公开(公告)号：WO2015160426A1

公开(公告)日：2015-10-22

申请号：PCT/US2015/016391

申请日：2015-02-18

Applicant: RAYTHEON COMPANY

Inventor： KYHL, Cary C. ,  HESTON, Scott M.

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K7/2039 ,  H01L2224/73253 ,  H01L2924/16195 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/1056 ,  H05K2201/10628 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract translation: 公开了一种表面贴装装置。 表面安装装置可以包括可在电子电路中操作的电子部件。 表面安装装置还可以包括热耦合到电子部件的传热部件。 传热部件可以具有配置成与散热器相接合的传热表面。 此外，表面安装器件可以包括弹性柔性引线，以将电子部件电耦合到电路板。 弹性柔性引线可以被配置为弹性偏转，以促进热传递表面与电路板的可变距离，使得热传递表面和另一类似配置的表面安装器件的平面传热表面能够基本上对准用于接口 与散热器。

公开(公告)号：EP3132662A1

公开(公告)日：2017-02-22

申请号：EP15713345.5

申请日：2015-02-18

Applicant: Raytheon Company

Inventor： KYHL, Cary C. ,  HESTON, Scott M. ,  ELLIOTT, James M.

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K7/2039 ,  H01L2224/73253 ,  H01L2924/16195 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/1056 ,  H05K2201/10628 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract translation: 公开了一种表面贴装装置。 表面安装装置可以包括可在电子电路中操作的电子部件。 表面安装装置还可以包括热耦合到电子部件的传热部件。 传热部件可以具有配置成与散热器相接合的传热表面。 此外，表面安装装置可以包括弹性柔性引线，以将电子部件电耦合到电路板。 弹性柔性引线可以被配置为弹性偏转，以促进热传递表面与电路板的可变距离，使得热传递表面和另一类似配置的表面安装器件的平面传热表面能够基本上对准用于接口 与散热器。