公开(公告)号：WO2018093503A1

公开(公告)日：2018-05-24

申请号：PCT/US2017/056620

申请日：2017-10-13

Applicant: QUALCOMM INCORPORATED

Inventor： SAEIDI, Mehdi ,  SAHU, Vivek ,  KHADIVI, Taravat ,  COUTTS, Ryan ,  ALTON, Ronald ,  JAIN, Palkesh ,  MITTAL, Rajat

IPC: G06F1/20 ,  G06F9/50

Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device, wherein a first one of the temperature sensors is physically located at a first processing unit of the computing device; processing the temperature information to identify that the first temperature sensor is associated with temperature that is at or above a threshold; and assigning a processing thread to a first core of a plurality of cores of a second processing unit in response to identifying that the first temperature sensor is associated with temperature that is at or above the threshold and based at least in part on a physical distance between the first core and the first temperature sensor.

公开(公告)号：EP3542240B1

公开(公告)日：2020-09-16

申请号：EP17797479.7

申请日：2017-10-13

Applicant: Qualcomm Incorporated

Inventor： SAEIDI, Mehdi ,  SAHU, Vivek ,  KHADIVI, Taravat ,  COUTTS, Ryan ,  ALTON, Ronald ,  JAIN, Palkesh ,  MITTAL, Rajat

IPC: G06F1/20 ,  G06F9/50