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    SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH
    1.
    发明申请
    SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH 审中-公开

    公开(公告)号：WO2021030425A1

    公开(公告)日：2021-02-18

    申请号：PCT/US2020/045908

    申请日：2020-08-12

    Applicant: RAYTHEON COMPANY

    Inventor： PEVZNER, Mikhail ,  BENEDICT, James E. ,  SOUTHWORTH, Andrew R. ,  SIKINA, Thomas V. ,  WILDER, Kevin ,  SOUZA, Matthew ,  TORBERG, Aaron Michael

    IPC: H05K3/40 ,  B21F11/00 ,  B26D3/00

    Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (RGB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the RGB, solder an end of the segment of copper wire to a signal trace of the RGB, and flush cut an opposite end of the segment of the copper wire to a surface of the RGB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

    STRIPLINE EDGE SNAP RADIO-FREQUENCY CONNECTION
    4.
    发明申请
    STRIPLINE EDGE SNAP RADIO-FREQUENCY CONNECTION 审中-公开

    公开(公告)号：WO2021041197A1

    公开(公告)日：2021-03-04

    申请号：PCT/US2020/047363

    申请日：2020-08-21

    Applicant: RAYTHEON COMPANY

    Inventor： WILDER, Kevin ,  SMITH, Alan C. ,  BENEDICT, James ,  SOUTHWORTH, Andrew ,  SIKINA, Thomas V. ,  HERNDON, Mary K. ,  HAVEN, John P.

    IPC: H05K1/02 ,  H05K1/14 ,  H05K3/40

    Abstract: A stripline radio-frequency (RF) connection interface is provided and includes first and second printed circuit boards (RGBs). The first RGB (110) includes a first trace (111), ground planes (112,113) at opposite sides of the first trace (111), dielectric material (114) interposed between the first trace (111) and the ground planes (112,113) and a first end. The first end is formed as a first rabbet (117) at which the first trace (111) is exposed. The second PCB (120) includes a second trace (121), ground planes (122,123) at opposite sides of the second trace (121), dielectric material (124) interposed between the second trace (121) and the ground planes (122,123) and a second end. The second end is formed as a second rabbet (127), which is substantially identical to the first rabbet (117), at which the second trace (121) is exposed. The first and second ends are mated in a shiplap joint (401) to electrically couple the first (111) and second (121) traces.

    ADDITIVE MANUFACTURING TECHNOLOGY (AMT) INVERTED PAD INTERFACE
    9.
    发明申请
    ADDITIVE MANUFACTURING TECHNOLOGY (AMT) INVERTED PAD INTERFACE 审中-公开

    公开(公告)号：WO2021055015A1

    公开(公告)日：2021-03-25

    申请号：PCT/US2020/026186

    申请日：2020-04-01

    Applicant: RAYTHEON COMPANY

    Inventor： BENEDICT, James, E. ,  DELEY, Timothy, David ,  SIKINA, Thomas, V. ,  SOULIOTIS, Michael, Ryan ,  SOUTHWORTH, Andrew, R. ,  WILDER, Kevin

    IPC: H05K3/40 ,  H05K3/46 ,  H05K1/02 ,  H05K3/00 ,  H05K1/11

    Abstract: A multilayer printed circuit board includes a first dielectric layer and a second dielectric layer, each layer having a top surface and a bottom surface. The first dielectric layer is positioned above the second dielectric layer with the bottom surface of the first dielectric layer facing the top surface of the second dielectric layer. The top surface of the second dielectric layer has a conductive trace. The second dielectric layer has a through-hole that extends through the conductive trace. The multilayer printed circuit board includes an inverted pad interface structure including an inverted pad provided on the bottom surface of the first dielectric layer, a first solder layer provided on a surface of the inverted pad, a second solder layer provided on the conductive trace, and a copper wire positioned within the through-hole to provide the vertical and electrical connection with the conductive trace.

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