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公开(公告)号：KR20180020319A
公开(公告)日：2018-02-27
申请号：KR20187004487
申请日：2010-01-08
Applicant: R&D CIRCUITS INC
Inventor： RUSSELL JAMES V
CPC classification number: H05K3/30 , G01R1/07378 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L23/50 , H01L24/13 , H01L2924/01057 , H01L2924/01078 , H01L2924/14 , H05K1/0213 , H05K1/0231 , H05K1/0234 , H05K1/0298 , H05K1/111 , H05K1/141 , H05K1/185 , H05K2201/049 , H05K2201/10378 , H05K2201/10636 , Y02P70/611 , Y10T29/4913 , H01L2924/00
Abstract: 본게시물은어댑터보드또는인터포저보드안에커패시턴스또는저항을직접부착하고내장한다음주회로보드에접속하기위해제공된다. 어댑터보드는납땜, 전도성탄성중합체접속에의한전기접속, 스프링핀 또는공지의다른방법에의해주회로보드에접속될수 있다.
Abstract translation: 在适配器板内嵌入功率修改部件，例如电容器，该适配器板位于主电路板的通孔之上并延伸超出主电路板的通孔，使得包含嵌入电容的内插器板的一部分位于通孔或百叶窗所在的位置之外。 这允许通过通过开口进行。 这样，电容和电阻将具有更接近电气元件的接触点。 电阻也可以嵌入适配器板的开口中并且在开口内垂直对准以与适配器板的顶部上的焊盘和适配器板的底部上的焊盘接触，以便电通过嵌入式部件 。
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2.发明公开METHOD AND STRUCTURE FOR FORMING CONTACT PADS ON A PRINTED CIRCUIT BOARD USING ZERO UNDER- CUT TECHNOLOGY 审中-公开方法与结构接触表面上的电路板面平整使用零退刀技术
公开(公告)号：EP2893783A4
公开(公告)日：2016-08-24
申请号：EP13834789
申请日：2013-08-09
Applicant: R&D CIRCUITS INC
Inventor： TURPUSEEMA DAN , RUSSELL JAMES V
CPC classification number: H05K3/425 , H05K1/113 , H05K1/115 , H05K3/0094 , H05K3/243 , H05K3/4007 , H05K3/427 , H05K2201/0959 , Y10T29/49156
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3.发明公开EMBEDDED COMPONENTS IN INTERPOSER BOARD FOR IMPROVING POWER GAIN (DISTRIBUTION) AND POWER LOSS (DISSIPATION) IN INTERCONNECT CONFIGURATION 审中-公开嵌入式组件在中间卡，改进后的Power COLLECTION（分布），降低功率损失（缓解）在网络配置
公开(公告)号：EP2478751A4
公开(公告)日：2013-01-23
申请号：EP10817530
申请日：2010-01-08
Applicant: R & D CIRCUITS INC
Inventor： RUSSELL JAMES V
CPC classification number: H05K3/30 , G01R1/07378 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L23/50 , H01L24/13 , H01L2924/01057 , H01L2924/01078 , H01L2924/14 , H05K1/0213 , H05K1/0231 , H05K1/0234 , H05K1/0298 , H05K1/111 , H05K1/141 , H05K1/185 , H05K2201/049 , H05K2201/10378 , H05K2201/10636 , Y02P70/611 , Y10T29/4913 , H01L2924/00
Abstract: Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component.
Abstract translation: 嵌入功率修改组件：如位于上方延伸的适配器板的内部和超出所述主电路板的通孔的电容所以做了插入器板包含嵌入电容的一部分被定位成超过该通路或百叶窗的位置。 这允许通过没有通过开口进行。 以这种方式，电容和电阻将具有更紧密的接触点到电组件。 的电阻因此可以在适配器板开口被嵌入在与所述开口内垂直对准，以与在适配器板的顶部上的垫和垫在适配器板的底部接触，从而没有电通过嵌入式部件进行 ，
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公开(公告)号：EP2798702A4
公开(公告)日：2015-08-26
申请号：EP13777883
申请日：2013-03-28
Applicant: R & D CIRCUITS INC
Inventor： WARWICK THOMAS P , RUSSELL JAMES V , MCMULLIN DERMICK , QUICK WILLIAM
CPC classification number: H01R13/03 , H01R12/52 , H01R13/2414 , H01R43/26 , Y10T29/49208 , Y10T29/4921
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5.发明公开METHOD AND APPARATUS FOR IMPROVING POWER AND LOSS FOR INTERCONECT CONFIGURATIONS 审中-公开方法和设备在网络中配置更高的性能和较低收入
公开(公告)号：EP2428105A4
公开(公告)日：2013-05-29
申请号：EP10772351
申请日：2010-01-08
Applicant: R & D CIRCUITS INC
Inventor： RUSSELL JAMES V
CPC classification number: H05K1/185 , H05K1/023 , H05K1/0231 , H05K1/0234 , H05K1/112 , H05K3/4046 , H05K2201/096 , H05K2201/10636 , Y02P70/611
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Patent Agency Ranking
公开(公告)号：EP3194989A4
公开(公告)日：2018-03-21
申请号：EP15835363
申请日：2015-08-26
Applicant: R&D CIRCUITS INC
Inventor： WARWICK THOMAS P , RUSSELL JAMES V
IPC: G01R31/28 , G01R31/303 , G01R31/317 , H01L23/498 , H04L1/24 , H04L12/24 , H04L12/26 , H05K1/02 , H05K1/11
CPC classification number: H04L1/243 , G01R31/2851 , G01R31/31716 , H04L41/24 , H04L43/50 , H05K1/0231 , H05K1/185 , H05K2201/10015
Abstract: A method and a structure with multiple implementations is provided that depends on the specific need, for placing (embedding) a serial loopback circuit of known design in a printed circuit board directly beneath the device under test. Micro-vias and traces connect components including transmitter components (TX) and receiver components (RX) that are formed into a loopback circuit for connection to a device under test (DUT). The connection is accomplished by a coupling capacitor with a shortest possible electrical length approximating a straight line between said components and said DUT and said distance is a length of said short straight line times a square root of 2 so that said receiver components are beneath the DUT.
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7.发明公开SEPARABLE ELECTRICAL CONNECTORS USING ISOTROPIC CONDUCTIVE ELASTOMER INTERCONNECT MEDIUM 审中-公开可分离的电连接器上的人员的BASIS各向同性ELASTOMER JOINT MEDIA
公开(公告)号：EP2225802A4
公开(公告)日：2011-04-27
申请号：EP08863567
申请日：2008-12-17
Applicant: R & D CIRCUITS INC
Inventor： RUSSELL JAMES V
IPC: H01R4/58
CPC classification number: H01R13/2414 , H01R4/58 , H01R13/03 , H05K3/245 , H05K3/326 , H05K2201/0314 , H05K2201/10719
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公开(公告)号：MY165331A
公开(公告)日：2018-03-21
申请号：MYPI2012001174
申请日：2010-01-08
Applicant: R&D CIRCUITS INC
Inventor： RUSSELL JAMES V
Abstract: THE PRESENT DISCLOSURE PROVIDES FOR ATTACHING AND EMBEDDING A CAPACITANCE OR A RESISTANCE DIRECTLY IN AN ADAPTOR BOARD OR AN INTERPOSER BOARD THAT IS THEN CONNECTED TO THE MAIN CIRCUIT BOARD. THE ADAPTOR BOARD CAN BE CONNECTED TO THE MAIN CIRCUIT BOARD BY SOLDERING, ELECTRICALLY CONNECTING IT BY A CONDUCTIVE ELASTOMER CONNECTION, SPRING PINS OR BY ANY OTHER WAY THAT IS KNOWN IN THE ART. THE MOST ILLUSTRATIVE DRAWING IS
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公开(公告)号：SG11201701593XA
公开(公告)日：2017-03-30
申请号：SG11201701593X
申请日：2015-08-26
Applicant: R&D CIRCUITS INC
Inventor： WARWICK THOMAS P , RUSSELL JAMES V
IPC: G01R31/303
Abstract: A method and a structure with multiple implementations is provided that depends on the specific need, for placing (embedding) a serial loopback circuit of known design in a printed circuit board directly beneath the device under test. Micro-vias and traces connect components including transmitter components (TX) and receiver components (RX) that are formed into a loopback circuit for connection to a device under test (DUT). The connection is accomplished by a coupling capacitor with a shortest possible electrical length approximating a straight line between said components and said DUT and said distance is a length of said short straight line times a square root of 2 so that said receiver components are beneath the DUT.
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10.发明申请METHOD AND STRUCTURE FOR COAXIAL VIA ROUTING IN PRINTED CIRCUIT BOARDS FOR IMPROVED SIGNAL INTEGRITY 审中-公开用于改善信号完整性的印刷电路板中的通路的同轴方法和结构
公开(公告)号：WO2011106091A3
公开(公告)日：2012-01-05
申请号：PCT/US2011000338
申请日：2011-02-24
Applicant: R & D CIRCUITS INC , RUSSELL JAMES V
Inventor： RUSSELL JAMES V
CPC classification number: H05K1/0222 , H05K1/0251 , H05K1/116 , H05K3/4069 , H05K3/42 , H05K2201/0187 , H05K2201/096 , H05K2201/09609 , H05K2201/09727 , H05K2201/09809 , Y10T29/49124 , Y10T29/49165
Abstract: A method and a structure for a coaxial via that extend along the entire length of a signal via in a printed circuit board. Signal integrity is improved by providing ground shield for the entire length of the coaxial via. The ground shielding can be implemented by either providing ground cage vias around a signal via and routing a trace to the signal via on a built up layer or by providing a semi circle ground trench through a build up layer to permit a trace access to the signal via.
Abstract translation: 一种用于沿着印刷电路板中的信号通道的整个长度延伸的同轴通孔的方法和结构。 通过为同轴通孔的整个长度提供接地屏蔽来改善信号完整性。 接地屏蔽可以通过在信号通孔周围提供接地保持架通孔，并将迹线路由到建立层上的信号通道或者通过建立层提供半圆接地沟槽来实现，以允许对信号进行跟踪访问 通过。
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