公开(公告)号：CA2400025A1

公开(公告)日：2001-08-23

申请号：CA2400025

申请日：2001-02-12

Applicant: REDWOOD MICROSYSTEMS INC

Inventor： WEBER WALTER A ,  HARRIS JAMES M ,  SELSER MICHAEL J

IPC: B81C3/00 ,  B81B7/00 ,  B81B7/02 ,  C09J5/00 ,  F15C5/00 ,  F16K99/00 ,  B32B31/00 ,  F16K7/00

Abstract: A method of attaching a micromechanical fluid control device (62) to a substrate (64) includes the steps of forming a first ring of a first adhesiv e (70) around an aperture (66) defined between a micromechanical fluid control device and a substrate. The first adhesive forms a first interface between t he micromechanical fluid control device and the substrate that is clean and corrosion resistant. A second ring of a second adhesive (72) is applied arou nd the first ring. The second adhesive forms a second interface between the micromechanical fluid control device and the substrate that is hermetic.

公开(公告)号：CA2400025C

公开(公告)日：2009-01-06

申请号：CA2400025

申请日：2001-02-12

Applicant: REDWOOD MICROSYSTEMS INC

Inventor： HARRIS JAMES M ,  SELSER MICHAEL J ,  WEBER WALTER A

IPC: B81C1/00 ,  B81C3/00 ,  B81B7/00 ,  B81B7/02 ,  C09J5/00 ,  F15C5/00 ,  F16K99/00 ,  F16L13/10

Abstract: A method of attaching a micromechanical fluid control device (62) to a substrate (64) includes the steps of forming a first ring of a first adhesive (70) around an aperture (66) defined between a micromechanical fluid control device and a substrate. The first adhesive forms a first interface between the micromechanical fluid control device and the substrate that is clean and corrosion resistant. A second ring of a second adhesive (72) is applied around the first ring. The second adhesive forms a second interface between the micromechanical fluid control device and the substrate that is hermetic.

公开(公告)号：AU3686301A

公开(公告)日：2001-08-27

申请号：AU3686301

申请日：2001-02-12

Applicant: REDWOOD MICROSYSTEMS INC

Inventor： HARRIS JAMES M ,  SELSER MICHAEL J ,  WEBER WALTER A

IPC: B81C3/00 ,  B81B7/00 ,  B81B7/02 ,  C09J5/00 ,  F15C5/00 ,  F16K99/00 ,  B32B31/00 ,  F16K7/00

Abstract: A method of attaching a micromechanical fluid control device to a substrate includes the steps of forming a first ring of a first adhesive around an aperture defined between a micromechanical fluid control device and a substrate. The first adhesive forms a first interface between the micromechanical fluid control device and the substrate that is clean and corrosion resistant. A second ring of a second adhesive is applied around the first ring. The second adhesive forms a second interface between the micromechanical fluid control device and the substrate that is hermetic.

公开(公告)号：EP1255642A4

公开(公告)日：2003-03-19

申请号：EP01909072

申请日：2001-02-12

Applicant: REDWOOD MICROSYSTEMS INC

Inventor： HARRIS JAMES M ,  SELSER MICHAEL J ,  WEBER WALTER A

IPC: B81C3/00 ,  B81B7/00 ,  B81B7/02 ,  C09J5/00 ,  F15C5/00 ,  F16K99/00 ,  H01L23/10

CPC classification number: B81B7/0041 ,  B81C2203/019 ,  C09J5/00 ,  F15C5/00 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0036 ,  Y10T137/0402 ,  Y10T137/87676 ,  Y10T137/87885

Abstract: A method of attaching a micromechanical fluid control device (62) to a substrate (64) includes the steps of forming a first ring of a first adhesive (70) around an aperture (66) defined between a micromechanical fluid control device and a substrate. The first adhesive forms a first interface between the micromechanical fluid control device and the substrate that is clean and corrosion resistant. A second ring of a second adhesive (72) is applied around the first ring. The second adhesive forms a second interface between the micromechanical fluid control device and the substrate that is hermetic.

Abstract translation: 微机械的流体控制装置附连到基板的方法，包括在微机械的流体控制装置和基板之间限定的孔周围形成第一粘合剂的第一环的步骤。 第一粘合剂形成微机械流体控制装置和所述基板之间的第一接口做是干净的，耐腐蚀的。 第二粘合剂的第二环在所述第一环围绕的应用。 第二粘合剂形成微机械流体控制装置之间的第二界面和基片做是气密性的。