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    Electroless copper plating solutions with accelerated plating rates
    1.
    发明授权
    Electroless copper plating solutions with accelerated plating rates 失效
    电镀铜镀层解决方案具有加速镀层率

    公开(公告)号：US3720525A

    公开(公告)日：1973-03-13

    申请号：US3720525D

    申请日：1971-08-16

    Applicant: RCA CORP

    Inventor： FELDSTEIN N ,  WEINER J

    IPC: C23C18/40 ,  C23C3/02

    CPC classification number: C23C18/40

    Abstract: THE RATE OF PLATING COPPER ONTO AN ACTIVE METALLIC SURFACE OF A SUBSTRATE FROM AN ELECTROLESS COPPER PLATING SOLUTION IS ENHANCED BY ADDING TO THE PLATING SOLUTION AN IONIC COMPOUND CONSISTING OF EITHER AN ACETATE, A NITRATE, AN OXALATE, A LACTATE, A CHLORIDE, A TARTRATE, A FORMATE, A PHTHALAE, A TUNGSTATE, A MOLYBDATE, A CHLORATE, A PERCHLORATE, A CITRATE, A MOLONATE, OR MIXTURES THEREOF.

    Method of repairing or depositing a pattern of metal plated areas on an insulating substrate
    2.
    发明授权
    Method of repairing or depositing a pattern of metal plated areas on an insulating substrate 失效
    在绝缘基板上修复或沉积金属涂层区域的方法

    公开(公告)号：US3753816A

    公开(公告)日：1973-08-21

    申请号：US3753816D

    申请日：1971-11-18

    Applicant: RCA CORP

    Inventor： FELDSTEIN N ,  LAW H

    IPC: C23C18/18 ,  G03F1/72 ,  H05K1/03 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/22 ,  C23F1/02 ,  C23F17/00

    CPC classification number: G03F1/72 ,  C23C18/1605 ,  H05K1/0306 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/225 ,  H05K2201/0344 ,  H05K2203/0542 ,  H05K2203/072 ,  Y10T29/49156 ,  Y10T29/49746

    Abstract: The method comprises depositing a thin layer of a first metal having a relatively high degree of solubility in a particular etchant over both plated areas (if a previously deposited pattern is being repaired) and unplated areas on a substrate, this first metal being catalytic to electroless deposition of a second metal to be subsequently deposited, electrolessly depositing on the first metal either an overall pattern of areas of a second metal which has a relatively low degree of solubility in the etchant or a pattern limited to parts of a previously deposited pattern that were missing or incompletely formed, and then treating the plated areas with the etchant, where desired, so that the first metal is removed where it is not covered by the second metal but the second metal is substantially unaffected.

    Abstract translation: 该方法包括在两个镀覆区域（如果先前沉积的图案被修复）和在基底上未镀覆的区域上沉积具有相对较高溶解度的第一金属薄层，该第一金属在特定的蚀刻剂上催化以无电化 沉积待随后沉积的第二金属，在第一金属上无电沉积第二金属的整体图案，其在蚀刻剂中具有相对较低溶解度的第二金属的区域或限于先前沉积图案的部分的图案， 丢失或不完全形成，然后在需要时用蚀刻剂处理镀覆区域，使得第一金属在不被第二金属覆盖但第二金属基本上不受影响的情况下被去除。

    Method for electroless deposition of metal using improved colloidal catalyzing solution
    3.
    发明授权
    Method for electroless deposition of metal using improved colloidal catalyzing solution 失效
    使用改进的胶体催化溶液对金属进行电沉积的方法

    公开(公告)号：US3841881A

    公开(公告)日：1974-10-15

    申请号：US28877772

    申请日：1972-09-13

    Applicant: RCA CORP

    Inventor： FELDSTEIN N ,  LANCSEK T

    IPC: C23C18/28 ,  C23C3/02

    CPC classification number: C23C18/28

    Abstract: A colloidal solution of a catalytic metal is prepared by admixing an acid-soluble salt of the metal, hydrochloric acid, a soluble stannous salt present in excess of the amount necessary to reduce the metal salt to colloidal metal, and a quantity of stannic chloride that has been separately aged. A substrate surface upon which metal is to be deposited is treated with the catalytic colloidal solution. The catalyzed surface is then subjected to an electroless plating bath.

    Abstract translation: 催化金属的胶体溶液通过将金属的酸溶性盐，盐酸，超过金属盐所需量的可溶性亚锡盐与胶态金属混合，并将一定量的氯化锡， 已分别老化。 用催化胶体溶液处理要沉积金属的衬底表面。 然后将催化表面进行化学镀浴。

    Electroless cobalt plating bath and process
    5.
    发明授权
    Electroless cobalt plating bath and process 失效
    电镀铜镀层浴和工艺

    公开(公告)号：US3745039A

    公开(公告)日：1973-07-10

    申请号：US3745039D

    申请日：1971-10-28

    Applicant: RCA CORP

    Inventor： FELDSTEIN N

    IPC: C23C18/36 ,  C23C3/02

    CPC classification number: C23C18/36

    Abstract: ELECTROLESS DEPOSITION OF COBALT FROM AN AQUEOUS ALKALINE BATH ON A PALLADIUM ACTIVATED SUBSTRATE. BATH CONTAINS HYPOPHOSPHITE AS REDUCING AGENT, LINEAR POLYPHOSPHATE ANION AND AMMONIUM HYDROXIDE AS COMPLEXING AGENTS AND SMALL CONTROLLED AMOUNTS OF NICKEL ION. COBALT WILL ALSO DEPOSIT WITHOUT IONS BEING IN BATH BY PROVIDING NICKEL ON SUBSTRATE.

    METHOD OF PRODUCING A LUMINESCENT-SCREEN STRUCTURE INCLUDING LIGHT-EMITTING AND LIGHT-ABSORBING AREAS
    6.
    发明专利
    METHOD OF PRODUCING A LUMINESCENT-SCREEN STRUCTURE INCLUDING LIGHT-EMITTING AND LIGHT-ABSORBING AREAS 未知

    公开(公告)号：CA928164A

    公开(公告)日：1973-06-12

    申请号：CA110239

    申请日：1971-04-13

    Applicant: RCA CORP

    Inventor： FELDSTEIN N

    IPC: H01J9/227 ,  H01J29/18 ,  H01J29/32 ,  H01J29/34

    Abstract: 1342636 Electroless plating R C A CORPORATION 5 May 1971 [5 May 1970] 13344/71 Heading C7F [Also in Division H1] A method of producing a luminescent screen structure for an image reproducer (e.g. a c.r.t.) comprising light emitting and light absorbing areas on a support surface 23, comprises coating the support surface with a pattern of deposits comprising film-forming binder material and phosphor particle electrolessly plating only the areas between the deposits with at least one of Ni, Co and Cu, and optionally also including Fe, Mn or W, and converting the plated metal to an adherent dark coloured and light absorbing compound material. Surface 23 may be coated with an initiator by cleaning and washing with a 10% aqueous solution of fluoroboric acid to leach and render hydrophilic, rinsed with an aqueous acidic stannous chloride solution whereby stannousions are absorbed, rinsed with Pd salt solution, Pd ions replacing stannous ions producing discontinuous monolayer 25. Green, blue, red phosphors 27, 29, 31 are photographically offset or screen printed, the phosphor being mixed with the binder or applied after the binder is printed. Plating may use Co So 4 7H 2 O, sodium pyrophosphate and conc. ammonium hydroxide, pH being 10 to 10-5 and 90 to 100‹F temperature producing 0.005mn thickness, followed by aluminizing and baking at 440‹C in air to oxidize the Co to a black material of one or more oxides and removing organic material. The conversion to a dark coloured material may be by oxidizing or sulfurizing or otherwise converting Ni and Co from black oxides and sulfides and conversion may be by baking in a gas ambient or by a reaction in a liquid medium. In plating, both temperatures of 90‹ to 100‹F reduce non-uniformities, a thin layer of an additional promoter, e.g. heat treated tin oxide, leached or hydrated suface, beneath the initiation reduces peeling, phosphor dot porosity may be reduced by baking at 150‹C or by incorporating an organic filler (e.g. an acrylate copolymer) to promote the hydrophobic character. The film forming binder used with the phosphor reduces Co metal ion poisoning. Reference is made to shadow mask colour TV tube with a light absorbing screen matrix.

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