公开(公告)号：WO2023009241A1

公开(公告)日：2023-02-02

申请号：PCT/US2022/033967

申请日：2022-06-17

Applicant: QUALCOMM INCORPORATED

Inventor： IPEK, Engin ,  RYCHLIK, Bohuslav ,  PATSILARAS, George ,  KULKARNI, Prajakt ,  HANKENDI, Can ,  ALI, Fahad ,  GEMAR, Jeffrey ,  SEVERSON, Matthew

IPC: H03M7/04 ,  H03M5/14 ,  G06F13/00 ,  G06F9/00 ,  G11C7/10 ,  H03M7/30

Abstract: The energy consumed by data transfer in a computing device may be reduced by transferring data that has been encoded in a manner that reduces the number of one "1" data values, the number of signal level transitions, or both. A data destination component of the computing device may receive data encoded in such a manner from a data source component of the computing device over a data communication interconnect, such as an off-chip interconnect. The data may be encoded using minimum Hamming weight encoding, which reduces the number of one "1" data values. The received data may be decoded using minimum Hamming weight decoding. For other computing devices, the data may be encoded using maximum Hamming weight encoding, which increases the number of one "1" data values while reducing the number of zero "0" values, if reducing the number of zero values reduces energy consumption.

公开(公告)号：EP4519771A1

公开(公告)日：2025-03-12

申请号：EP23724443.9

申请日：2023-04-05

Applicant: QUALCOMM INCORPORATED

Inventor： IPEK, Engin ,  OMAR, Hamza ,  RYCHLIK, Bohuslav ,  KUANR, Saumya Ranjan ,  DASHTIPOUR, Behnam ,  LO, Michael Hawjing ,  GEMAR, Jeffrey ,  SEVERSON, Matthew ,  PATSILARAS, George ,  TURNER, Andrew Edmund

IPC: G06F13/16 ,  G11C11/406

公开(公告)号：EP4378082A1

公开(公告)日：2024-06-05

申请号：EP22751181.3

申请日：2022-06-17

Applicant: QUALCOMM INCORPORATED

Inventor： IPEK, Engin ,  RYCHLIK, Bohuslav ,  PATSILARAS, George ,  KULKARNI, Prajakt ,  HANKENDI, Can ,  ALI, Fahad ,  GEMAR, Jeffrey ,  SEVERSON, Matthew

IPC: H03M7/04 ,  H03M5/14 ,  G06F13/00 ,  G06F9/00 ,  G11C7/10 ,  H03M7/30

CPC classification number: H03M7/6047 ,  H03M7/04 ,  H03M5/145 ,  G11C7/1006 ,  Y02D10/00

公开(公告)号：EP4515408A1

公开(公告)日：2025-03-05

申请号：EP23719541.7

申请日：2023-03-29

Applicant: QUALCOMM INCORPORATED

Inventor： IPEK, Engin ,  OMAR, Hamza ,  RYCHLIK, Bohuslav ,  GEMAR, Jeffrey ,  SEVERSON, Matthew ,  LO, Michael Hawjing ,  SUH, Jungwon

IPC: G06F13/16 ,  G11C7/10