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公开(公告)号：EP4533824A1
公开(公告)日：2025-04-09
申请号：EP23732728.3
申请日：2023-05-19
Applicant: QUALCOMM INCORPORATED
Inventor： LUND, Benjamin , RAMASAMY, Bala , PARK, Edwin Chongwoo , BAKER, Daniel , VASSILOVSKI, Dan , ZHANG, Xiaoxin , DAS, Soumya , SHRIVER, Garrett
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