公开(公告)号：EP2798702A4

公开(公告)日：2015-08-26

申请号：EP13777883

申请日：2013-03-28

Applicant: R & D CIRCUITS INC

Inventor： WARWICK THOMAS P ,  RUSSELL JAMES V ,  MCMULLIN DERMICK ,  QUICK WILLIAM

IPC: H01R13/24 ,  H01R12/52

CPC classification number: H01R13/03 ,  H01R12/52 ,  H01R13/2414 ,  H01R43/26 ,  Y10T29/49208 ,  Y10T29/4921

公开(公告)号：EP3194989A4

公开(公告)日：2018-03-21

申请号：EP15835363

申请日：2015-08-26

Applicant: R&D CIRCUITS INC

Inventor： WARWICK THOMAS P ,  RUSSELL JAMES V

IPC: G01R31/28 ,  G01R31/303 ,  G01R31/317 ,  H01L23/498 ,  H04L1/24 ,  H04L12/24 ,  H04L12/26 ,  H05K1/02 ,  H05K1/11

CPC classification number: H04L1/243 ,  G01R31/2851 ,  G01R31/31716 ,  H04L41/24 ,  H04L43/50 ,  H05K1/0231 ,  H05K1/185 ,  H05K2201/10015

Abstract: A method and a structure with multiple implementations is provided that depends on the specific need, for placing (embedding) a serial loopback circuit of known design in a printed circuit board directly beneath the device under test. Micro-vias and traces connect components including transmitter components (TX) and receiver components (RX) that are formed into a loopback circuit for connection to a device under test (DUT). The connection is accomplished by a coupling capacitor with a shortest possible electrical length approximating a straight line between said components and said DUT and said distance is a length of said short straight line times a square root of 2 so that said receiver components are beneath the DUT.

公开(公告)号：SG11201701593XA

公开(公告)日：2017-03-30

申请号：SG11201701593X

申请日：2015-08-26

Applicant: R&D CIRCUITS INC

Inventor： WARWICK THOMAS P ,  RUSSELL JAMES V

IPC: G01R31/303

Abstract: A method and a structure with multiple implementations is provided that depends on the specific need, for placing (embedding) a serial loopback circuit of known design in a printed circuit board directly beneath the device under test. Micro-vias and traces connect components including transmitter components (TX) and receiver components (RX) that are formed into a loopback circuit for connection to a device under test (DUT). The connection is accomplished by a coupling capacitor with a shortest possible electrical length approximating a straight line between said components and said DUT and said distance is a length of said short straight line times a square root of 2 so that said receiver components are beneath the DUT.

公开(公告)号：SG11201405599WA

公开(公告)日：2014-10-30

申请号：SG11201405599W

申请日：2013-03-28

Applicant: R&D CIRCUITS INC

Inventor： WARWICK THOMAS P ,  RUSSELL JAMES V ,  MCMULLIN DERMICK ,  QUICK WILLIAM

IPC: H01R12/00

公开(公告)号：WO2012047266A2

公开(公告)日：2012-04-12

申请号：PCT/US2011001663

申请日：2011-09-28

Applicant: R & D CIRCUITS INC

Inventor： WARWICK THOMAS P ,  RUSSELL JAMES V

IPC: H01P1/20 ,  H01P1/203 ,  H01P1/205

CPC classification number: H05K1/0233 ,  H05K1/113 ,  H05K1/185 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

Abstract: The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.

Abstract translation: 本公开涉及减少包含RF装置的印刷电路板（PCB）中的不需要的RF噪声。 隔离过滤器嵌入在包含RDF设备的PCB中。 通过将隔离滤波器尽可能靠近RF器件放置，以便显着减少由于PCB结构中的通孔和平面之间不可避免的耦合而导致的不必要的RF噪声。