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公开(公告)号:EP4406111A1
公开(公告)日:2024-07-31
申请号:EP22778188.7
申请日:2022-08-31
Applicant: QUALCOMM INCORPORATED
Inventor: HOLLAND, Kyle David , LEE, Jang Joon , KODKANI, Rahul , TASIC, Aleksandar Miodrag , LIAO, Chih-Fan , LEUNG, Lai Kan , NARATHONG, Chiewcharn
CPC classification number: H03F3/189 , H03F1/56 , H03F2200/29420130101 , H03F2200/45120130101 , H03F3/72 , H03F2203/720920130101 , H03F2200/11120130101 , H03F3/211 , H03F2203/723320130101 , H04B1/16 , H04B1/18
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公开(公告)号:WO2023049616A1
公开(公告)日:2023-03-30
申请号:PCT/US2022/075764
申请日:2022-08-31
Applicant: QUALCOMM INCORPORATED
Inventor: HOLLAND, Kyle David , LEE, Jang Joon , KODKANI, Rahul , TASIC, Aleksandar Miodrag , LIAO, Chih-Fan , LEUNG, Lai Kan , NARATHONG, Chiewcharn
Abstract: An amplifier (320) may include multiple stages (322, 324), with the multiple stages (322, 324) arranged in a fan-out configuration. The fan-out configuration provides multiple amplified signals at multiple amplifier output nodes, which may be coupled to a shared set of downconverters (330A, 330B, 330C). The shared downconverters (330A, 330B, 330C) may support processing of only a smaller bandwidth than the largest possible bandwidth of an input RF signal input to the amplifier (320). For example, the downconverters may support a bandwidth matching a smallest bandwidth of a supported RF signal. For example, when the amplifier (320) is intended to support 5G mmWave RF signals and 5G sub-6 GHz RF signals, the downconverters (330A, 330B, 330C) may each individually support a bandwidth of carriers in the 5G sub-6 GHz RF signals but not individually support the entire bandwidth of a possible 5G mmWave RF signal.
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