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公开(公告)号：WO2021055015A1
公开(公告)日：2021-03-25
申请号：PCT/US2020/026186
申请日：2020-04-01
Applicant: RAYTHEON COMPANY
Inventor： BENEDICT, James, E. , DELEY, Timothy, David , SIKINA, Thomas, V. , SOULIOTIS, Michael, Ryan , SOUTHWORTH, Andrew, R. , WILDER, Kevin
Abstract: A multilayer printed circuit board includes a first dielectric layer and a second dielectric layer, each layer having a top surface and a bottom surface. The first dielectric layer is positioned above the second dielectric layer with the bottom surface of the first dielectric layer facing the top surface of the second dielectric layer. The top surface of the second dielectric layer has a conductive trace. The second dielectric layer has a through-hole that extends through the conductive trace. The multilayer printed circuit board includes an inverted pad interface structure including an inverted pad provided on the bottom surface of the first dielectric layer, a first solder layer provided on a surface of the inverted pad, a second solder layer provided on the conductive trace, and a copper wire positioned within the through-hole to provide the vertical and electrical connection with the conductive trace.
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公开(公告)号：EP4032375A1
公开(公告)日：2022-07-27
申请号：EP20720717.6
申请日：2020-04-01
Applicant: Raytheon Company
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