5.
    发明专利
    未知

    公开(公告)号:DE3731742A1

    公开(公告)日:1988-03-31

    申请号:DE3731742

    申请日:1987-09-22

    Applicant: RCA CORP

    Abstract: A radiation hardened silicon-on-insulator semiconductor device and method of making the same is disclosed. A region is formed in the silicon layer adjacent the insulating substrate which has a high density of naturally occurring crystallographic defects. This region substantially reduces the back-channel leakage that occurs when the device is operated after being irradiated.

Patent Agency Ranking