公开(公告)号：WO2017079322A1

公开(公告)日：2017-05-11

申请号：PCT/US2016/060147

申请日：2016-11-02

Applicant: REVERA INCORPORATED

Inventor： LEE, Wei Ti ,  POIS, Heath ,  KLARE, Mark ,  BOZDOG, Cornel

IPC: H01L21/00

CPC classification number: G01N23/2208 ,  G01B11/06 ,  G01B15/02 ,  G01N23/223 ,  G01N23/2273 ,  G01N2223/305 ,  G01N2223/633 ,  H01L22/12

Abstract: Determining a property of a layer of an integrated circuit (IC), the layer being formed over an underlayer, is implemented by performing the steps of: irradiating the IC to thereby eject electrons from the IC; collecting electrons emitted from the IC and determining the kinetic energy of the emitted electrons to thereby calculate emission intensity of electrons emitted from the layer and electrons emitted from the underlayer calculating a ratio of the emission intensity of electrons emitted from the layer and electrons emitted from the underlayer; and using the ratio to determine material composition or thickness of the layer. The steps of irradiating IC and collecting electrons may be performed using x-ray photoelectron spectroscopy (XPS) or x-ray fluorescence spectroscopy (XRF).

Abstract translation: 通过执行以下步骤来实现确定集成电路（IC）的层的属性，所述层形成在底层上方：照射IC以由此从IC喷射电子; 收集从IC发射的电子并确定发射的电子的动能，从而计算从该层发射的电子和从底层发射的电子的发射强度，计算从该层发射的电子的发射强度与从该层发射的电子的比率 底层; 并使用该比率来确定层的材料组成或厚度。 照射IC和收集电子的步骤可以使用X射线光电子能谱（XPS）或X射线荧光能谱（XRF）来进行。

公开(公告)号：WO2015200112A1

公开(公告)日：2015-12-30

申请号：PCT/US2015/036619

申请日：2015-06-19

Applicant: REVERA, INCORPORATED

Inventor： POIS, Heath, A. ,  LEE, Wei, Ti ,  BOT, Lawrence, V. ,  KWAN, Michael, C. ,  KLARE, Mark ,  LARSON, Charles, Thomas

IPC: G01N23/22 ,  G01N23/223 ,  G01N23/227 ,  G01B15/02

CPC classification number: G01B15/02 ,  G01N23/223 ,  G01N23/2273

Abstract: Methods and systems for feed- forward of multi-layer and multi-process information using XPS and XRF technologies are disclosed. In an example, a method of thin film characterization includes measuring first XPS and XRF intensity signals for a sample having a first layer above a substrate. A thickness of the first layer is determined based on the first XPS and XRF intensity signals. The information for the first layer and for the substrate is combined to estimate an effective substrate. Second XPS and XRF intensity signals are measured for a sample having a second layer above the first layer above the substrate. The method also involves determining a thickness of the second layer based on the second XPS and XRF intensity signals, the thickness accounting for the effective substrate.

Abstract translation: 披露了使用XPS和XRF技术进行多层和多工艺信息前馈的方法和系统。 在一个示例中，薄膜表征的方法包括测量具有衬底上方的第一层的样品的第一XPS和XRF强度信号。 基于第一XPS和XRF强度信号确定第一层的厚度。 组合第一层和底物的信息以估计有效的底物。 对于在衬底上方的第一层上方具有第二层的样品测量第二XPS和XRF强度信号。 该方法还涉及基于第二XPS和XRF强度信号来确定第二层的厚度，其计算有效衬底的厚度。

公开(公告)号：EP3161462A1

公开(公告)日：2017-05-03

申请号：EP15812142.6

申请日：2015-06-19

Applicant: ReVera Incorporated

Inventor： POIS, Heath A. ,  LEE, Wei Ti ,  BOT, Lawrence V. ,  KWAN, Michael C. ,  KLARE, Mark ,  LARSON, Charles Thomas

IPC: G01N23/22 ,  G01N23/223 ,  G01N23/227 ,  G01B15/02

CPC classification number: G01B15/02 ,  G01N23/223 ,  G01N23/2273

Abstract: Methods and systems for feed-forward of multi-layer and multi-process information using XPS and XRF technolgies are disclosed. In an example, a method of thin film characterization includes measuring first XPS and XRF intensity signals for a sample having a first layer above a substrate. A thickness of the first layer is determined based on the first XPS and XRF intensity signals. The information for the first layer and for the substrate is combined to estimate an effective substrate. Second XPS and XRF intensity signals are measured for a sample having a second layer above the first layer above the substrate. The method also involves determining a thickness of the second layer based on the second XPS and XRF intensity signals, the thickness accounting for the effective substrate.

Abstract translation: 公开了使用XPS和XRF技术前馈多层和多处理信息的方法和系统。 在一个示例中，薄膜表征的方法包括测量具有衬底上方的第一层的样本的第一XPS和XRF强度信号。 基于第一XPS和XRF强度信号确定第一层的厚度。 结合第一层和基底的信息来估计有效底物。 测量第二XPS和XRF强度信号用于在衬底上方的第一层上具有第二层的样本。 该方法还涉及基于第二XPS和XRF强度信号确定第二层的厚度，所述厚度考虑到有效衬底。