公开(公告)号：WO2018175099A1

公开(公告)日：2018-09-27

申请号：PCT/US2018/020918

申请日：2018-03-05

Applicant: QUALCOMM INCORPORATED

Inventor： KANG, Kuiwon ,  JOMAA, Houssam ,  BAHR, Christopher ,  ROUHANA, Layal

IPC: H01L23/538

Abstract: A package that includes a substrate comprising an interposer interconnect and a cavity, a redistribution portion coupled to the substrate, the redistribution comprising a plurality of redistribution interconnects, and a first die coupled to the redistribution portion through the cavity of the substrate. A substantial region between a side surface of the first die and the substrate is free of an encapsulation layer. In some implementations, the substrate is free of a metal ring that surrounds the first die. In some implementations, the redistribution portion comprises a barrier layer and a first interconnect coupled to the barrier layer. The barrier layer is coupled to the interposer interconnect.