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1.发明公开METHOD AND STRUCTURE FOR FORMING CONTACT PADS ON A PRINTED CIRCUIT BOARD USING ZERO UNDER- CUT TECHNOLOGY 审中-公开方法与结构接触表面上的电路板面平整使用零退刀技术
公开(公告)号：EP2893783A4
公开(公告)日：2016-08-24
申请号：EP13834789
申请日：2013-08-09
Applicant: R&D CIRCUITS INC
Inventor： TURPUSEEMA DAN , RUSSELL JAMES V
CPC classification number: H05K3/425 , H05K1/113 , H05K1/115 , H05K3/0094 , H05K3/243 , H05K3/4007 , H05K3/427 , H05K2201/0959 , Y10T29/49156
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