Method of making a semi-transparent photomask
    1.
    发明授权
    Method of making a semi-transparent photomask 失效
    制作半透明光掩模的方法

    公开(公告)号:US3922420A

    公开(公告)日:1975-11-25

    申请号:US47509474

    申请日:1974-05-31

    Applicant: RCA CORP

    CPC classification number: G03F1/54 G03F1/50 Y10T428/24926

    Abstract: A method of making a semi-transparent photomask of the iron oxide type comprising depositing a thin film of nickel or of a nickel alloy on a glass substrate, forming on the nickel or nickel alloy film a pattern of a resist which is the negative of the desired photomask, electrolytically depositing a layer of iron on the areas of the alloy film not covered by the resist, removing the resist and heating the assembly in an oxidizing atmosphere to convert the iron layer to iron oxide and also to convert the nickel or nickel alloy film to transparent oxides, at the same time providing improved adherence.

    Abstract translation: 一种制造氧化铁半透明光掩模的方法,包括在玻璃基板上沉积镍或镍合金薄膜,在镍或镍合金膜上形成抗蚀剂的图案,该图案为 在未被抗蚀剂覆盖的合金膜的区域上电解沉积铁层,除去抗蚀剂并在氧化气氛中加热组件以将铁层转化为氧化铁,并将镍或镍合金 膜到透明氧化物,同时提供改善的附着力。

    2.
    发明专利
    未知

    公开(公告)号:IT1205089B

    公开(公告)日:1989-03-10

    申请号:IT2103387

    申请日:1987-06-24

    Applicant: RCA CORP

    Abstract: Indicia are formed in a sapphire substrate by ion implantation with a sufficient amount of silicon ions to establish a contrast with the remainder of the substrate. The implant is annealed at 1050 DEG to 1200 DEG C. under an oxygen or inert atmosphere. The implants are stable to repeated heatings to elevated temperature. The implants are further beneficial in that they do not introduce a source of contamination into the substrate.

    METHOD OF FORMING ALIGNMENT MARKS IN SAPPHIRE

    公开(公告)号:GB2197123B

    公开(公告)日:1990-05-09

    申请号:GB8714909

    申请日:1987-06-25

    Applicant: RCA CORP

    Abstract: Indicia are formed in a sapphire substrate by ion implantation with a sufficient amount of silicon ions to establish a contrast with the remainder of the substrate. The implant is annealed at 1050 DEG to 1200 DEG C. under an oxygen or inert atmosphere. The implants are stable to repeated heatings to elevated temperature. The implants are further beneficial in that they do not introduce a source of contamination into the substrate.

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