keepout distance associated with a characteristic of the component within the WLP layer and the component depth.