公开(公告)号：WO2018093503A1

公开(公告)日：2018-05-24

申请号：PCT/US2017/056620

申请日：2017-10-13

Applicant: QUALCOMM INCORPORATED

Inventor： SAEIDI, Mehdi ,  SAHU, Vivek ,  KHADIVI, Taravat ,  COUTTS, Ryan ,  ALTON, Ronald ,  JAIN, Palkesh ,  MITTAL, Rajat

IPC: G06F1/20 ,  G06F9/50

Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device, wherein a first one of the temperature sensors is physically located at a first processing unit of the computing device; processing the temperature information to identify that the first temperature sensor is associated with temperature that is at or above a threshold; and assigning a processing thread to a first core of a plurality of cores of a second processing unit in response to identifying that the first temperature sensor is associated with temperature that is at or above the threshold and based at least in part on a physical distance between the first core and the first temperature sensor.

公开(公告)号：WO2018057145A1

公开(公告)日：2018-03-29

申请号：PCT/US2017/046472

申请日：2017-08-11

Applicant: QUALCOMM INCORPORATED

Inventor： SAEIDI, Mehdi ,  MITTAL, Rajat ,  COUTTS, Ryan

IPC: G06F1/20 ,  G01K7/18

CPC classification number: H05K7/2039 ,  G01K7/183 ,  G01K2217/00 ,  G06F1/203

Abstract: The disclosure generally relates to a hybrid design whereby a heat spreader arranged to reduce an external skin temperature on a handheld device may further enable the external skin temperature to be directly measured. For example, the heat spreader may be thermally coupled to at least one external surface and include at least one region in which a plurality of recesses are formed such that an electrical resistance is produced in the at least one region when a current is applied thereto. The heat spreader may be formed from a material having a substantially linear resistance-to-temperature correlation, whereby the electrical resistance produced in the at least one region may be measured and correlated to a temperature on the at least one external surface.

Abstract translation: 本公开总体上涉及一种混合设计，其中布置成降低手持设备上的外部皮肤温度的散热器可以进一步使得能够直接测量外部皮肤温度。 例如，散热器可以热耦合到至少一个外表面，并且包括至少一个区域，在该区域中形成有多个凹槽，使得当电流被施加到所述至少一个区域时产生电阻。 散热器可以由具有基本上线性的电阻 - 温度相关性的材料形成，由此可以测量在至少一个区域中产生的电阻并且将其与至少一个外表面上的温度相关联。

公开(公告)号：EP3542240B1

公开(公告)日：2020-09-16

申请号：EP17797479.7

申请日：2017-10-13

Applicant: Qualcomm Incorporated

Inventor： SAEIDI, Mehdi ,  SAHU, Vivek ,  KHADIVI, Taravat ,  COUTTS, Ryan ,  ALTON, Ronald ,  JAIN, Palkesh ,  MITTAL, Rajat

IPC: G06F1/20 ,  G06F9/50